Umatshini wokuMakisha we-ThinkLaser SigmaClean Wafer Laser

I-ThinkLaser SigmaClean yinkqubo yokumakisha yelaser ezenzekelayo ngokupheleleyo "ethambileyo" eyenzelwe ngokukodwa ii-wafers ze-100mm ukuya kwi-200mm, ehambelana ngokupheleleyo nemigangatho yegumbi lokucoca leKlasi 1. Umsebenzi wayo ophambili kukusebenzisa itekhnoloji yelaser enelungelo lobunikazi ukubonelela ii-wafers ze-semiconductor ngeempawu ezisebenzayo, ezihlala ixesha elide, nezifundeka lula—ngaphandle kokuvelisa ungcoliseko lwamasuntswana—ngaloo ndlela ivumela ukulandeleka ngokuzenzekelayo kuyo yonke i-wafer lifecycle.

**Imigaqo yoBugcisa**

Amandla aphambili eSigmaClean akwitekhnoloji yayo ecocekileyo elawulwa ngumthombo kunye noyilo lwayo oluzinzileyo nolucwangcisiweyo lwezixhobo.

**Iteknoloji yeSuperSoftMark® enelungelo lobunikazi:** Le yindlela ephambili yokwahlulahlula iSigmaClean kwezinye izixhobo. Ngokulawula ngokuchanekileyo amandla elaser, ifikelela kuphawu "olungenazo iinkunkuma". Olu phawu lususa ngokusisiseko umngcipheko wongcoliseko lweenxalenye, luvumela inkqubo ukuba isetyenziswe ngokukhuselekileyo kwiindawo zokwenza izinto zeFront-End of Line (FEOL) apho iimfuno zococeko zingqongqo kakhulu.

**I-Laser ye-Solid-State ePomped Diode eZinzileyo kakhulu:** Le nkqubo isebenzisa i-solid-state laser epomped diode enelungelo elilodwa lomenzi ephawulwe ngokuqina kwe-pulse-to-pulse okugqwesileyo. Oku kuqinisekisa ukuhambelana okuphezulu kubunzulu kunye nokujikeleza kwechaphaza ngalinye eliphawulweyo, ngaloo ndlela kuqinisekisa uzinzo kunye nokuphindaphindwa komgangatho wokuphawula.

**Iinkqubo zeRobust Optical kunye ne-Automation:** Lo matshini wonke unoyilo oluzenzekelayo ngokupheleleyo, uxhasa iiprotokholi zonxibelelwano lwe-SECS II/GEM factory automation, kwaye udibana ngokungenamthungo neenkqubo zokuphatha ii-wafer ezizenzekelayo, ezifana nee-wafer pods ze-SMIF (Standard Mechanical Interface).

**Iingenelo eziphambili kunye neempawu**

Iingenelo zeSigmaClean zidlulela ngaphaya kwamandla ayo okuphawula aphambili ukuya kwixabiso elibonakalayo elinika izityalo zokwenza iiwafer.

**Ucoceko Olungenakuthelekiswa Nanto:** Iyahambelana neemfuno zokuhambelana kwegumbi lokucoca leKlasi 1 (i-International Standard ISO Class 3), nto leyo eyenza ukuba ibe lolona khetho lukhethwayo kwizityalo zokwenza ii-wafer zeFront-End (Fabs) ezinemigangatho yokusingqongileyo ecocekileyo kakhulu.

**Ukusebenza Okuphezulu Nokusebenza Kakuhle Kweendleko:** Inkqubo yokumakisha ethambileyo—eyenzelwe ngokukodwa ukuphawula iiwafers ezicociweyo kwiindawo zokucoca kwaye ngoku ezisemgangathweni weshishini—isetyenziswa yile nkqubo ukubonelela ngesisombululo esingabizi kakhulu.

