ACCRETECH FP2000 ekyuma ekikebera wafer

FP2000 ya mm 200 (yinsi 8) ekola otomatiki mu bujjuvu wafer/frame dual-purpose prober** eyatongozebwa kkampuni ya ACCRETECH eya Japan. Okusinga ekoleddwa okugezesa CP chips ezikoleddwa nga tezinnabaawo ku dicing frames, ate nga era ekwatagana ne standard 5–8 inch whole wafers. Ye nkola enkulu ey’okugezesa CSP/WLCSP, MEMS, ne wafers ezigonvu ennyo/eziwuguddwa.

I. Enkola y’emirimu

FP2000 mu bukulu ye kyuma ekigezesa n’okusunsula amasannyalaze mu ngeri entuufu. Omusingi gwayo omukulu gulimu emitendera esatu:

* **Okutikka, okutikkula, n'okuteeka mu kifo mu ngeri ey'obwengula:** Ewagira okutikka mu ngeri ey'otoma, okulaganya, n'okunyweza wafers zonna oba pre-diced wafers/chips eziyungiddwa ku dicing frames.

* **Okutegeera ebifaananyi n’okukwatagana obulungi:** Kkamera ey’obulungi obw’amaanyi ne pulogulaamu ekola ku bifaananyi bitegeera butereevu chip pads, ne bivuga XYθ platform okutambula n’obutuufu obw’amaanyi, okukakasa nti ensonga ya kaadi ya probe ekwatagana bulungi ne pad.

**Okutegeera ebifaananyi n’okukwatagana obulungi:** Kkamera ey’obulungi obw’amaanyi ne pulogulaamu ekola ku bifaananyi bitegeera butereevu chip pads, ne bivuga XYθ platform okutambula n’obutuufu obw’amaanyi, okukakasa nti ensonga ya kaadi ya probe ekwatagana bulungi ne pad. Okugezesa kw’amasannyalaze okukka mu ngeri ennyogovu: Z-axis soft-landing control; probe enyiga butono ku paadi okukola ekiyungo ky’amasannyalaze; omukebera ATE afulumya siginiini okugezesa omulimu/parameters za chip, n’awandiika ebivuddemu ebirungi/ebibi n’okubissaako akabonero.

Okukola n’okusunsula data: Egabanya n’okutereka data mu ngeri ey’otoma okusinziira ku bivudde mu kugezesebwa, ng’eyungibwa ku byuma ebisunsula/okupakinga eby’emabega.

Core Technical Highlights: Eriko enkola ey’enjawulo ey’okutereeza ekifo kya chip, mu ngeri ey’enjawulo eliyirira ensobi z’okugolola, okukyusakyusa, n’okukyusakyusa chip ku fuleemu oluvannyuma lw’okusala dicing, okukakasa okukwatagana okutuufu okwa probe.

II. Ebikwata ku nsonga enkulu (2026 Ebisembyeyo)

Ekintu ku mmeeza Parameter Ekozesebwa Sayizi 5/6/8 yinsi (120/150/200mm) wafer yonna; Fuleemu ya yinsi 8 eya dicing (ekwatagana ne fuleemu ya yinsi 6)

Obutuufu bw’okuteeka mu kifo XY: ±1.0 μm; θ: ±0.001°

Sipiidi y’okutambula XY: Esinga obunene mm 200/s; Z: Ekisinga obunene mm 20/s

Temperature Range Standard: Ebbugumu ly’ekisenge; Okwesalirawo: -40°C ～ +150°C Okukebera ebbugumu erya waggulu n’erya wansi

Omutendera Omutendera gwa seramiki ogw’obugumu obw’amaanyi, okusikiriza mu vacuum; awagira ultra-thin (≤50μm), wafers / fuleemu eziwuuma ennyo

Enkola y’okulaganya Kkamera bbiri (waggulu/wansi) okulaganya okw’otoma; okukuza 200–1000×

Probe Card Ekwatagana ne kaadi zonna eza probe eza mm 200 eza mutindo; okupima parallelism mu ngeri ey’otoma

