i-ave ukuya kuthi ga kwi-70% kuMacandelo e-SMT - KwiSitokhwe & Ukulungele ukuThunyelwa
Fumana iQuote →Uphawu oluhlala luhleli olunemilinganiselo ephezulu yeewafers, iipakethe ze-semiconductor, iimodyuli, kunye nezixhobo ze-elektroniki. Yakhelwe ukulandeleka, ukufundeka kwekhowudi, ukuveliswa ngokuzenzekelayo, kunye nokuchongwa kwesixhobo okuthembekileyo.
Ukumakisha nge-laser kunceda abavelisi ukuba benze amanqaku ahlala ixesha elide nafundekayo kwiiwafers, iipakethe, iimodyuli, kunye nezinto ezisetyenziselwa ukulandelelwa nokulawula imveliso.
Phawula ii-wafers, iipakethe, okanye izixhobo ngeekhowudi zeData Matrix, iikhowudi zeQR, iinombolo zeserial, iinombolo zebatch, iilogo, kunye neefomathi zokuchonga ezenziwe ngokwezifiso.
Ukumakishwa nge-laser kudala iimpawu ezicocekileyo nezifundekayo ezixhasa ukuhlolwa, ukuhlelwa, ukulandelwa kwemveliso, kunye nokuchongwa okusezantsi.
Le nkqubo ingasetyenziswa kwiindawo zemveliso ezizimeleyo okanye ezingaphakathi kwaye inokuxhasa ukulayisha ngokuzenzekelayo, ukuveliswa kwekhowudi, kunye nonxibelelwano lwedatha.
Hlola izixhobo ezikhoyo zokumakisha i-wafer, ukumakisha iipakeji, ukukhowuda iData Matrix, ukulandeleka, kunye nokuchongwa komgca wemveliso ye-semiconductor.
Ukumakishwa kwelaser kuxhasa ukuchongwa kwemveliso okuthembekileyo ngaphandle kweelebheli, i-inki, okanye ukumakishwa okusekelwe kuqhagamshelwano. Kufanelekile kwimveliso ye-semiconductor ephezulu apho ukufundeka nokulandeleka kubalulekile.
Landelela i-wafer nganye, iphakheji, imodyuli, okanye isixhobo ngokuvelisa, ukuvavanya, ukupakisha, ukuthunyelwa, kunye nolawulo lomgangatho emva kokuthengisa.
Iimpawu zihlala zifundeka ngexesha lokuphathwa, ukuvavanywa, ukupakishwa, kunye nokusetyenziswa kwemveliso ixesha elide.
Ixhasa ukuveliswa kwekhowudi ngokuzenzekelayo, ukuhlolwa kombono womatshini, ukulayisha ngaphakathi, kunye nonxibelelwano lwedatha neenkqubo zemveliso.
Ifanelekile kwimveliso enkulu yeepakethe ze-semiconductor, iimodyuli ze-elektroniki, kunye nezixhobo ezichanekileyo.
Lo matshini ungalungiselelwa izinto ezahlukeneyo zokumakisha kwimveliso ye-semiconductor kunye ne-elektroniki.
I-Wafer ID, ikhowudi yebhetshi, ikhowudi yokulandelela, kunye nokuchongwa kwenkqubo.
Ukumakishwa kwephakheji ye-BGA, QFN, QFP, SOP, CSP, kunye nezixhobo ezinxulumene noko.
Ukumakishwa kwelaser kwiimodyuli zamandla, iisensa, iimodyuli zeMEMS, kunye neendibano.
Ukuchongwa kokugqibela, ukulandelwa kwemveliso, kunye nokulandelelwa kokuthunyelwa.
Uqwalaselo olufanelekileyo lunokukhethwa ngokwezinto ezisetyenzisiweyo kwiphakheji, ubungakanani, ukugqitywa komphezulu, kunye neemfuno zokumakisha.
Izixhobo ezahlukeneyo zifuna imithombo eyahlukeneyo yelaser. Ukukhetha ilaser efanelekileyo kunceda ukuphucula ukungafani, ukunciphisa impembelelo yobushushu, kunye nokukhusela umgangatho wesixhobo.
| Itekhnoloji yeLaser | Engcono Kwi | Ukusetyenziswa Okuqhelekileyo |
|---|---|---|
| IFayibha Laser | Imiphezulu yesinyithi kunye nezinye izinto zokupakisha | Iikhowudi zephakheji, izinto zesinyithi, iinombolo zokulandelelana, kunye nokuchonga okuhlala ixesha elide. |
| I-UV Laser | Izinto ezinobuthathaka kunye nokumakishwa okuncinci | Ukuphawula okunemilinganiselo ephezulu kunye nefuthe eliphantsi lobushushu kwizixhobo ezibuthathaka. |
| I-Laser eluhlaza | Ukumakisha ngokuchanekileyo kunye nezixhobo ezikhethekileyo | Uphawu olucacileyo apho kufuneka khona ukufunxwa kwamandla okulawulwayo. |
| CO₂ Laser | Izinto zokupakisha zeplastiki nezendalo | Ukuphawula kwiindawo ezifanelekileyo zeplastiki kunye nezinto ezingezizo ezesinyithi. |
Lo matshini ungadityaniswa neendlela zokupakisha kunye nokuvavanya imisebenzi ye-semiconductor ukuxhasa ukuchongwa okuqhubekayo kunye nokulandelela umgangatho.
