ThinkLaser SigmaEkyuma ekiyonjo ekya Wafer Laser Marking Ekyuma

ThinkLaser SigmaClean nkola ya layisi ekola mu bujjuvu "soft-marking" eyakolebwa naddala ku wafers za mm 100 okutuuka ku mm 200, nga etuukana mu bujjuvu n'omutindo gwa Class 1 cleanroom. Omulimu gwayo omukulu kwe kukozesa tekinologiya wa layisi alina patent okusobola okuwa wafers za semiconductor obubonero obulungi, obuwangaala, era obusomebwa ennyo —nga tewali bucaafu bwa butundutundu —bwe kityo ne kisobozesa okulondoola mu ngeri ey’otoma mu bulamu bwonna obwa wafer.

**Emisingi gy'ebyekikugu**

Amaanyi ga SigmaClean amakulu gali mu tekinologiya waayo omuyonjo afugibwa ensibuko n’ensengeka yaayo ey’ebyuma ebinywevu, ekoleddwa mu ngeri entuufu.

**Tekinologiya wa SuperSoftMark® alina patent:** Kino kye kikulu eky’enjawulo ekyawula SigmaClean ku byuma ebirala. Nga efuga bulungi amaanyi ga layisi, etuuka ku bubonero obw'amazima "Debris-Free". Ekintu kino mu musingi kimalawo obulabe bw’obucaafu bw’obutundutundu, ekisobozesa enkola eno okuteekebwa mu ngeri ey’obukuumi mu mbeera z’amakolero eza Front-End of Line (FEOL) ng’ebyetaago by’obuyonjo bikakali nnyo.

**Highly Stable Diode-Pumped Solid-State Laser:** Enkola eno ekozesa layisi ya patented diode-pumped solid-state emanyiddwa olw’obutebenkevu obw’enjawulo okuva ku pulse-to-pulse. Kino kikakasa okukwatagana okw’amaanyi mu buziba n’okwetooloola kwa buli katundu akassiddwako akabonero, bwe kityo ne kikakasa okutebenkera n’okuddiŋŋana kw’omutindo gw’okussaako akabonero.

**Robust Optical and Automation Systems:** Ekyuma kyonna kirimu dizayini ya otomatiki mu bujjuvu, kiwagira SECS II/GEM factory automation communication protocols, era kikwatagana bulungi n’enkola enkulu ez’okukwata wafer ez’obwengula, nga SMIF (Standard Mechanical Interface) wafer pods.

**Ebirungi Ebikulu n'Ebirimu**

Ebirungi bya SigmaClean bisukka ku busobozi bwayo obw’omulembe obw’okussaako obubonero okutuuka ku muwendo ogulabika gw’etuusa mu makolero agakola wafer.

**Obuyonjo obutafaananako:** Butuukana n’ebisaanyizo by’okukwatagana n’ekisenge ekiyonjo ekya Class 1 (International Standard ISO Class 3), ekigifuula eky’okulonda ekisinga obulungi eri ebyuma ebikola wafer ebya Front-End (Fabs) ebirina omutindo gw’obutonde obuyonjo ogwetaagisa ennyo.

**High Throughput and Cost-Effectiveness:** Enkola y’okussaako obubonero obugonvu —eyakolebwa naddala okussaako akabonero ku wafers ezirongooseddwa mu mbeera z’ebisenge ebiyonjo era kati omutindo gw’amakolero —ekozesebwa enkola eno okusobola okuwa eky’okugonjoola ekizibu ekitali kya ssente nnyingi.

**Omutindo gw’okussaako obubonero ogukwatagana n’okulondoola:** Okutebenkera kw’okukuba okw’enjawulo okwa layisi kye kisumuluzo ky’okutuuka ku buziba bw’ennyiriri n’okwetooloola okwa kimu, ensonga enkulu mu kwongera emiwendo gy’okutegeera enkola z’okulaba kw’ekyuma eziddako (Optical Character Recognition, OCR). Mu kiseera kye kimu, enkola eno ekola obubonero obw’olubeerera, okusoma, nga buwa okulondoola mu buli mutendera gwonna ogw’okufulumya.

Okukyukakyuka okw’amaanyi mu kukozesa: Ebibinja by’obubonero ebingi bisobola okuteekebwa mu ngeri yonna ku ngulu wa wafer, ng’ebifo ebiteekebwako obubonero bikoma ku zoni ey’enkulungo mu mm 25 okuva ku bbali wa wafer.

Ebikwata ku & Enkola/Okuddaabiriza

Ekika ky'okulaga | Detailed Parameters & Ennyonnyola

Ensengeka y'Ebyuma | Ekola mu bujjuvu, ISO 3 / Class 1 Ekwatagana n’ekisenge ekiyonjo, 100–200 mm Wafer Soft Marking System

Sayizi ya Wafer | Obuwagizi obwa mutindo ku mm 100 – mm 200 (yinsi 4–8) .

