ali ndi 70% pa Magawo a SMT - Mu Stock & Okonzeka Kutumiza
Pezani Quote →Mayankho olondola kwambiri a flip chip bonding a die-to-substrate assembly, fine-pitch alignment, thermo-compression bonding, SiP, chiplet integration, MEMS devices, sensors, ndi ma Advanced Semiconductor Packaging Production.
Malo oikamo die othandizidwa ndi maso kuti agwirizane bwino.
Flip chip bonder ndi zida zomangira za semiconductor zomwe zimagwiritsidwa ntchito kuyika ndikulumikiza die molunjika pansi pa substrate, interposer, phukusi, kapena chonyamulira. Nthawi zambiri imagwiritsidwa ntchito pomanga flip chip, kusonkhanitsa bwino, kuphatikiza chiplet, ma module a SiP, zida za MEMS, masensa, ndi ma phukusi apamwamba a semiconductor.
Poyerekeza ndi zida zachikhalidwe zolumikizira ma die, kulumikizana kwa flip chip kumafuna kulondola kwambiri kwa malo, kulumikizana kwa maso, kuwongolera mphamvu ya ma bonding, komanso kukhazikika kwa kutentha chifukwa kulumikizana kwamagetsi kumachitika kudzera m'mabampu, ma pad, kapena maulumikizidwe omwe ali mbali yogwira ntchito ya die.
Cholumikizira cha flip chip chimafuna malo olondola oyika die, mphamvu yokhazikika yolumikizira, kuwongolera kutentha kodalirika, komanso magwiridwe antchito obwerezabwereza. Cholumikizira choyenera cha flip chip chimathandiza kukonza kupangika kwa makonzedwe, kuchepetsa zolakwika zolumikizira, komanso kuthandizira zofunikira kwambiri pakulongedza.
Kwa ma bumps opindika bwino, ma bumps ang'onoang'ono, ma chiplets, ndi ma connector okhala ndi density yayikulu.
Zimathandiza kuchepetsa kuwonongeka kwa ma die, kukhudzana kosayenera, komanso kusintha kwa njira.
Chofunika kwambiri pa thermo-compression bonding ndi solder bump bonding.
Imathandizira SiP, chiplet, MEMS, masensa, ndi ma phukusi apamwamba a semiconductor.
Ma flip chip osiyanasiyana amafunika ma bonding configurations osiyanasiyana. Timathandiza kufananiza zida kutengera njira yolumikizira, kukula kwa die, mtundu wa substrate, kulondola kwa malo, kutentha, kuwongolera kuthamanga, ndi mphamvu yopangira.
Kambiranani za Njira Yanu YolumikiziranaKwa mapulogalamu omwe amafunikira mphamvu yolondola, kutentha, nthawi, ndi kuwongolera kulumikizana.
Popangira flip chip pogwiritsa ntchito solder bumps kapena micro bump interconnects.
Kwa MEMS, zipangizo zoyezera, ma module, ndi msonkhano wapadera wa substrate.
Kwa chiplet, phukusi lapamwamba kwambiri, ndi mapulogalamu apamwamba olumikizirana.
Malo awa ndi osungidwa kuti agwiritsidwe ntchito pa gulu la malonda anu kapena kuyitanidwa kwa malonda omwe akulimbikitsidwa. Sinthani makadi azinthu zomwe mwasankha ndi CMS product loop yanu.
Fufuzani ASM AMICRA AFC PLUS die and flip chip bonder, kuphatikizapo makonzedwe omwe alipo, kulondola kwa malo, ndi ma bonding...
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Shibaura Mechtronics TFC-9000 ndi makina olumikizirana a flip-chip omwe amapangidwa mochuluka omwe adapangidwira njira yapamwamba yopangira ma paketi...
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ASM AFC Plus ndi bonder yokhwima paukadaulo, yolondola kwambiri komanso yolondola kwambiri. Ndipotu, ndi yosinthika yokhala ndi ziboliboli ziwiri...
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Besi Datacon 8800 CHAMEO ultra plus AC ndiye mtsogoleri wosadziwika pamsika wapadziko lonse wa hybrid bonding.
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BESI Esec 2100 FC hS ndi makina okhwima opangidwira kupanga ma flip-chip bonding othamanga kwambiri komanso amphamvu kwambiri.
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Choyikira cha Yamaha YSH20 flip chip ndi choyikira chachangu komanso cholondola kwambiri choyenera kuyika zinthu zosiyanasiyana...
