Chikwama cha SHIBAURA TFC-9000 flip chip

SHIBAURA MECHATRONICS TFC-9000 ndi cholumikizira cha flip-chip chopangidwa mochuluka chomwe chimapangidwira njira zapamwamba zopakira, monga Fan-Out Wafer-Level Packaging (FO-WLP). M'malo motsatira kulondola kwambiri pamlingo wa labotale, zolinga zake zazikulu zopangira zimayika patsogolo Kupanga Kwambiri ndi Kapangidwe Kakang'ono, ndikuchiyika bwino pamsika wopanga zinthu zambiri. Chifukwa cha chizolowezi chofuna kuchepetsa mphamvu ndi kuphatikiza kwakukulu pazida zam'manja, kufunikira kwa njira za FO-WLP kukuchulukirachulukira; TFC-9000 ikuyimira chitsanzo chachikulu cha Shibaura chomwe chidapangidwa makamaka kuti chigwirizane ndi vutoli.

**Zofunika Kwambiri: Kulinganiza Magwiridwe Antchito ndi Kugwira Ntchito Mwanzeru**

Magawo ofunikira aukadaulo otsatirawa, osonkhanitsidwa kuchokera ku deta yovomerezeka, akuwonetsa momwe makinawo alili pakati pa kulondola, kugwira ntchito bwino, ndi luso logwiritsira ntchito zinthu:

**Mawonekedwe** | **Magawo Ofotokozedwa**

**Mtundu wa Zipangizo** | Bonder Yopangira Mapaketi Yokhala ndi Wafer-Level / Bonder Yokhala ndi Flip-Chip

**Njira Zapakati** | Kupaka Ma Wafer-Level Packaging (FO-WLP), Flip-Chip Ball Grid Array (FC-BGA)

**Kulondola kwa Malo** | Kulinganiza Kwapafupi: ±5 µm (3σ)

Kugwirizana kwa Padziko Lonse: ± 7 µm (3σ)

**Kugwira Ntchito Mwachangu (UPH)** | Kugwirizana Padziko Lonse: Mpaka mayunitsi 7,200 pa ola limodzi

Kulinganiza Kwapafupi: Mpaka mayunitsi 5,100 pa ola limodzi

**Mphamvu Yogwirizanitsa** | Max. 50 N

**Kukula kwa Chip** | Kukula Kwambiri □26 mm

**Kukula kwa Substrate/Wafer Yothandizidwa** | Wafer: φ200 / 300 mm

Chigawo chapansi: Chokulirapo 330 × 320 mm

**Kuthandizira Njira** | Imathandizira njira zonse ziwiri za Face-Up ndi Flip-Chip (Face-Down); imagwirizana ndi ukadaulo wosiyanasiyana kuphatikiza DAF (Die Attach Film), C4 (Controlled Collapse Chip Connection), ndi T/C (Thermo-Compression).

**Malo Oyendera** | Malo akuluakulu a chipinda: Pafupifupi 2.5 m² (Kapangidwe Kakang'ono)

**Malo ndi Tsatanetsatane Waukulu Waukadaulo**

Malingaliro ofunikira a kapangidwe ka TFC-9000 ndikukwaniritsa zosowa za kupanga ma CD akuluakulu komanso ogwira ntchito bwino kwambiri. **Kukhazikitsa Mitu Yambiri Yopanga Zinthu:** Zipangizozi zimakhala ndi mitu iwiri, zomwe zimapangitsa kuti ntchito igwire bwino ntchito mkati mwa malo ochepa kwambiri; zimagwira ntchito ngati chitsanzo chofunikira cha filosofi ya "Ming'alu Yaing'ono & Yopanga Zinthu Kwambiri".

**Kugwirizana kwa Njira Yonse:** Yokonzedwa makamaka kuti igwiritsidwe ntchito pa Fan-Out Wafer-Level Packaging (FO-WLP), dongosololi limagwirizana ndi njira zonse ziwiri za FO-WLP—"Chip-First" ndi "Chip-Last/RDL-First"—potero limagwirizana ndi njira zosiyanasiyana zaukadaulo za makasitomala osiyanasiyana.

**Zosankha Zosinthasintha:** Kuwonjezera pa kuthekera kokhazikika kwa flip-chip, chipangizochi chimapereka mitundu yambiri ya ma module ofunikira—monga Flux Copying ndi Thick/Thin Die Pickup—kuti akwaniritse zochitika zosiyanasiyana zogwiritsidwa ntchito.