Ekika kya Layisi | Sigma100 IR Diode-Pamped Layisi ey’embeera enkalu

Tekinologiya w'okussaako obubonero | SuperSoftMark® eriko patent (Okussaako obubonero obugonvu obutaliimu bifunfugu)

Ekifo Ekiteekebwako obubonero | Okulaga kwonna munda mu zoni ya mm 25 ey’enkulungo ku bbali wa wafer

Enkola y'empuliziganya | SECS II/GEM, Enkola y’okukyaza ey’omutindo gwa SEMI

Entambula/Kaseti | 3 Siteegi za Kaseti eziggule; Adapter ya SMIF Pod eya mm 200 ey’okwesalirawo

Ebintu eby'okwesalirawo | Okusoma OCR/Barcode n’okuddamu okussaako obubonero

Enkola ya Sofutiweya | Enkola y’Omukozesa eyesigamiziddwa ku Windows®

Okugoberera & Okukakasa | Egoberera omutindo gwa SEMI S2/S8, CE, n’emirala

Amasannyalaze N'empewo | Standard Industrial Single-Phase 220V Amasannyalaze n’empewo ennyonjo enyigirizibwa

SigmaClean nayo ekoleddwa nga etunuulidde obwangu bw’okuddaabiriza:

**Obwangu bw'okuddaabiriza:** Enteekateeka y'enkola eyamba okulabirira okwangu okwa buli lunaku; okukebera okwa bulijjo —nga okuyonja lenzi —kusobola okumalirizibwa mu ddakiika nga 5. Ekirala, ebyuma bino birina obusobozi obw’okwekebejja buli lunaku mu ngeri ey’otoma era biwa obulagirizi obutegeerekeka obw’enkola y’okuddaabiriza singa wabaawo ensobi, bwe kityo ne kyanguyiza okuddaabiriza okutegekeddwa okutandikibwawo omukozesa.

**Obukuumi n’obuyonjo:** Okutwalira awamu dizayini y’ekyuma etuukana n’omutindo gw’ensi yonna ogw’obukuumi (okugeza, SEMI S2/S8, CE, n’ebirala) era nga kirimu enkola ey’okuggya enfuufu ekwataganye, okwongera okukakasa obukuumi n’obuyonjo bw’embeera y’okufulumya.

**Emirimu emikulu n'embeera z'okukozesa**

**Okukola Wafer mu maaso:** Esaanira wafers ezikoleddwa mu bintu nga silicon, SiC, ne GaAs, nga zitandikira ku mmita 100 okutuuka ku mm 200 mu sayizi. Nga bayiwa ekintu eky’enjawulo ekimanyisa mu mitendera egy’okusooka egy’okufulumya, enkola eno esobozesa okulondoola omutindo okuva ku nkomerero okutuuka ku nkomerero n’okufuga enkola y’emitindo (SPC).

**Okupakinga okw’omulembe:** Ewa ID ezikulu ez’okulondoola mu nkola za Wafer-Level Packaging (WLP) oba Reconstituted Wafer.

**R&D ne Small-Batch Production:** Dizayini yaayo ekyukakyuka, ekola mu ngeri ey’otoma egifuula etuukira ddala ku mbeera z’okukola R&D n’okugezesa okufulumya ezimanyiddwa olw’okukola ebintu ebitabuddwamu ebingi, mu bungi obutono.

**Mu bufunze n'okugeraageranya**

Mu bufunze, ThinkLaser SigmaClean kitundu kya kyuma ekituuka ku mutindo ogukulembedde mu makolero mu by’obuyonjo, okutebenkera, n’okukola mu ngeri ey’obwengula. Nga ekozesa tekinologiya waayo ow’obuyinza obwa SuperSoftMark®, egonjoola bulungi ensonga y’obulumi enkulu —obucaafu bw’obutundutundu —etera okukwatagana n’enkola ez’ennono ez’okussaako obubonero, bwe kityo ne yeeteekawo ng’ekipimo mu kisaawe ky’okussaako obubonero obugonvu” ku wafers eza yinsi 4 ku 8. Okusobola okufuna okutegeera okutegeerekeka obulungi ku kifo kyayo mu layini y’ebintu, nsaba otunuulire okugeraageranya kuno wammanga ne SC300 —ekyuma ekirala ekissaako obubonero obugonvu:

**Ekifaananyi** | **Okuyonja Sigma** | **SC300**

**Okuteeka mu kifo ekisookerwako** | Enkola y’okussaako obubonero obugonvu mu bujjuvu mu ngeri ey’otoma ku wafers za mm 100–200 (yinsi 4–8) | Enkola y’okussaako obubonero obugonvu mu bujjuvu ku wafers za mm 300 (yinsi 12).

**Okusaba mu katale** | Egendereddwamu fabs za semiconductor wafer fabs n’amakolero agapakinga agakwata wafers za yinsi 8 n’obutono; ekola nga eky’okugonjoola ekikulembedde mu kitundu kino eky’akatale | Etwalibwa nnyo abakola ebyuma byonna ebya mm 300 Integrated Device Manufacturers (IDMs) n’amakolero agakola wafer foundries

**Ebikwata ku by'ekikugu** | Class 1 cleanroom ekwatagana n’ekisenge ekiyonjo; ekozesa tekinologiya wa SuperSoftMark® alina patent okutuuka ku bubonero obutaliimu bifunfugu | Era ekozesa tekinologiya w’okussaako obubonero obugonvu, ng’awa okukwatagana okwetaagisa, obuyonjo, omutindo gw’okussaako obubonero, n’obwesigwa obwetaagisa okukola mmita 300 mu bungi

**Enkola y'ebyentambula** | Mu bujjuvu esengekebwa nga erina siteegi za kaseti 3 eziggule; SMIF pods ezisangibwa nga eky'okulonda | Mu bujjuvu ekwatagana ne Front-Opening Unified Pods (FOUPs); ewagira enkola za OHT (Overhead Hoist Transport).

**Embeera y'amakolero** | Ekizibu ekikulembedde mu makolero ku 4–8-inch wafer soft marking | Omutindo gw’amakolero ogw’okussaako obubonero obugonvu mu wafer fabs eza mm 300, nga zeewaanira ku base ennene ennyo eyateekebwamu (yuniti ezisukka mu 140)