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Kuyika kwa chip mwachindunji kuchokera pa wafer pazida zokhazikika zoyikira pamwamba, kuphatikiza liwiro la makina oyikira pamwamba ...
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Katalyst™ ndi chipangizo chotsogola cha Flip Chip chomwe chinayambitsidwa ndi Kulicke & Soffa (K&S), chomwe chimagwiritsidwa ntchito kwambiri popangira flip chi...
Yang'anani Zomwe Zasungidwa & MtengoKapangidwe ka chipu cha flip chip chiyenera kusankhidwa malinga ndi njira yolumikizira, kukula kwa die, kukula kwa substrate, kulondola kwa alignment, mphamvu yolumikizira, kufunikira kwa kutentha, makina owonera, ndi mphamvu yopangira.
Mtengo wa bond ya flip chip umadalira mtundu, nsanja, kulondola kwa malo, njira yolumikizira, mulingo wodziyimira pawokha, makina owonera, gawo la kutentha, kasinthidwe ka mapulogalamu, momwe zida zilili, komanso kupezeka kwa makina pakadali pano.
Kulumikiza bwino kwa ma slats ndi ma micro bump nthawi zambiri kumafuna ma platforms olondola kwambiri.
Kugwirizanitsa kwa thermo-compression, kulumikiza kwa solder bump, ndi kulumikiza kwa glue kumafuna ma module osiyanasiyana.
Makina opangidwa ndi manja, opangidwa ndi theka, komanso opangidwa ndi makina okha ali ndi mphamvu zosiyana komanso mtengo wosiyanasiyana.
Ma bond a flip chip omwe agwiritsidwa ntchito komanso okonzedwanso amatha kuchepetsa ndalama zomwe amaika poyerekeza ndi machitidwe atsopano.
Imathandizira kulinganiza kwa die-to-substrate komanso kulondola kwa malo oyika bwino.
Chofunika kwambiri pa chitetezo cha die, ubwino wa kulumikizana, komanso zotsatira zobwerezabwereza za mgwirizano.
Zofunikira pa thermo-compression bonding, solder bump processes, komanso kutentha kukhazikika.
Imathandizira ma substrates osiyanasiyana, ma interposer, ma phukusi, zonyamulira, ndi ma module.
Sankhani makina opangidwa ndi manja, opangidwa ndi theka, kapena opangidwa ndi okha kutengera zomwe akufuna kupanga.
Makina ogwiritsidwa ntchito ndi okonzedwanso ayenera kufufuzidwa ngati ali ndi kasinthidwe, kayendedwe, mawonekedwe, ndi momwe amawongolera.
Bonder ya flip chip ndi bonder ya die zonse zimagwiritsidwa ntchito popanga ma semiconductor, koma zimakwaniritsa mawonekedwe osiyanasiyana a bonding ndi zofunikira pakulongedza.
| Chinthu | Flip Chip Bonder | Wothandizira |
|---|---|---|
| Malangizo Ogwirizanitsa | Imfa yamangidwa chafufumimba | Die nthawi zambiri imayikidwa moyang'anizana kapena yolumikizidwa ku leadframe/substrate |
| Njira Yolumikizira | Mabampu, ma pad, ma bampu ang'onoang'ono, ma connectors | Chomangira chomatira, epoxy, solder, kapena eutectic |
| Kufunika Kolondola | Kulondola kwambiri kwa kulinganiza | Zimatengera phukusi ndi njira yolumikizirana |
| Mapulogalamu Aakulu | Chip yozungulira, SiP, chiplet, phukusi la 2.5D/3D | Ma CD wamba, ma LED, masensa, ma module |
| Kuwongolera Njira | Imafuna mphamvu, kutentha, masomphenya, ndi kuwongolera malo | Imayang'ana kwambiri pa malo oyika ma die ndikuwongolera zinthu |
Ma bond a flip chip amagwiritsidwa ntchito pamene pakufunika kulumikizana kwamphamvu kwambiri, mapaketi ang'onoang'ono, kulumikizana kolondola, komanso magwiridwe antchito apamwamba.
Kuti mugwirizane ndi chip-to-substrate komanso kuti mupange phukusi lapamwamba kwambiri.
Kuti muphatikize zinthu zambirimbiri, ma phukusi osiyanasiyana, komanso kuti mupange chiplet.
Kwa ma module ang'onoang'ono, makina omwe ali mkati, ndi zipangizo zogwira ntchito bwino kwambiri.
