SHIBAURA TFC-9000 ekyuma ekikuba ebipande

SHIBAURA MECHATRONICS TFC-9000 ye flip-chip bonder ekolebwa mu bungi nga ekoleddwa mu nkola ez’omulembe ez’okupakinga, gamba nga Fan-Out Wafer-Level Packaging (FO-WLP). Mu kifo ky’okugoberera obutuufu obusukkiridde, ku ddaala lya laboratory, ebigendererwa byayo ebikulu eby’okukola dizayini bikulembeza Productivity Enkulu n’Ekigere Ekitono, ne kigiteeka mu kifo ekituufu ku katale k’okufulumya ebintu mu bungi. Olw’okuvugibwa omuze gw’okukendeeza n’okugatta ennyo mu byuma ebikozesebwa ku ssimu, obwetaavu bw’enkola za FO-WLP bweyongera; TFC-9000 eyimiridde nga Shibaura's flagship model eyakolebwa mu ngeri ey'enjawulo okukola ku mbeera eno ey'okukozesa.

**Ebikulu ebikwata ku nkola: Okugeraageranya emirimu n'obulungi**

Ebintu bino wammanga ebikulu eby’ekikugu, ebikung’aanyiziddwa okuva mu biwandiiko ebitongole, biraga enzikiriziganya y’ekyuma wakati w’obutuufu, obulungi, n’obusobozi bw’okukwata ebintu:

**Ekifaananyi** | **Ebipimo ebikwata ku nsonga eno**

**Ekika ky'Ebyuma** | Wafer-Level Okupakinga Bonder / Bonder ya Flip-Chip

**Enkola Enkulu** | Fan-Out Wafer-Level Okupakinga (FO-WLP), Ensengekera y’omupiira ogw’omupiira ogw’okukyusakyusa (FC-BGA)

**Obutuufu bw'okuteekebwa** | Okukwatagana kw’ekitundu: ±5 μm (3σ) .

Okukwatagana kw’ensi yonna: ±7 μm (3σ)

**Okukola obulungi (UPH)** | Okukwatagana mu nsi yonna: Okutuuka ku yuniti 7,200/essaawa

Okukwatagana mu kitundu: Okutuuka ku yuniti 5,100/essaawa

**Amaanyi ag'okusiba** | Max. 50 N

**Size ya Chip ewagirwa** | Max. □26 mm

**Ensimbi ya Substrate/Wafer ewagirwa** | Wafer: φ200 / mm 300 nga bwe kiri

Substrate: Ekisinga obunene. 330 × 320 mm

**Obuwagizi bw'enkola** | Awagira enkola zombi eza Face-Up ne Flip-Chip (Face-Down); ekwatagana ne tekinologiya ow’enjawulo omuli DAF (Die Attach Film), C4 (Controlled Collapse Chip Connection), ne T/C (Thermo-Compression) okusiba.

**Ekigere** | Ekitundu kya yuniti enkulu: Nga. 2.5 m2 (Dizayini entono)

**Ebifo n'ebikulu ebikwata ku by'ekikugu**

Endowooza enkulu ey’okukola dizayini emabega wa TFC-9000 kwe kukola ku byetaago by’okufulumya ebipapula eby’omulembe ebinene, ebikola obulungi. **High-Productivity Dual-Head Configuration:** Ekyuma kino kirimu ensengeka y’emitwe ebiri, okutuuka ku bulungibwansi obusinga obunene mu kufulumya mu kigere ekitono ennyo; kikola nga quintessential embodiment y'obufirosoofo "Small Footprint & High Productivity".

**Okukwatagana kw'enkola empanvu:** Elongooseddwa naddala ku Fan-Out Wafer-Level Packaging (FO-WLP), enkola eno ekwatagana n'enkola zombi eza FO-WLP ezikulukuta-"Chip-First" ne "Chip-Last/RDL-First"-bwe kityo n'ekwatagana n'enteekateeka za tekinologiya ez'enjawulo eza bakasitoma ab'enjawulo.

**Flexible Configuration Options:** Ng’oggyeeko obusobozi bwa flip-chip bonding obwa bulijjo, ebyuma biwa okulonda okungi okwa modulo ezikola ez’okwesalirawo-nga Flux Copying ne Thick/Thin Die Pickup-okubikka ku spectrum empanvu ey’embeera z’okukozesa.