**Malo Ogwiritsira Ntchito:** Yoyang'ana Kwambiri Pakuyika Zinthu Zapamwamba

TFC-9000 imagwiritsidwa ntchito makamaka m'malo opanga zinthu zazikulu komwe kuchita bwino, kulondola, komanso kuwongolera ndalama ndizofunikira kwambiri.

**Malo Opaka Ma Wafer Ochokera ku Fan-Out (FO-WLP):** Pulogalamu yofunikira kwambiri. Yokonzedwa bwino kuti igwiritsidwe ntchito poyika ma chips ambiri omwe amapezeka m'mafoni am'manja—monga mafoni am'manja ndi mapiritsi—kuphatikizapo Power Management ICs (PMICs) ndi RF Front-End Modules (RF FEMs).

**Flip-Chip Ball Grid Array (FC-BGA):** Malo ena ofunikira kwambiri ogwiritsira ntchito. Amagwiritsidwa ntchito pokonza ma chips apamwamba kwambiri, monga ma CPU, ma GPU, ndi ma processor a AI.

**Kugwirizanitsa kwa Wafer ndi Wafer / Substrate ndi Substrate (Chip pa Wafer/Substrate):** Kumathandizira kuyika kwa ma chips pa ma wafer a 300mm kapena ma substrate a sikweya okwana 330mm x 320mm, zomwe zimathandiza mitundu yosiyanasiyana ya ma paketi.

**Malo a Msika ndi Ubwino Wopikisana: Msika wa Shibaura's Niche**

Mu msika wapadziko lonse lapansi wa ma bond a flip-chip, Shibaura ndiye wosewera wofunikira kwambiri.

**Udindo wa Msika:** Msika wapadziko lonse wa flip-chip bonder ukulamulidwa ndi opanga akuluakulu anayi—Besi, ASM Pacific, Shibaura, ndi Kulicke & Soffa—omwe onse pamodzi amapanga pafupifupi 70% ya gawo lonse la msika. Udindo wa Shibaura: Shibaura Mechatronics ili ndi zaka zambiri zogwira ntchito mozama pantchito yolumikiza flip-chip. Mndandanda wazinthu zake za TFC ukuwonetsa magwiridwe antchito abwino kwambiri pamitundu yosiyanasiyana yaukadaulo wapamwamba wopaka, kuphatikiza FO-WLP ndi FC-BGA. Kampaniyo ili ndi mbiri yayikulu, makamaka m'magawo a semiconductor flip-chip bonders ndi Flat Panel Display (FPD) bonders.

Chidule: N’chifukwa Chiyani Muyenera Kusankha TFC-9000?

Mosiyana ndi machitidwe ena akuluakulu omwe amaika patsogolo kutsata kulondola kwambiri kuposa china chilichonse, SHIBAURA TFC-9000 ndi yankho lopangidwa bwino kuti liwongolere bwino kupanga zinthu zambiri. Opanga ma paketi akamafunafuna zida zamakono—monga FO-WLP kapena FC-BGA—zomwe zimapereka ntchito yokhazikika, zimakwaniritsa miyezo yolondola yofunikira, komanso nthawi yomweyo zimakulitsa zotulutsa pagawo lililonse, TFC-9000 imadziwika kuti ndi chisankho chodalirika komanso chotsimikizika pamsika. Imakwaniritsa kusiyana kumeneku kudzera mu luso lake labwino kwambiri, kapangidwe kake kakang'ono, komanso ukadaulo waukulu wa Shibaura pankhani yolumikizana.

Mbali TFC-9000 (SHIBAURA) Kufunika

Kuyika Pakati Pachimake Kupanga zinthu zambiri pamlingo waukulu; kumalinganiza bwino ntchito ndi kulondola Imayang'ana kwambiri pakupanga zinthu zambiri, m'malo mogwira ntchito ngati nsanja yofufuza ndi chitukuko yolondola kwambiri—chinthu chodziwika bwino pakusanthula koyerekeza.

Kulondola (Kwapafupi) ±5 µm Zimakwaniritsa zofunikira pakupanga zinthu zambiri pogwiritsa ntchito ukadaulo wapamwamba kwambiri wopangira zinthu.

Kuchita Bwino (UPH) Kufikira 7,200 Kuchuluka kwa zinthu zomwe zimapangidwa ndi anthu ambiri; kumatanthauza mwayi waukulu wopikisana.

Chizindikiro cha phazi Pafupifupi 2.5 m² Kapangidwe kakang'ono; kamakonza bwino kugwiritsa ntchito malo apansi pa fakitale.

Mapulogalamu Oyenera FO-WLP, FC-BGA Yang'anani kwambiri pa magawo omwe akukula mofulumira kwambiri mkati mwa gawo lapamwamba la ma phukusi.