Zipangizo zofewa zomwe zimafuna malo okhazikika komanso kulamulira kugwirizana.
Pa mizere ya R&D, kupanga koyeserera, kukulitsa mphamvu, kapena mapulojekiti omwe amaganizira bajeti, ma bond a flip chip omwe amagwiritsidwa ntchito komanso okonzedwanso angapereke mphamvu yogwirira ntchito yolumikizirana ndi nthawi yochepa komanso mtengo wotsika wa zida.
Musanagule bonder ya flip chip yomwe yagwiritsidwa ntchito kale kapena yokonzedwanso, yang'anani zigawo zazikulu zomwe zimakhudza mwachindunji kulondola kwa kulumikizana, kukhazikika kwa bonding, komanso kugwiritsidwa ntchito kwa nthawi yayitali.
Timathandiza makasitomala kupeza ma flip chip bonders oyenera kutengera kukula kwa die, mtundu wa phukusi, kufunikira kwa kulumikizana, njira yolumikizirana, mphamvu yopangira, momwe zida zilili, bajeti, ndi nthawi yotumizira.
Tsimikizani die, substrate, mtundu wa phukusi, njira yolumikizirana, ndi kufunikira kolondola.
Perekani malangizo oyenera kutengera njira ndi bajeti.
Tsimikizirani momwe makinawo alili komanso momwe zida zake zilili zoyambira musanatumize.
Thandizani kulongedza katundu kunja, kugwirizanitsa kayendetsedwe ka zinthu, ndi kutumiza katundu kunja.
Flip chip bonder ndi zida zomangira za semiconductor zomwe zimagwiritsidwa ntchito kuyika ndikulumikiza die molunjika pansi pa substrate, interposer, kapena phukusi pogwiritsa ntchito kulinganiza bwino, mphamvu, ndi kuwongolera kutentha.
Imagwiritsidwa ntchito popangira ma flip chip, kulumikiza chip-to-substrate, kuyika ma Advanced Packaging, SiP, Chiplet Integration, MEMS Devices, Masensa, ndi High-density Semiconductor Assembly.
Cholumikizira cha die chimayika die pa substrate kapena leadframe, pomwe cholumikizira cha flip chip chimalumikiza die molunjika pansi ndi kulumikizidwa bwino ndi ma bumps, ma pad, kapena ma interconnect.
Inde. Ma bond ogwiritsidwa ntchito komanso okonzedwanso bwino ndi oyenera makasitomala omwe amafunikira mphamvu yodalirika yolumikizirana ndi ndalama zochepa.
Muyenera kuganizira kulondola kwa malo, njira yolumikizira, kukula kwa die, kukula kwa substrate, mphamvu yolumikizira, kuwongolera kutentha, mphamvu yogwiritsira ntchito, momwe zida zilili, bajeti, ndi chithandizo chomwe chilipo.
Tiuzeni kukula kwa die yanu, mtundu wa substrate, njira yolumikizirana, kulondola komwe mukufuna, mtundu womwe mumakonda, bajeti yanu, ndi nthawi yotumizira. Tikuthandizani kupangira njira zoyenera zolumikizirana ndi flip chip.
Chifukwa chiyani anthu ambiri amasankha kugwira ntchito ndi GeekValue?
Mtundu wathu ukufalikira kuchokera ku mzinda kupita ku mzinda, ndipo anthu osawerengeka andifunsa, "Kodi GeekValue ndi chiyani?" Zimachokera ku masomphenya osavuta: kupatsa mphamvu luso lachi China ndi luso lamakono. Uwu ndi mzimu wodzitukumula mosalekeza, wobisika pakufunafuna kwathu tsatanetsatane komanso chisangalalo chopitilira zomwe tikuyembekezera pakubweretsa kulikonse. Mmisiri waluso komanso kudzipereka uku sikungolimbikira kwa omwe adayambitsa, komanso tanthauzo ndi kutentha kwa mtundu wathu. Tikukhulupirira kuti muyambira pano ndikutipatsa mwayi wopanga ungwiro. Tiyeni tigwire ntchito limodzi kuti tipange chozizwitsa chotsatira cha "zero defect".
ChenLumikizanani ndi katswiri wazogulitsa
Lumikizanani ndi gulu lathu lazamalonda kuti mufufuze mayankho omwe amagwirizana bwino ndi bizinesi yanu ndikuyankha mafunso aliwonse omwe mungakhale nawo.
© Ufulu Onse Ndiwotetezedwa. Thandizo laukadaulo:TiaoQingCMS
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