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EKHAYA>Izixhobo zeSemiconductor > I-Bonder >
Fully automatic die bonding and flip chip system AD838L plus

Ukuzibophelela okuzenzekelayo ngokupheleleyo kunye nenkqubo ye-chip chip AD838L kunye

I-AD838l kunye ne-disk bonding ezenzekelayo ezenzekelayo kunye ne-flip chip inkqubo ye-high-chane kwaye i-high-effective die bonding izixhobo, isetyenziselwa ukuveliswa kwe-automated ye-semiconductor ukupakishwa kunye ne-flip chips. Inkqubo inolu phawu lulandelayo

Ilizwe:Isetyenzisiwe Ikhona: yiba Iwaranti: ubonelelo

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UQHAGAMSHELWANO OLUKHE NGOKUKHAWULEZANcokola kwi-WhatsAppImpendulo ekhawulezileyo kwimizuzu embalwa I-RFQ ENOLWAZISithumelele i-imeyilesmt-sales3@gdxinling.cn
Iinkcukacha

Intshayelelo eneenkcukacha:

AD838L-plus

Ukuzibophelela okuzenzekelayo ngokugqibeleleyo kunye nenkqubo ye-chip chip


■Uhlobo olulodwa lomthwali wokukwazi ukuphatha izixhobo, ingakumbi ezilungele i-8'' eethe-ethe kunye ne-scratch-prone substrates.


■ Inkqubo yeteknoloji yeZhuanli, +25μm/+15um_phezulu ukuchaneka kusenokugcina umthamo wemveliso weyure ophezulu we-12K/H.


■ Ukukwazi ukuphatha izinto ezizenzekelayo (ukhetho)


■Isixokelelwano esisicaba esizenzekelayo sokulayisha kunye nokukhulula (ukhetho)


■ Imilomo yokutshintsha okuzenzekelayo 4 (ukhetho)


■Ikhono lokuqhuba itshiphu yeFC (uyazikhethela)


■tshiza idiski yeglu xa utshiza kwangaphambili (uyazikhethela)


■ 1 isifundi sebhakhowudi (ukhetho), kwi-intanethi (ukhetho)


■ Inkxaso yesondlo esibuyela umva ukuphatha iimveliso zokupakisha ezixubeneyo


■ Isixokelelwano seglu eqhutywa yinjini ye-XY ephindwe kabini, esetyenziselwa intlama yesilivere eyahlukeneyo, iglu eziziqhubela phambili okanye ezingaqhubekiyo.


■ Isixokelelwano sengalo esijikelezayo sokuwelda sithatha indawo yetshiphu yokulungiswa kwetafile ejikelezayo

 

 

 


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