SINTAIKE ekyuma ekisimba wafer ekya semikondokita STK-6020

SINTAIKE STK-6020 kyuma kya wafer pre-taping ekitono, nga kya semi-automatic nga kyakolebwa nnyo mu nkola y’okugonza wafer ku wafers za yinsi 4 ku 8. Ewa eky’okugonjoola ekikekkereza era ekyesigika ku adhesive film lamination.

**Omusingi gw'emirimu**

STK-6020 yeesigamiziddwa ku tekinologiya wa anti-static roller lamination. Enkola yaayo enkulu erimu emitendera gino wammanga:

**Okutikka n’okuteeka mu kifo:** Omukozi assa wafer mu ngalo ku mmeeza y’okukolerako, gy’enyweza ng’akozesa obubonero obulaga nti buli muntu oba ppini z’empewo.

**Automatic Lamination:** Ekyuma kino kiwa firimu eyesiiga mu ngeri ey’otoma, era ekizingulula ekiziyiza okutambula (anti-static roller) kisiiga firimu ku ngulu wa wafer nga erina puleesa etereezebwa, okukakasa nti ewedde nga fulaati, nga temuli bubble.

**Precision Cutting:** Enkola eno ekozesa ebisala ebigolokofu n’ebyekulungirivu okusala obulungi firimu, okuziyiza ebiwujjo n’okukendeeza ku kasasiro w’ebintu.

**Okutikkula:** Omukozi aggyayo wafer—kati ebikkiddwako firimu ekuuma—okugenda mu maaso n’omutendera oguddako ogw’okulongoosa.

**Ebikulu n'ebirungi**

Ekyuma kino kirimu dizayini essiddwako essira egaba eky’okugonjoola eky’omugaso ekituukira ddala ku byetaago ebitongole eby’oyo akikozesa.

**Ekika ky'ebintu** | **Engeri n'Ebirungi**

**Enkola y'enkola ey'enjawulo** | Atuuka ku makungula ga wafer aga ≥99.9%; ekakasa okuwunyiriza kwa firimu okutaliimu biwujjo (nga tobaliddeemu biwujjo ebiva ku butundutundu bw’enfuufu obusibiddwa).

**Ensengeka Ekyukakyuka & Okuyita Mu Maaso** | Ekwatagana ne sayizi za wafer nnya eza bulijjo: 4", 5", 6", ne 8". Atuuka ku throughput ya ≥80 wafers buli ssaawa, nga average product changeover time tesukka ddakiika 5.

**Obukugu obukulu mu by'ekikugu** | **Obujjanjabi obuziyiza okutambula:** Ekozesa ebizingulula ebiziyiza okutambula (anti-static rollers) n’emmeeza y’okukolerako—eyungiddwa ku ionizer—okukendeeza ku kwonooneka kw’okufulumya amasannyalaze. **Enkola y’okubugumya:** Emmeeza y’emirimu (okutuuka ku 100°C) n’ebiso ebisala (okutuuka ku 150°C) byombi bibuguma, okulongoosa amaanyi g’okunyweza firimu. **Edge Cutting:** Okusingira ddala ku wafers za yinsi 8, circular cutter erina omulimu gwa "V-groove no-cut" okukakasa nti okusiba kukwata bulungi. **Precision Positioning:** Ekozesa ppini z'empewo okusobola okukwataganya wafer, okukakasa nti ekifo kituufu. Ebikwata ku nsonga eno mu bujjuvu

Ebiwandiiko bino wammanga ebikwata ku nsonga eno mu bujjuvu bikung’aanyiziddwa okusinziira ku nsonda ez’enjawulo:

Ekika kya Parameter | Ebikwata ku nsonga eno mu bujjuvu

Ekika ky'Ebyuma | Semi-automatic, Benchtop Wafer Ekyuma kya Lamination nga tekinnagonza

Sayizi za Wafer ezikozesebwa | Yinsi 4 (mm 100), yinsi 5 (mm 125), yinsi 6 (mm 150), yinsi 8 (mm 200)

Wafer Obugumu Obuwanvu | 300 ~ 750 mayikironi (μm) .