**Umgangatho Wokuphawula Ongaguqukiyo kunye Nokulandelela:** Ukuzinza kwe-pulse ye-laser okugqwesileyo ngundoqo ekufezekiseni ubunzulu obufanayo bamachaphaza kunye nokujikeleza, into ebalulekileyo ekunyuseni amazinga okuqatshelwa kweenkqubo zokubona komatshini ezilandelayo (Optical Character Recognition, OCR). Kwangaxeshanye, inkqubo idala amanqaku ahlala ehleli, afundekayo, ebonelela ngokulandelela kuwo onke amanqanaba emveliso.

Ukuguquguquka Okubanzi Kokusetyenziswa: Amaqela amaninzi eempawu anokubekwa kuyo nayiphi na indlela kumphezulu we-wafer, apho iindawo zokuphawula zithintelwe kwindawo ejikelezileyo ngaphakathi kwe-25 mm ukusuka kumphetho we-wafer.

Iinkcukacha kunye nokusebenza/ukugcinwa

Udidi lweeNkcukacha | Iiparameter ezineenkcukacha kunye neNkcazelo

Uhlu lwezixhobo | Ngokuzenzekelayo ngokupheleleyo, i-ISO 3 / iCandelo 1 lokucoca lihambelana negumbi lokucoca, Inkqubo yokuMakisha ethambileyo yeWafer eyi-100–200 mm

Ubungakanani beWafer | Inkxaso eqhelekileyo ye-100 mm – 200 mm (4–8 intshi)

Uhlobo lweLaser | ILaser yeSigma100 IR Diode-Pumped Solid-State

Iteknoloji yokuMakisha | I-SuperSoftMark® enePatent (UkuMakisha okuthambileyo okungenankunkuma)

Indawo Yokuphawula | Naluphi na ulwalathiso olungaphakathi kwendawo ejikelezileyo engama-25 mm kumphetho we-wafer

Ujongano loNxibelelwano | I-SECS II/GEM, Ujongano loMsingathi oluqhelekileyo lwe-SEMI

Uthutho/Ikhasethi | Izikhululo zeKhasethi ezi-3 ezivulekileyo; I-adaptha yePod ye-SMIF ye-200 mm enokukhetha kuyo

Iimpawu Ongazikhetha | Ukufundwa kwe-OCR/Barcode kunye nokuMakishwa kwakhona

Inkqubo yeSoftware | Ujongano lomsebenzisi olusekwe kwiWindows®

Ukuthobela imithetho kunye nesiqinisekiso | Ihambelana ne-SEMI S2/S8, CE, kunye neminye imigangatho

Ubonelelo lwaMandla kunye noMoya | Ubonelelo lwaMandla oluQhelekileyo lweSizini oluyiSigaba esinye se-220V kunye noMoya oCocekileyo oQinisekisiweyo

I-SigmaClean nayo yenzelwe ukugcinwa lula engqondweni:

**Ukulula Kokugcinwa:** Uyilo lwenkqubo luququzelela ukugcinwa okulula kwemihla ngemihla; ukujonga rhoqo—njengokucoca iilensi—kunokugqitywa malunga nemizuzu emi-5. Ngaphezu koko, izixhobo zinezakhono zokuzixilonga ngokuzenzekelayo zemihla ngemihla kwaye zibonelela ngesikhokelo esicacileyo senkqubo yokugcinwa kwimeko yempazamo, ngaloo ndlela ziququzelela ukugcinwa okucwangcisiweyo okuqalwe ngumsebenzisi.

**Ukhuseleko kunye nokuCoceka:** Uyilo lomatshini ngokubanzi luhambelana nemigangatho yokhuseleko yamazwe ngamazwe (umz., i-SEMI S2/S8, CE, njl.njl.) kwaye luxhotyiswe ngenkqubo edibeneyo yokukhupha uthuli, nto leyo eqinisekisa ngakumbi ukhuseleko kunye nococeko lwendalo yemveliso.

