ASM flip chip bond AFC Plus

ASM AFC Plus ni uburyo bwo gukora imashini ya Flip Chip Bonder bugezweho mu ikoranabuhanga, kandi bufite ikoranabuhanga rigezweho. Mu by’ukuri, ikora nk'uburyo bubiri butandukanye—ishobora gukora imashini isanzwe yo gufunga no gufunga—izwiho ubuhanga bwayo buhamye bwa ± 1.0 µm no guhindura imikorere yayo mu buryo bukomeye. Ni amahitamo akunzwe cyane mu bushakashatsi no mu iterambere ndetse no mu gukora ibicuruzwa bigezweho ku bwinshi.

Ibisobanuro by'ingenzi: Ubuhanga bwo hejuru n'imikorere myinshi

Ikiranga | Ibisobanuro birambuye

Ubwoko bw'ibikoresho | Imashini ikora automatic Die Bonder / Flip Chip Bonder

Ubuziranenge bw'ibanze | Guhuza/Gushyiramo neza: ± 1.0 µm @ 3σ

Igihe cy'urugendo (Kuri buri munsi) | Hafi amasegonda 15

Ingano y'urufaya | Ifite uburebure bunini cyane: kuva kuri 0.1 mm kugeza kuri 20 mm

Ingano y'ifatizo/Wafer | Ishobora gufata substrates cyangwa wafers kugeza kuri mm 300 x 300

Ingufu zo Guhuza | Iragenzurwa neza, kuva kuri 10g kugeza kuri 2kg

Uburyo buhuye | - Eutectic Bonding

- Gutanga Epoxy

- Gukiza UV

- Guhuza hakoreshejwe laser

Uburyo bwo Kuboneza | Igenamiterere risanzwe rifite Kuboneza bidakoreshejwe; rishobora kuvugurura rigashyirwa kuri Kuboneza Bikora iyo ubisabye.

Uburyo bworoshye bwo guhindura ibintu bugaragazwa bute?

Urufunguzo rwa AFC Plus ruri mu miterere yayo ya modular: ishobora gukora nka Die Bonder isanzwe, ariko ishobora kongera gushyirwaho kugira ngo ikore nka Flip Chip Bonder.

Guhuza Urufunguzo: Igice cy'ingenzi gifasha imikorere ya flip-chip ni module ya "Flip Chip Option". Iyi module yemerera sisitemu guhindura die, ikayishyira uruhande rwayo rukora rureba hasi.

Ubushobozi bwo guhuza ibikoresho: Ishyigikira uburyo butandukanye bwo guhuza ibintu—harimo eutectic, epoxy dispensing, UV curing, na laser bonding—ishobora kwakira ibikoresho bitandukanye bya flip-chip.

Uburyo bworoshye bwo gukoresha: Uburyo bwo hejuru bwo gukoresha uburyo bworoshye no koroshya ibintu bituma iba imwe mu miyoboro y’amashanyarazi ikoreshwa mu buryo busanzwe ku isoko, ikaba ishobora gukwirakwira mu buryo butandukanye, kuva ku miyoboro ikoreshwa mu buryo bworoshye kugeza ku miyoboro ikoreshwa mu buryo bworoshye.

Ikoresheje ubuhanga bwayo bwo hejuru cyane n'uburyo bworoshye bwo gukora, AFC Plus ikora cyane cyane porogaramu zifite agaciro gakomeye kandi zisabwa kugira ngo ireme ry'imibanire rirusheho kuba ryiza:

Silicon Photonics: Ifite amateka akomeye mu nzego zigezweho nka transceivers z'itumanaho rya optique na moteri z'ingufu.

Packaging igezweho: Ikwiriye gukoreshwa mu gupakira ibikoresho bya semiconductor byo mu rwego rwo hejuru, harimo no guhuza 3D na die stacking.

MEMS (Sisitemu ntoya z'amashanyarazi): Ituma habaho guteranya neza kw'ibikoresho nka accelerometer na gyroscope.

Ibikoresho by'urumuri: Bikubiyemo ibikoresho bya LiDAR, VCSEL, WDM (Wavelength Division Multiplexing), microlenses, n'ibindi.

Ubushakashatsi n'Iterambere n'Ubushakashatsi: Ikoreshwa cyane mu bigo byinshi by'ubushakashatsi bigezweho na laboratwari za kaminuza bitewe n'uburyo ikora neza kandi ikora neza.

Muri make, uburyo bwo gukoresha AFC Plus butandukanye cyane n’ubwo SHIBAURA TFC-9000 yavuzwe mbere: mu gihe TFC-9000 ikora ku bwinshi, AFC Plus yihariye mu gukora ibintu bigezweho cyane, bivanze neza kandi byoroshye—ibi bikaba ari igikoresho cyiza cyo gukora ubushakashatsi no guteza imbere no gukora ibikoresho bigezweho byo gupakira no gukoresha ibikoresho by’ikoranabuhanga bigezweho.