ACCRETECH FP2000 wafer prober

FP2000 ndi wafer/frame yopangidwa yokha ya 200mm (8-inch) yopangidwa yokha ndi kampani ya ACCRETECH ya ku Japan. Yapangidwira makamaka kuyesa ma chips odulidwa kale pamafelemu odulidwa, komanso imagwirizana ndi ma wafers onse a mainchesi 5–8. Ndi chitsanzo chodziwika bwino choyesera ma wafers a CSP/WLCSP, MEMS, ndi ma wafers owonda kwambiri/opindika.

I. Mfundo Yogwirira Ntchito

FP2000 kwenikweni ndi chipangizo choyesera ndi kusanja zamagetsi cholondola kwambiri. Mfundo yake yaikulu ili ndi magawo atatu:

* **Kuyika, Kutsitsa, ndi Kuyika Zokha:** Zimathandizira kuyika, kulinganiza, ndi kuyika ma wafer athunthu kapena ma wafer/ma chips odulidwa kale omwe amamangiriridwa ku mafelemu odulidwa.

* **Kuzindikira ndi Kulinganiza Zithunzi Mwanzeru:** Kamera yapamwamba kwambiri komanso pulogalamu yokonza zithunzi imazindikira yokha ma chip pad, zomwe zimapangitsa kuti nsanja ya XYθ iyende bwino kwambiri, ndikuwonetsetsa kuti nsonga ya khadi la probe ikugwirizana bwino ndi pad.

**Kuzindikira ndi Kulinganiza Zithunzi Mwanzeru:** Pulogalamu yojambula zithunzi yokhala ndi kamera yapamwamba kwambiri komanso yokonzedwa bwino imazindikira zokha ma chip pad, ndikuyendetsa nsanja ya XYθ kuti iyende bwino kwambiri, kuonetsetsa kuti nsonga ya khadi la probe ikugwirizana bwino ndi pad. Kuyesa Kwamagetsi Kofewa: Kuwongolera kofewa kwa Z-axis; probe imakanikiza pang'ono pa pad kuti ipange kulumikizana kwamagetsi; choyesera cha ATE chimatulutsa chizindikiro kuti chiyese ntchito/magawo a chip, kulemba zotsatira zabwino/zoipa ndikuzilemba.

Kukonza ndi Kusanja Deta: Kugawa deta m'magulu ndi kuisunga yokha malinga ndi zotsatira za mayeso, kuilumikiza ku zida zosonkhanitsira/kuyika deta.

Zinthu Zapamwamba Zaukadaulo: Yokhala ndi njira yapadera yokonzera malo a chip, makamaka yothandiza pa zolakwika zotambasula, zopingasa, ndi zopotoka za chip pa chimango pambuyo podula, kuonetsetsa kuti probe ikukhudzana bwino.

II. Zofunikira Zapakati (Zaposachedwa za 2026)

Chigawo cha Zinthu pa Tebulo Kukula Koyenera 5/6/8 mainchesi (120/150/200mm) wafer yonse; chimango chodulira cha mainchesi 8 (chogwirizana ndi chimango cha mainchesi 6)

Kulondola kwa Malo XY: ±1.0 μm; θ: ±0.001°

Liwiro Loyenda XY: Pamwamba 200 mm/s; Z: Pamwamba 20 mm/s

Mulingo Woyenera Kutentha: Kutentha kwa chipinda; Zosankha: -40℃ ～ +150℃ Kuyesa kutentha kwakukulu komanso kotsika

Gawo Gawo la ceramic lolimba kwambiri, kulowetsedwa kwa vacuum; limathandizira ma wafer/mafelemu opyapyala kwambiri (≤50μm)

Kachitidwe Kogwirizanitsa Kamera ziwiri (pamwamba/pansi) zowongolera zokha; kukula 200–1000×

Khadi la Probe Limagwirizana ndi makadi onse oyesera a 200mm; kuwerengera kofanana kwa automatic

Kuchuluka Kwake: Ma wafer 200–300 patsiku (mafelemu 8 odulira 1800mm; Multi-Die safuna

Miyeso/Kulemera: Pafupifupi 1800×1200×1800 mm; Pafupifupi 1800 kg

III. Ntchito Zazikulu

Kusintha kwa chivundikiro cha wafer/dicing kamodzi

Palibe chifukwa chosinthira zida zamagetsi, kusinthana kamodzi kokha pakati pa njira zonse za wafer ndi ma dicing frame kumachepetsa kwambiri nthawi yosinthira.