**Imisebenzi ephambili kunye neemeko zokusetyenziswa**

**Ukwenziwa kweWafer ePhambili:** Ifanelekile kwiiwafer ezenziwe ngezinto ezifana nesilicon, iSiC, kunye neGaAs, ezinobukhulu obuqala kwi-100mm ukuya kwi-200mm. Ngokukrola isichazi esahlukileyo ngexesha lokuqala kwemveliso, inkqubo ivumela ukulandeleka komgangatho ukusuka ekuqaleni ukuya ekupheleni kunye noLawulo lweNkqubo yeStatistical (SPC).

**Ukupakisha Okuphambili:** Ibonelela ngee-ID ezibalulekileyo zokulandelela ngaphakathi kweenkqubo ze-Wafer-Level Packaging (WLP) okanye ze-Reconstituted Wafer.

**Imveliso ye-R&D kunye ne-Small-Batch:** Uyilo lwayo oluguquguqukayo noluzenzekelayo lwenza ukuba ifaneleke kakhulu kwiindawo ze-R&D kunye nemveliso yovavanyo ebonakaliswa kukuveliswa okuxutyiweyo okuphezulu, okunomthamo omncinci.

**Isishwankathelo kunye noThelekiso**

Ngamafutshane, iThinkLaser SigmaClean sisixhobo esifikelela kwimigangatho ephambili kushishino ngokubhekiselele kucoceko, uzinzo, kunye nokuzisebenzela. Ngokusebenzisa iteknoloji yayo enelungelo lobunikazi iSuperSoftMark®, isombulula ngempumelelo indawo ebuhlungu—ukungcola kwamasuntswana—okuhlala kunxulunyaniswa neendlela zemveli zokumakisha, ngaloo ndlela izimisa njengophawu kwicandelo “lokumakisha okuthambileyo” kwiiwafers ezi-4 ukuya kwezi-8 intshi. Ukuze ufumane ukuqonda okucacileyo kwendawo ekuyo ngaphakathi komgca wemveliso, nceda ujonge kuthelekiso olulandelayo ne-SC300—esinye isixhobo sokumakisha okuthambileyo:

**Impawu** | **SigmaClean** | **SC300**

**Ukubekwa kwindawo ephambili** | Inkqubo yokumakisha ethambileyo ezenzekelayo ngokupheleleyo kwiiwafers eziyi-100–200mm (4–8-intshi) | Inkqubo yokumakisha ethambileyo ezenzekelayo ngokupheleleyo kwiiwafers eziyi-300mm (12-intshi)

**Ukusetyenziswa kweMarike** | Ijolise kwiifektri ze-semiconductor wafer kunye nezakhiwo zokupakisha eziphatha ii-wafers ezincinci eziziisentimitha ezi-8; isebenza njengesisombululo esiphambili kweli candelo lemarike | Yamkelwe kakhulu yiyo yonke i-300mm Integrated Device Manufacturers (IDMs) kunye nee-wafer foundries.

**Iimpawu zobugcisa** | Ihambelana negumbi lokucoca leKlasi 1; isebenzisa itekhnoloji yeSuperSoftMark® enelungelo lobunikazi ukufezekisa uphawu olungenazinkunkuma | Ikwasebenzisa itekhnoloji yokuphawula okuthambileyo, ebonelela ngokuhambelana okufunekayo, ucoceko, umgangatho wokuphawula, kunye nokuthembeka okufunekayo kwimveliso yobunzima be-300mm

**Inkqubo yoThutho** | Iqhele ukwenziwa ngeesitishi zekhasethi ezivulekileyo ezi-3; ii-SMIF pods ziyafumaneka njengokhetho | Iqhele ukuhambelana nee-Front-Opening Unified Pods (FOUPs); ixhasa iinkqubo ze-OHT (Overhead Hoist Transport)

**Imeko yoShishino** | Isisombululo esiphambili kushishino sokuphawula okuthambileyo kwe-wafer ye-intshi ezi-4–8 | Umgangatho kushishino wokuphawula okuthambileyo kwi-wafer fabs ye-300mm, enesiseko esikhulu esifakiweyo (ngaphezulu kweeyunithi ezili-140)