Obusobozi Obumanyiddwa: Wafers 200–300/olunaku (8 1800mm dicing frame; Multi-Die optional

Ebipimo/Obuzito: Nga. 1800×1200×1800 mm, nga zino ze zikola; Nga. kkiro 1800

III. Emirimu Emikulu

Okukyusa wafer/dicing frame okunyiga omulundi gumu

Tekyetaagisa kukyusa hardware, okukyusa okunyiga omulundi gumu wakati wa whole wafer ne dicing frame modes kikendeeza nnyo ku budde bw’okukyusa.

Enkola y’okugezesa ekolebwa mu ngeri ya otomatiki mu bujjuvu

Okutikka mu ngeri ey’otoma → Okukwatagana n’ebifaananyi → Okukwatagana ne probe → Okugezesa amasannyalaze → Okukwata ebivuddemu → Okutikkula mu ngeri ey’otoma, nga tewali alabirira mu bujjuvu.

Okutereeza ekifo mu ngeri ey’obutuufu obw’amaanyi

Sofutiweya eyeetongodde eliyirira okugolola chip, offset, n’okuwugula oluvannyuma lw’okusala dicing, okulongoosa amakungula ebitundu 3–5%.

Ebbugumu erigazi n’okugezesebwa okw’enjawulo

Module z’okugezesa ez’ebbugumu erya waggulu n’ezo erya wansi, micro-current, voltage enkulu, ne RF ezigezesebwa, ezikwata ku MEMS, ebyuma by’amasannyalaze, n’obwetaavu bw’ebyuma by’emmotoka.

Okulondoola Okulondoola Empiso

Okulondoola mu kiseera ekituufu okwambala n’okubeebalama kwa probe, okutangira pad okwonooneka n’okukendeeza ku ssente z’okuddaabiriza.

Okugezesa mu ngeri ya Multi-Die parallel

Awagira okugezesa omulundi gumu okutuuka ku chips 4, okwongera ku throughput emirundi 2-3. Okulondoola n’okuddukanya data: Okutegeera koodi ya Barcode/QR, okusoma n’okuwandiika ID, okuteeka data y’okugezesa mu kiseera ekituufu, n’okuwagira okwekenneenya amakungula n’okulondoola.

Okulondoola n’okuddukanya data: Okutegeera koodi ya Barcode/QR, okusoma n’okuwandiika ID, okuteeka data mu kugezesa mu kiseera ekituufu, okuwagira okwekenneenya amakungula n’okulondoola.

IV. Emirimu emikulu: Ebyuma ebikulu eby’okugezesa chip (CP): Ekola okugezesa amasannyalaze 100% ku chips ezasaliddwa edda ku wafer frame oluvannyuma lw’okuzipakira dicing ne nga tezinnaba kupakinga, okukebera ebintu ebirungi n’okwewala kasasiro w’okupakinga.

Advanced Packaging Adaptation: Ekoleddwa naddala ku CSP/WLCSP, Fan-out, ne 2.5D/3D packages, okugonjoola okusoomoozebwa kw’okugezesa okukwatagana ne ultra-thin/warpage/dicing.

Eweereddwayo eri MEMS/Ebyuma by’Amaanyi: Ewagira okugezesa okw’obutuufu obw’amaanyi okwa MEMS (pressure/accelerometer/gyroscope), MOSFETs, IGBTs, ne diodes/transistors.

Okulongoosa mu makungula n’obusobozi: Okupima mu ngeri ey’otoma + okugezesa ku sipiidi ey’amaanyi + okukola mu ngeri ey’okukwatagana kulongoosa amakungula, obusobozi emirundi ebiri, n’okukendeeza ku nsaasaanya y’okugezesa yuniti.

V. Ebirungi Ebikulu (Okugeraageranya n’Ebintu Ebifaanagana) .

1. Unique "Wafer/Frame Dual-Use" High-Precision Model: Ebintu ebisinga ebivuganya biweereddwayo oba wafers oba frames zokka; FP2000 yenkana ebyuma bibiri mu kimu, ekuwa ssente entono ennyo.

