SHIBAURA TFC-9000 flip chip bonder

SHIBAURA MECHATRONICS TFC-9000 ni bonder ikora cyane yagenewe uburyo bwo gupakira, nka Fan-Out Wafer-Level Packaging (FO-WLP). Aho gukurikirana uburyo bwo gukora neza cyane, intego zayo z'ingenzi zo gushushanya zishyira imbere umusaruro mwinshi n'ikirenge gito, zibishyira ku isoko ry'ibikoresho byinshi. Bitewe n'icyerekezo cyo gukora ibintu bike no guhuza ibikoresho bigendanwa, gukenera ibikorwa bya FO-WLP biriyongera; TFC-9000 igaragara nk'icyitegererezo cya Shibaura cyagenewe by'umwihariko gukemura iki kibazo cyo gukoresha.

**Ibisobanuro by'ingenzi: Kunoza imikorere n'imikorere myiza**

Ibipimo by'ingenzi bya tekiniki bikurikira, byakusanyijwe bivuye mu makuru yemewe, bigaragaza uburinganire bw'imashini hagati y'ubuhanga, imikorere myiza, n'ubushobozi bwo gucunga ibikoresho:

**Ikiranga** | **Ibipimo birambuye**

**Ubwoko bw'ibikoresho** | Bonder yo gupakira ku rwego rwa Wafer / Bonder yo gupakira ku rukuta

**Inzira z'ingenzi** | Gupakira ku rwego rwa Fan-Out Wafer (FO-WLP), Flip-Chip Ball Grid Array (FC-BGA)

**Uburyo bwo gushyiramo ibintu neza** | Guhuza aho uherereye: ± 5 µm (3σ)

Kuboneza Isi: ± 7 µm (3σ)

**Uburyo bwo gukora neza (UPH)** | Kugena imiterere y'isi: Ibice bigera kuri 7.200 ku isaha

Guhuza aho utuye: Ibiro 5.100 ku isaha

**Imbaraga zo Guhuza** | Ntarengwa 50 N

**Ingano ya Chip** | Ntarengwa □26 mm

**Ingano y'agace k'inyuma/agace k'inyuma gashyigikiwe** | Agace k'inyuma: φ200 / 300 mm

Igice cy'ubutaka: Ntarengwa 330 × 320 mm

**Ubufasha mu Gutunganya** | Ishyigikira inzira zo mu maso no mu gukurura (Face-Down); ijyanye n'ikoranabuhanga ritandukanye ririmo DAF (Die Attach Film), C4 (Controlled Collapse Chip Connection), na T/C (Thermo-Compression).

**Ikirenge** | Ubuso bw'igice cy'ingenzi: Hafi 2.5 m² (Igishushanyo mbonera gito)

**Imyanya n'Ibisobanuro by'ingenzi bya Tekiniki**

Ihame ry'ingenzi ry'igishushanyo mbonera cya TFC-9000 ni ugutanga serivisi ku bikenerwa mu gupakira ku rwego runini kandi rufite umusaruro mwinshi. **Imiterere y'Imitwe ibiri ifite umusaruro mwinshi:** Ibi bikoresho bifite imiterere y'imitwe ibiri, bigatuma umusaruro urushaho kuba mwiza mu buryo buciriritse cyane; ni nk'icyitegererezo cy'ingenzi cya filozofiya ya "Small Footprint & High Productivity".

**Guhuza Uburyo Bugari:** Yakozwe neza cyane cyane kugira ngo ikoreshwe mu buryo bwa Fan-Out Wafer-Level Packaging (FO-WLP), iyi sisitemu ijyanye n'imikorere ya FO-WLP—"Chip-First" na "Chip-Last/RDL-First"—bityo ikaba yakira gahunda zitandukanye z'ikoranabuhanga z'abakiriya batandukanye.

**Amahitamo yo Guhindura Imiterere:** Uretse ubushobozi busanzwe bwo guhuza imashini, ibi bikoresho bitanga amahitamo menshi y’ibikoresho byihariye—nk’uburyo bwo gukoporora bwa Flux na Thick/Thin Die Pickup—kugira ngo bikoreshwe mu buryo butandukanye.