Ebika bya Wafer ebikwatagana | Silikoni, Gallium Arsenide (GaAs), oba ebintu ebirala; ewagira wafers eziriko fulaati emu, eziriko fulaati bbiri, ne V-notch

Ebika bya Firimu Ebikwatagana | Firimu ya bbululu oba firimu ya UV (Adhesion ≤ 8N/20mm); Obugazi bwa firimu: 120–240mm (ebika ebirondeddwa biwagira okutuuka ku mm 340)

Enkola ya Lamination | Anti-static roller lamination nga ekola ku by’okuzimba; puleesa ya roller etereezebwa

Chuck Okusengeka | Universal integrated Teflon anti-static coated contact chuck (Ebyokulonda bya Silicone oba Ceramic ebiriwo); Ebbugumu: Ebbugumu ly’ekisenge ~ 100°C

Enkola y'okusala | Ekyuma ekisala empeta ekitereezebwa mu ngalo + Ekisala ekigolokofu mu ngalo; Ebbugumu ly'omutwe gw'omusala: Room Temp ~ 150°C

Okufuga okuziyiza okutambula | Wafer chuck esiigiddwa Teflon eziyiza okutambula, ebizingulula ebiziyiza okutambula, ionizer eggyawo obutakyukakyuka

Enkola y'okufuga | Enkola y’okufuga eyesigamiziddwa ku PLC, ng’erina touchscreen ya yinsi 5.7 oba yinsi 7

Okukuuma Obukuumi | Eriko bbaatuuni y’okuyimirira mu bwangu

Ebyetaago by'Ekifo | Amasannyalaze: AC 220V eya phase emu, 10A; Empewo Enyigirizibwa: 5 kg/cm2 empewo ennyonjo, enkalu; Omuwendo gw’amazzi agakulukuta: 100 L/min

Ebipimo | 670mm (Obugazi) × 1180mm (D) × 1000mm (Obuwanvu) .

Ebikozesebwa Obuzito Obutuufu | Nga. kkiro 140

Okuyita mu nkola | ≥ 80 wafers/essaawa

Obudde bw'okukyusa ebintu | ≤ eddakiika 5

Ebitundu Ebikulu eby’Okusaba

Nga omukago omukulu mu layini y’okufulumya ebipapula bya semiconductor, STK-6020 okusinga ekozesebwa ku:

Okukuuma kungulu nga tonnagonza mugongo: Omulimu gwayo omukulu kwe kusiiga firimu ekuuma ku ngulu wa wafer nga tonnasena mugongo (back-grinding) okuziyiza okukunya n’obucaafu bw’eddagala. Dicing Tape Lamination: Enkola eno era esobola okukozesebwa okusiiga dicing tape nga tonnasala wafer, bwe kityo ne kinyweza wafer n’okwanguyiza emirimu gya dicing egiddako.

Enkola Ennungi: Esaanira ebyuma bya semikondokita eby’enjawulo, ebikwata ku nnimiro empanvu nga logic chips, memory chips, MEMS sensors, n’ebirala.

**Ebyuma Ebikolagana**

Mu layini y’okupakinga semikondokita, STK-6020 etera okukola ng’ekwataganye n’ebyuma ebirala ebikola mu ngeri ey’otoma okukola eky’okugonjoola ekijjuvu, ekigatta:

**Upstream Integration (with Tape Removal Equipment):** Nga tonnaba kugonza oba kukola dicing processes, kitera okwetaagisa okusooka okuggyawo film protective film eyassibwa mu kiseera ky’omutendera gw’enkola ogusoose. SINTAIKE egaba ebyuma ebiggyawo wafer tape ebitali bimu —nga STK-520 ne STK-5020 —ebiyinza okugattibwa obulungi ne tape laminator.

Enkola z’omugga wansi n’ebikozesebwa mu kusena/okusala: Enkola y’okusiiga bw’emala okuggwa, wafers zikyusibwa ne ziteekebwa mu sila oba dicing saw okusobola okuzirongoosa oluvannyuma.

Okubumbako

Okutwaliza awamu, SINTAIKE STK-6020 nkola ya semi-automatic wafer lamination system ekuze, eyeesigika, era etali ya ssente nnyingi. Okuyita mu ngeri yaayo ey’okukola mu ngeri ya semi-automatic erongooseddwa, etuwa omutindo gwa lamination ogutebenkedde n’okukyukakyuka kw’enkola okw’amaanyi, ekigifuula esaanira nnyo naddala layini z’okugezesa n’embeera ezirimu okufulumya okutabula okungi, okw’obuzito obutono. Ku bakasitoma abakulembeza Return on Investment (ROI) era nga banoonya okussa mu nkola enkola ya stable wafer lamination ku ssente entono, STK-6020 ekiikirira eky’okulonda ekisaanira ennyo okulowoozebwako.