Njira yoyesera yokha

Kutsegula kokha → Kulinganiza chithunzi → Kulumikizana ndi probe → Kuyesa kwamagetsi → Kujambula zotsatira → Kutsitsa kokha, popanda kuyang'aniridwa konse.

Kukonza malo molondola kwambiri

Mapulogalamu apadera amathandiza kukulitsa tchipisi, kuyika tchipisi, ndi kupotoza pambuyo poduladula, zomwe zimapangitsa kuti phindu likhale lokwera ndi 3–5%.

Kutentha kwakukulu ndi mayeso apadera

Ma module oyesera kutentha kwapamwamba ndi kotsika, ma micro-current, ma voltage okwera, ndi ma RF omwe mungasankhe, omwe amakhudza MEMS, zida zamagetsi, ndi zosowa zamagetsi zamagalimoto.

Kuwunika kwa Singano

Kuwunika nthawi yeniyeni kuwonongeka ndi kupindika kwa probe, kupewa kuwonongeka kwa ma pad ndikuchepetsa ndalama zokonzera.

Kuyesa kwa Multi-Die nthawi imodzi

Imathandizira kuyesa ma chips mpaka 4 nthawi imodzi, ndikuwonjezera kuchuluka kwa deta ndi nthawi 2-3. Kutsata ndi Kuyang'anira Deta: Kuzindikira ma code a Barcode/QR, kuwerenga ndi kulemba ma ID, kukweza deta yoyeserera nthawi yeniyeni, komanso kuthandizira kusanthula ndi kutsatira zomwe zapezeka.

Kutsata ndi Kuyang'anira Deta: Kuzindikira ma Barcode/QR code, kuwerenga ndi kulemba ma ID, kukweza deta yoyesera nthawi yeniyeni, kuthandizira kusanthula zokolola ndi kutsatira.

IV. Ntchito Zazikulu: Zipangizo zoyezera ma chip (CP): Zimayesa magetsi 100% pa ma chips omwe adadulidwa kale pa chimango cha wafer ataduladula komanso asanapake, kufufuza zinthu zabwino ndikupewa kutaya zinthu zopaketera.

Kusintha kwa Ma Packaging Mwapamwamba: Yopangidwira makamaka ma CSP/WLCSP, Fan-out, ndi ma 2.5D/3D packages, kuthetsa mavuto oyesera okhudzana ndi ultra-thin/warpage/dicing.

Yoperekedwa kwa Zipangizo za MEMS/Power: Imathandizira kuyesa kwapamwamba kwa MEMS (pressure/accelerometer/gyroscope), MOSFET, IGBTs, ndi ma diode/transistors.

Kukweza Kuchuluka kwa Zokolola ndi Kutha: Kuyesa kokha + kuyesa mwachangu + kukonza nthawi imodzi kumawonjezera kuchuluka kwa zokolola, mphamvu ziwiri, ndikuchepetsa ndalama zoyesera mayunitsi.

V. Ubwino Wofunika (Kuyerekeza ndi Zogulitsa Zofanana)

1. Chitsanzo Chapadera cha "Wafer/Frame Dual-Use" Cholondola Kwambiri: Zinthu zambiri zopikisana nazo zimaperekedwa ku ma wafer kapena mafelemu okha; FP2000 ndi yofanana ndi makina awiri mu imodzi, zomwe zimapangitsa kuti ikhale yotsika mtengo kwambiri.

2. Kulondola kwa Mayeso Otsogola Pambuyo pa Kudya: Pogwiritsa ntchito njira yapadera yoyesera chimango ya zaka 20, imathandizira kutambasula/kupotoza magawo, kukwaniritsa kulondola kwa malo a ±1μm, kupitirira kwambiri ±2–3μm ya omwe akupikisana nawo.