2. Obutuufu bw’okugezesa oluvannyuma lw’okukola endya: Nga ekozesa enkola ey’enjawulo ey’okugezesa fuleemu ey’emyaka 20, eliyirira dicing stretching/warping, okutuuka ku ±1μm positioning accuracy, esukkulumye nnyo ku bavuganya ±2-3μm.

3. Obusobozi obw’amaanyi obw’okukwata Wafers Ultra-Thin/Warped: Vacuum adsorption + flexible support ekakasa okukwata okunywevu kwa wafers ≤50μm ultra-thin ne >5mm warped, n’okufiirwa amakungula <1%.

4. Mature, Stable, and Low TCO: Okusinziira ku UF2000 high-end platform, nga erimu units ezisoba mu 1000 eziteekeddwa mu nsi yonna, obudde wakati w’okulemererwa (MTBF) buli ssaawa >5000, ekivaamu ssente entono ez’okuddaabiriza.

5. Modular Expansion, Flexible Adaptation: Module ez’okwesalirawo ez’ebbugumu erya waggulu n’ery’entono, puleesa eya waggulu, micro-current, RF, multi-chip parallel processing, probe cleaning, n’ebirala, okusobozesa okulongoosa nga bwe kyetaagisa n’okukuuma investment.

6. Simple Operation, Easy to Learn: Unified GUI interface, okukyusa mode okunyiga omulundi gumu, okulaganya otomatiki, n'okugezesa otomatiki; n’abatandisi basobola okuyiga okugikozesa mu lunaku lumu.

VI. Ensonga eza bulijjo ez’okukozesa

CSP/WLCSP Production Line: okugezesa dicing ne frame ya yinsi 8, erimu obuzito bungi, ekola amakungula amangi

MEMS Okukola: Puleesa/ekipima sipiidi/gyroscope chips, ebbugumu erya waggulu ne wansi + okugezesa micro-current

Ebyuma by’Amasannyalaze: MOSFETs, IGBTs, diodes, okugezesa kwa vvulovumenti eya waggulu/amasannyalaze amangi

Ultra-thin Wafers: Logic/analog chips wansi wa 50μm, okusikiriza ku ludda lw’emabega + okuliyirira warpage

Automotive Electronics: AEC-Q100 satifikeeti, ebbugumu range (-40 ° C ~ 150 ° C) + okugezesa okwesigika okw'amaanyi

VII. Okugerageranya n’abavuganya (Okulaba amangu) .

Ekintu ekigeraageranya emmeeza ACCRETECH FP2000 TEL Precio octo UF200R

Wafer/Frame Dual Kozesa Native Support Wafer Yokka Wafer Yokka

Obutuufu bw’okukuba daasi ±1μm (obukakaliddwa) ±1.5μm (obutapimiddwa) ±1.5μm (obutapimiddwa)

Okulongoosa okugonvu ennyo ≤50μm ≥100μm ≥75μm

Obusobozi (fuleemu ya yinsi 8): wafers 200–300/olunaku

Fuleemu tewagirwa

Bbeeyi: Wakati-waggulu, Wakati, Wansi

Ensonga ezikozesebwa: Fuleemu + Wafer, Okupakinga okw’omulembe, Wafer ennongoofu, Okufulumya mu bungi mu bulambalamba, Wafer ennongoofu, Okufulumya mu bungi okukekkereza ssente

Mu bufunze: FP2000 ye siteegi yokka ekola buli kimu mu katale ka yinsi 8 esobola okukwata byombi "whole wafer" ne "diced frame" high-precision testing. Esaanira nnyo okukozesebwa okw’omulembe nga CSP/WLCSP, MEMS, ne ultra-thin wafers, era ye nkola enkulu ennyo ey’okugezesa fuleemu mu nsi yonna okuva mu 2020 okutuuka mu 2026.