Ukumakisha nge-laser kunceda ukutshintsha ukuchongwa okusekelwe kwisandla okanye kwileyibhile okungazinzanga ngokuphawula okuqinileyo, okuzenzakalelayo, nokufundekayo.
Sinceda abathengi bafumane oomatshini bokumakisha i-laser ye-semiconductor abafanelekileyo ngokusekwe kuhlobo lwephakheji, ifomathi yokumakisha, uvakalelo lwezinto ezibonakalayo, imveliso ephumayo, kunye neemfuno zokudibanisa imveliso.
Inkxaso yethu igxile ekufaniseni oomatshini ngendlela esebenzayo, ukujonga ukufumaneka ngokukhawuleza, kunye nokufunyanwa kwezixhobo ze-semiconductor ezikwindawo enye.
Ubonelelo oluguquguqukayo loomatshini abakhoyo, iinkqubo ezisetyenzisiweyo, kunye nezixhobo ezihlaziyiweyo ngokwebhajethi yakho.
Cebisa uqwalaselo olufanelekileyo ngokwezinto ezikwiphakheji, uhlobo lwekhowudi, indawo yokumakisha, kunye nesiphumo.
Ukumakishwa kwelaser kunokufumaneka kunye nee-die bonders, ii-wire bonders, ii-plasma cleaners, i-AOI, kunye nee-test handlers.
Inkxaso yokupakisha izixhobo, amaxwebhu okuthumela ngaphandle, kunye nokuthunyelwa kwamanye amazwe.
Umatshini ofanelekileyo uxhomekeke kwizinto zesixhobo, uhlobo lwephakheji, umxholo wokumakisha, ubungakanani bekhowudi, imfuneko yomahluko, ixesha lomjikelo, inqanaba lokuzenzekela, kunye nokuhlanganiswa komgca wemveliso.
Sithumelele uhlobo lwephakheji yakho, isampuli yokumakisha, ifomathi yekhowudi, kunye nomthamo wemveliso. Siza kukunceda ukujonga izixhobo ezifanelekileyo ezikhoyo.
Yinkqubo yokuphawula esetyenziselwa ukudala ukuchongwa okusisigxina kwiiwafers, iipakethe ze-semiconductor, iimodyuli, kunye nezixhobo ze-elektroniki.
Iifomathi eziqhelekileyo ziquka iikhowudi zeData Matrix, iikhowudi zeQR, iibhakhowudi, iinombolo zeserial, iinombolo zebatch, iilogo, kunye noonobumba abakhethekileyo.
Ewe. Oomatshini bokumakisha nge-laser ye-semiconductor badla ngokusetyenziswa kwiikhowudi zeData Matrix ezincinci nezinomahluko omkhulu ezixhasa ukulandeleka.
Ngomthombo welaser ochanekileyo, amandla, isantya, ukugxila, kunye noseto lwenkqubo, ukumakisha kunokulawulwa ukunciphisa impembelelo yobushushu kunye nokukhusela umphezulu wesixhobo.
Iindidi zeepakeji eziqhelekileyo ziquka i-BGA, i-QFN, i-QFP, i-SOP, i-TSOP, i-CSP, i-MEMS, izixhobo zamandla, ii-wafers, iimodyuli, kunye nezixhobo ze-semiconductor ezinxulumene nazo.
I-laser yefayibha idla ngokusetyenziselwa ukuphawula ngesinyithi okanye ixesha elide, ngelixa i-laser ye-UV ifanelekile kwizixhobo ezibuthathaka kunye nokuphawula okuncinci okunefuthe elincinci lobushushu.
Iinkqubo ezininzi zinokuxhasa unxibelelwano lwedatha, ukuveliswa kwekhowudi ngokuzenzekelayo, ukulungelelaniswa kombono, kunye nokuhlanganiswa kwemigca yemveliso kuxhomekeke kuqwalaselo.
Kuya kufuneka uqwalasele uhlobo lwephakheji, umphezulu wezinto, ifomathi yekhowudi, umahluko wokuphawula, i-throughput, indlela yokulayisha, inqanaba lokuzenzekelayo, kunye neemfuno zokudibanisa.
Sithumelele uhlobo lwephakheji yakho, ifomathi yokumakisha, umphezulu wezinto, ubungakanani bekhowudi, kunye nomthamo wemveliso. Siza kukunceda ujonge iindlela ezifanelekileyo zezixhobo ezikhoyo.
Kutheni abantu abaninzi bekhetha ukusebenza ngeGeekValue?
Uphawu lwethu lusasazeka ukusuka kwisixeko ukuya kwisixeko, kwaye abantu abangenakubalwa bandibuze, "Yintoni iGeekValue?" Ivela kumbono olula: ukuxhobisa ukusungulwa kweTshayina ngetekhnoloji ye-cutting-edge. Lo ngumoya wokuziphucula okuqhubekayo, ofihliweyo ekusukeleni kwethu iinkcukacha ezingayekiyo kunye nolonwabo lokugqithisa ebesikulindele ngalo lonke unikezelo. Obu buchule bobugcisa obuphantse bugqithise kunye nokuzinikela akukona nje ukuzingisa kwabaseki bethu, kodwa kunye nokubaluleka kunye nokufudumala kwe-brand yethu. Siyathemba ukuba uza kuqala apha kwaye usinike ithuba lokudala imfezeko. Masisebenze kunye ukwenza ummangaliso olandelayo othi "zero defect".
IinkcukachaQhagamshelana nengcali yokuthengisa
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