**Imiterere y'Ikoreshwa:** Yibanda ku Gupakira Binini Bigezweho

TFC-9000 ikoreshwa cyane cyane mu bikorwa binini aho imikorere myiza, ubushishozi, no kugenzura ikiguzi ari byo bisabwa cyane.

**Gupakira ku rwego rwa Feni (FO-WLP):** Porogaramu y'ingenzi. Yakozwe neza kugira ngo ipakire chip nyinshi ziboneka mu bikoresho bigendanwa—nk'amatelefone na tableti—harimo Power Management ICs (PMICs) na RF Front-End Modules (RF FEMs).

**Flip-Chip Ball Grid Array (FC-BGA):** Irindi shami rikomeye rya porogaramu. Rikoreshwa mu gupakira utumashini tw’ikoranabuhanga dukora cyane, nka CPU, GPU, na poroseseri za AI.

**Guhuza Wafer na Wafer / Substrate-to-Substrate (Chip kuri Wafer/Substrate):** Ifasha gushyira utwuma ku dupfunyika twa 300mm cyangwa substrate kare zigera kuri 330mm x 320mm, bikajyana n'ubwoko butandukanye bw'udupfunyika.

**Imiterere y'Isoko n'Ibyiza byo Guhangana: Isoko rya Shibaura rizwi cyane**

Mu isoko mpuzamahanga ryibanda cyane ku bikoresho byo kohereza imashini zitwara amashanyarazi (flip-chip bonds), Shibaura ni umukinnyi ukomeye.

**Umwanya w'Isoko:** Isoko ry'ibicuruzwa bya flip-chip ku isi ryiganjemo inganda enye zikomeye—Besi, ASM Pacific, Shibaura, na Kulicke & Soffa—bose hamwe bangana na 70% by'isoko ryose. Uruhare rwa Shibaura: Shibaura Mechatronics ifite uburambe bukomeye mu myaka myinshi mu bijyanye no guhuza ibicuruzwa bya flip-chip. Uruhererekane rw'ibicuruzwa byayo bya TFC rugaragaza imikorere idasanzwe mu ikoranabuhanga rigezweho ryo gupakira, harimo FO-WLP na FC-BGA. Iyi sosiyete ifite amateka akomeye, cyane cyane mu bijyanye n'ibicuruzwa bya flip-chip bya semiconductor na Flat Panel Display (FPD).

Incamake: Kuki wahitamo TFC-9000?

Bitandukanye n'izindi sisitemu z'ingenzi zishyira imbere gushakisha ubuhanga buhanitse kurusha ibindi byose, SHIBAURA TFC-9000 ni igisubizo cyakozwe neza kugira ngo cyongere ubushobozi bwo gukora ibintu byinshi. Iyo abakora ibikoresho byo gupakira bashaka ibikoresho byo gukora ibintu bigezweho—nk'ibijyanye na FO-WLP cyangwa FC-BGA—bitanga imikorere ihamye, byujuje ibisabwa ku buryo bunoze, kandi icyarimwe bikongera umusaruro kuri buri gice, TFC-9000 igaragara nk'amahitamo yizewe kandi yizewe ku isoko. Igera kuri iri tandukaniro binyuze mu mikorere yayo myiza, imiterere yayo mito, n'ubuhanga bukomeye bwa Shibaura mu bijyanye no guhuza ibintu.

Ikiranga TFC-9000 (SHIBAURA) Akamaro

Aho inkingi iherereye Umusaruro mu bwinshi; bihuza imikorere n'ubuhanga Yibanda ku musaruro mwinshi, aho kuba urubuga rwo gukora ubushakashatsi n’iterambere rufite ubuhanga bwo hejuru—ikintu gihuriweho mu isesengura rigereranya.

Uburyo bworoshye (Byo mu gace) ± 5 µm Yujuje ibisabwa mu gutunganya ibintu byinshi hakoreshejwe ikoranabuhanga rigezweho ryo gupakira.

Ingufu (UPH) Kugeza ku 7.200 Umusaruro mwinshi cyane; bigaragaza inyungu nyamukuru mu irushanwa.

Ikirenge Hafi metero kare 2.5 Igishushanyo mbonera gito; gikoresha neza ikoreshwa ry'aho hasi mu ruganda.

Porogaramu zigamije FO-WLP, FC-BGA Yibanze ku byiciro bikura vuba mu rwego rwo gupakira ibintu mu buryo bugezweho.