I-ASM flip chip bonder AFC Plus

I-ASM AFC Plus yiFlip Chip Bonder ekhulileyo ngokwetekhnoloji, echanekileyo kakhulu. Ngokwenyani, isebenza njengenkqubo yeenjongo ezimbini eguquguqukayo—ekwaziyo zombini i-die bonding esemgangathweni kunye ne-flip-chip bonding—eyaziwa ngokuchaneka kwayo okuzinzileyo kwe-±1.0 µm kunye nokuguquguquka kwenkqubo. Lukhetho oludumileyo kakhulu kwizicelo ze-R&D kunye nemveliso ephantsi yeemveliso eziphezulu.

Iinkcukacha ezingundoqo: Ukuchaneka okuphezulu kunye nokusebenza okuninzi

Uphawu | Inkcazo eneenkcukacha

Uhlobo lweZixhobo | I-Die Bonder eZenzekelayo ngokupheleleyo / i-Flip Chip Bonder

Ulungelelwaniso lweCore | Ukuchaneka koLungelelaniso/ukubekwa: ±1.0 µm @ 3σ

Ixesha lomjikelo (Ngomntu ngamnye) | Malunga nemizuzwana eli-15

Ubungakanani bokufa | Uluhlu olubanzi kakhulu oluxhaswayo: ukusuka kwi-0.1 mm ukuya kwi-20 mm

Ubungakanani beSubstrate/Wafer | Iyakwazi ukuphatha iisubstrates okanye iiwafers ukuya kuthi ga kwi-300 x 300 mm

Uluhlu lwamandla okubopha | Ilawuleka kakuhle, ukusuka kwi-10g ukuya kwi-2kg

Iinkqubo Ezihambelanayo | - Eutectic Bonding

- Ukusasazwa kwe-Epoxy

- Unyango lwe-UV

- Ukubopha ngeLaser

Indlela Yokulungelelanisa | Uqwalaselo oluqhelekileyo luneempawu zolungelelwaniso olungasebenziyo; lunokuhlaziywa lube yi-Active Alignment xa luceliwe.

Kubonakaliswa njani ukuguquguquka kwayo?

Eyona nto iphambili kwi-AFC Plus ikuyilo lwayo lweemodyuli: inokusebenza njengeDie Bonder eqhelekileyo, kodwa inokulungiswa kwakhona ukuze isebenze njengeFlip Chip Bonder.

Ukuhlanganiswa kweZixhobo: Icandelo eliphambili elivumela ukusebenza kwe-flip-chip yimodyuli ethi "Flip Chip Option". Le modyuli ivumela inkqubo ukuba ijike idaye, iyibeke icala layo elisebenzayo lijonge ezantsi.

Ukuhambelana kwezinto: Ixhasa uluhlu olubanzi lweenkqubo zokubopha—kuquka i-eutectic, i-epoxy dispensing, i-UV curing, kunye ne-laser bonding—ivumela izixhobo ezahlukeneyo ze-flip-chip.

Ukuguquguquka Okuphezulu: Inqanaba layo eliphezulu lokuguquguquka kunye nokuguquguquka kwenza ukuba ibe yenye yezona bondi ze-die eziguquguqukayo ezikhoyo ngoku kwimarike, ezikwaziyo ukugubungela uluhlu olubanzi lweemeko zokuhlanganiswa, ukusuka kwi-die-to-wafer ukuya kwi-die-to-substrate bonding.

Isebenzisa ukuchaneka kwayo okuphezulu kakhulu kunye nokuguquguquka kwenkqubo, i-AFC Plus ngokuyintloko ikhonza usetyenziso olunexabiso eliphezulu kunye neemfuno ezingqongqo zomgangatho wokubopha:

I-Silicon Photonics: Iyazingca ngerekhodi yayo ephambili kwiinkalo eziphambili ezifana nee-transceivers zonxibelelwano lwe-optical kunye neenjini ze-optical.

Ukupakisha Okuphambili: Kufanelekile usetyenziso lokupakisha lwe-semiconductor oluphezulu, kubandakanya ukuhlanganiswa kwe-3D kunye nokudibanisa i-die stacking.

I-MEMS (iiNkqubo zeMicro-Electro-Mechanical): Ivumela ukuhlanganiswa ngokuchanekileyo kwezinzwa ezifana nee-accelerometers kunye nee-gyroscopes.

Izixhobo Zokubona: Ziquka iiLiDAR, iiVCSEL, izixhobo zeWDM (Wavelength Division Multiplexing), iilensi ezincinci, nokunye.

I-R&D kunye nePrototyping: Isetyenziswa kakhulu kwiindawo ezininzi zophando eziphambili nakwiilabhoratri zeyunivesithi ngenxa yokuguquguquka kwayo okugqwesileyo kunye nokuchaneka.

Ngamafutshane, iimeko zokusetyenziswa kwe-AFC Plus zahluke kakhulu kwezo ze-SHIBAURA TFC-9000 ebekuthethwe ngazo ngaphambili: ngelixa i-TFC-9000 ijongene nokuveliswa okukhulu, i-AFC Plus igxile ekuveliseni ngokuchanekileyo okuphezulu, ukuxuba okuphezulu, kunye nokuguquguquka—okwenza ibe sisixhobo esifanelekileyo sophando nophuhliso kunye nokuveliswa kwezixhobo eziphambili zokupakisha kunye nezixhobo ze-optoelectronic ezisemgangathweni.