3. Kutha Kwambiri Kugwira Ma Wafer Oonda Kwambiri/Opotoka: Kuthira kwa vacuum + chithandizo chosinthasintha chimatsimikizira kugwira bwino ntchito kwa ma wafer ≤50μm oonda kwambiri komanso opotoka >5mm, ndi kutayika kwa zokolola <1%.

4. TCO Yokhwima, Yokhazikika, komanso Yotsika: Kutengera nsanja yapamwamba ya UF2000, yokhala ndi mayunitsi opitilira 1000 omwe ayikidwa padziko lonse lapansi, nthawi yapakati pakati pa kulephera (MTBF) ndi > maola 5000, zomwe zimapangitsa kuti ndalama zokonzera zikhale zochepa.

5. Kukulitsa Modular, Kusintha Kosinthasintha: Ma module osankha kutentha kwambiri ndi kotsika, kuthamanga kwambiri, mphamvu yamagetsi yaying'ono, RF, kukonza ma chip ambiri, kuyeretsa probe, ndi zina zotero, zomwe zimathandiza kukweza ngati pakufunika ndikuteteza ndalama.

6. Ntchito Yosavuta, Yosavuta Kuphunzira: Mawonekedwe a GUI Ogwirizana, kusintha kwa mawonekedwe a kudina kamodzi, kulinganiza kokha, ndi kuyesa kokha; ngakhale oyamba kumene angaphunzire kuigwiritsa ntchito tsiku limodzi.

VI. Zochitika Zachizolowezi Zogwiritsira Ntchito

Mzere Wopanga wa CSP/WLCSP: Kuyesa kwa ma dicing a mainchesi 8 ndi chimango, chochuluka kwambiri, komanso chokwera mtengo

Kupanga kwa MEMS: Ma chips a Pressure/accelerometer/gyroscope, kuyesa kutentha kwambiri ndi kotsika + micro-current

Zipangizo Zamagetsi: MOSFET, IGBTs, ma diode, kuyesa kwamphamvu/kwamphamvu

Ma Wafers owonda kwambiri: Ma chips a Logic/analog osakwana 50μm, kulowetsedwa kwa madzi kumbuyo + kubwezeretsanso ma warpage

Zamagetsi Zamagetsi: Satifiketi ya AEC-Q100, kutentha kwakukulu (-40℃ ~ 150℃) + mayeso odalirika kwambiri

VII. Kuyerekeza ndi Opikisana Nawo (Chidule Chachidule)

Kuyerekeza kwa Tebulo Chinthu ACCRETECH FP2000 TEL Precio octo UF200R

Wafer/Frame Yogwiritsidwa Ntchito Pawiri Yothandizira Wafer Yokha Yokha

Kulondola kwa Kudula ±1μm (yoyesedwa) ±1.5μm (yosayesedwa) ±1.5μm (yosayesedwa)

Kukonza Kowonda Kwambiri ≤50μm ≥100μm ≥75μm

Kuchuluka (chimango cha mainchesi 8): ma wafer 200–300 patsiku

Chimango sichinathandizidwe

Mtengo: Wapakati-wapamwamba, Wapakati, Wotsika

Zochitika Zoyenera: Chimango + Wafer, Kupaka Kwapamwamba, Wafer Woyera, Kupanga Zinthu Zambiri, Wafer Woyera, Kupanga Zinthu Zambiri Mosawononga Ndalama

Mwachidule: FP2000 ndi malo okhawo oyesera zinthu zonse pamsika wa mainchesi 8 omwe amatha kuyesa bwino kwambiri "wafer yonse" komanso "chimango chodulidwa". Ndi yoyenera makamaka pa mapulogalamu apamwamba monga CSP/WLCSP, MEMS, ndi ma wafer owonda kwambiri, ndipo ndi chitsanzo chachikulu kwambiri choyesera zinthu padziko lonse lapansi kuyambira 2020 mpaka 2026.