**Ebitundu by'okukozesa:** Essira liteekeddwa ku kupakinga okw'omulembe okw'omutindo omunene

TFC-9000 okusinga eteekebwa mu bifo ebinene eby’okufulumya ng’obulungi, obutuufu, n’okufuga omuwendo bye byetaagisa ebikulu.

**Fan-Out Wafer-Level Packaging (FO-WLP):** Enkola enkulu. Erongooseddwa okupakinga mu bungi chips ezisangibwa mu byuma ebikozesebwa ku ssimu —nga ssimu ez’amaanyi ne tabuleti —omuli Power Management ICs (PMICs) ne RF Front-End Modules (RF FEMs).

**Flip-Chip Ball Grid Array (FC-BGA):** Ekitundu ekirala ekikulu eky'okukozesa. Ekozesebwa okupakinga chips za kompyuta ezikola obulungi, nga CPUs, GPUs, ne AI processors.

**Wafer-to-Wafer / Substrate-to-Substrate Bonding (Chip on Wafer/Substrate):** Ewagira okuteeka chips ku 300mm wafers oba square substrates ezipima okutuuka ku 330mm x 320mm, nga zisuza enkola ez’enjawulo ez’okupakinga.

**Enkula y'akatale n'enkizo mu kuvuganya: Shibaura's Niche Market**

Mu katale k’ensi yonna akalimu ennyo bbondi za flip-chip, Shibaura ayimiridde ng’omuzannyi omukulu.

**Ekifo ky’akatale:** Akatale ka flip-chip bonder mu nsi yonna kafugibwa kkampuni nnya enkulu ezikola ebintu—Besi, ASM Pacific, Shibaura, ne Kulicke & Soffa—nga zonna awamu zikola kumpi ebitundu 70% ku mugabo gwonna ogw’akatale. Omulimu gwa Shibaura: Shibaura Mechatronics erina obumanyirivu obw’emyaka mingi obusimbye emirandira mu kisaawe ky’okukwatagana kwa flip-chip. Ebintu byayo ebya TFC biraga omulimu ogw’enjawulo mu tekinologiya ow’omulembe ow’okupakinga, omuli FO-WLP ne FC-BGA. Kkampuni eno yeewaanira ku likodi nnyingi naddala mu bitundu bya semiconductor flip-chip bonders ne Flat Panel Display (FPD) bonders.

Mu bufunze: Lwaki Londa TFC-9000?

Okwawukanako n’enkola endala enkulu ezikulembeza okugoberera obutuufu obuyitiridde okusinga byonna, SHIBAURA TFC-9000 nkola ya yinginiya entuufu okutumbula obulungi bw’okufulumya ebintu mu bungi. Abakola ebipapula bwe banoonya ebyuma ebikozesebwa mu nkola ez’omulembe —nga FO-WLP oba FC-BGA —ebiwa enkola ennywevu, etuukana n’omutindo ogwetaagisa ogw’obutuufu, era mu kiseera kye kimu n’ebisinga okuvaamu buli yuniti y’ekitundu, TFC-9000 esinga kulabika ng’akatale akakakasiddwa, akalonda eyeesigika. Etuuka ku njawulo eno okuyita mu bulungibwansi bwayo obw’enjawulo, dizayini yaayo entono, n’obukugu bwa Shibaura obw’amaanyi mu by’okusiba.

Ekintu eky'enjawulo TFC-9000 (SHIBAURA) nga bakozesa eddagala lya TFC-9000. Amakulu

Okuteeka Ebifo Ebikulu (Core Positioning). Okufulumya ebintu mu bungi mu bungi; balances efficiency n’obutuufu Essira liteekeddwa ku kukola ebintu mu bungi, okusinga okukola ng’omukutu gwa R&D ogw’obutuufu obw’amaanyi —essira erya bulijjo mu kwekenneenya okugeraageranya.

Obutuufu (Eby’omu kitundu) . ±5 μm Atuukiriza ebisaanyizo by’okufulumya ebintu mu bungi ebya tekinologiya ow’omulembe ow’okupakinga.

Okukola obulungi (UPH) . Okutuuka ku 7,200 Okufulumya okufulumya kwa waggulu mu ngeri ey’enjawulo; ekiikirira enkizo enkulu mu kuvuganya.

Ekigere Nga. 2.5 m2 Dizayini entono; optimizes enkozesa y’ebifo wansi mu kkolero.

Okusaba Okugendereddwamu FO-WLP, FC-BGA, abawandiisi b’ekibiina kya FC-BGA Essira liteekeddwa ku bitundu ebisinga okukula amangu mu kitongole ky’okupakinga eby’omulembe.