I-ASM Pacific Technology yeTurret Wafer Level Test System SUNBIRD

I-SUNBIRD yinkqubo yovavanyo esebenzayo, echanekileyo ephezulu, ezenzekelayo ngokupheleleyo esekwe kwi-wafer-level eyenzelwe ushishino lokwenziwa kwe-semiconductor. Isetyenziswa ikakhulu kuvavanyo lombane lweewafers phambi kokusikwa (wafer sort/CP test). Iingenelo zayo eziphambili kukuphuma okuphezulu, uzinzo oluphezulu, kunye noyilo lweemodyuli. Iyakwazi ukulungelelanisa kwiimfuno ezahlukeneyo zovavanyo ukusuka kwi-R & D ukuya kwimveliso yobuninzi, ngokukodwa ifanelekileyo kwiimeko zokuvavanya ezinkulu zeesekethe ezidibeneyo ezihlangeneyo (ezifana ne-logic chips, imemori, izinzwa, njl.).

2. Iimpawu eziphambili kunye nezinto ezintsha zobuchwepheshe

2.1 Uyilo oluSekwe kwiTurret

Ukukwazi ukuvavanya okuhambelanayo: Ngoyilo lwezitishi ezininzi ze-turret, ukulayishwa okufanayo kunye nokukhulula, ukulungelelaniswa, kunye nokuvavanywa kwee-wafers kufezekisiwe, kuphucula kakhulu ukusebenza kakuhle (okufana ne-8-station turret inokuqhuba iiwafers ezininzi ngaxeshanye).

Ukusebenza okungapheliyo: Xa i-turret ijikeleza ukutshintsha izikhululo, ezinye izitishi ziyaqhubeka nokusebenza, zisusa ixesha lokulinda labavavanyi bendabuko.

2.2 Ukudityaniswa okuzenzekelayo ngokupheleleyo

Intsebenziswano yerobhothi: Dibanisa iingalo zerobhothi ezichaneke kakhulu kunye neenkqubo zokubeka imbonakalo ukuze ugqibezele ngokuzenzekela ukulayisha, ukulungelelaniswa, ukuphonononga uqhagamshelwano kunye nokuhlelwa.

I-algorithm yokucwangcisa ehlakaniphile: lungisa ulandelelwano lovavanyo kunye nendlela, ukwandisa ukusetyenziswa kwezixhobo (i-UPH inokufikelela kuma-200 + amaqhekeza / iyure, kuxhomekeke kubunzima bovavanyo).

2.3 Ikhono lovavanyo oluchanekileyo

Ukuchaneka kwe-Nano-level positioning: laser interferometer okanye i-high-resolution encoder isetyenziselwa ukuqinisekisa ukuchaneka kokulungelelaniswa kwekhadi le-probe kunye ne-wafer pad (ngaphakathi kwe-± 1μm).

Uvavanyo lwamatshaneli amaninzi: luxhasa uvavanyo oluhambelanayo ukuya kuthi ga kumawaka amatshaneli, ahambelana neeparamitha ze-DC/AC, iRF, uvavanyo lweempawu ezixubeneyo, njl.

2.4 Ukuba bhetyebhetye kunye nokwaleka

Uyilo lwemodyuli: imodyuli yokulawula ukushisa (-55 ° C ~ 150 ° C), ibhodi yokuvavanya i-multi-DUT, i-interfaces yekhadi le-probe eyahlukeneyo (njenge-MEMS probe) inokukhethwa ngokweemfuno.

I-Software evulekileyo ye-interface: isekela ukudibanisa kunye nezixhobo ze-EDA ze-third-party (ezifana neCadence, Keysight) kunye neenkqubo ze-MES ukuphumeza uhlalutyo lwexesha langempela (SPC, i-Bin Map generation).

2.5 Ukuthembeka kunye nokugcinwa

Inkqubo yokuzixilonga: ukujonga ixesha lokwenyani lokunxiba kweprobe, ukukhukuliseka kweqondo lokushisa kunye nezinye iiparamitha, kubangela ukulinganisa okuzenzekelayo okanye i-alamu.

Ukutshintsha komgca okhawulezayo: Uyilo olusemgangathweni olusemgangathweni luxhasa ukutshintshwa ngokukhawuleza kwamakhadi eprobe / iibhodi zokuvavanya (ixesha lokutshintsha

3. Iimeko zesicelo esiqhelekileyo

Uvavanyo lwe-Logic/memory chip mass production: njengovavanyo olusebenzayo lweCP ye-SoC, i-DRAM, kunye ne-NAND Flash.

Uvavanyo oluchanekileyo oluchanekileyo: ukuqinisekiswa kweeparameter ezininzi zezixhobo ze-MEMS (i-gyroscopes, i-pressure sensors).

Uvavanyo lwe-semiconductor lwesizukulwana sesithathu: ukulungelelanisa kwiimfuno ze-high-voltage kunye nobushushu obuphezulu be-SiC / GaN wafers.

4. Umzekelo weparamitha yobugcisa (uhlengahlengiso ngokolungelelwaniso lokwenene)

IParameter yento

Ubungakanani be-Wafer 6"/8"/12" (inokwenziwa ngokwezifiso)

Inani lezikhululo zovavanyo 4/6/8 izikhululo ozikhethelayo

Ukumisa ukuchaneka ±0.5μm @ 3σ

Uluhlu lovavanyo lobushushu Ubushushu obuqhelekileyo ~ 150°C (ukhetho lwemodyuli yobushushu obuphantsi)

Elona nani liphezulu lovavanyo lwamajelo 2048 amajelo (anokwandiswa)

Unxibelelwano lonxibelelwano GPIB/Ethernet/SECS/GEM

5. Uhlalutyo lokhuphiswano lwemarike

Izinto eziluncedo:

Xa kuthelekiswa nabavavanyi besikhululo esinye (njengeProber yendabuko), ukusebenza kakuhle kuphuculwe nge-30% ~ 50%.

Ukuhambelana okuqinileyo, ukuxhasa inguqu engenamthungo ukusuka kwi-throughput ephantsi kwi-R&D ukuya kwimveliso ephezulu.

Iimveliso zokuthelekisa:

Ikhuphisana neTokyo Electron (TEL) Prober, Teradyne UltraFlex, njl., Kodwa ineempawu ezahlukileyo ngakumbi kwi-architecture ye-turret kunye nokusebenza kakuhle kweendleko.

6. Ixabiso loMthengi

Iindleko zovavanyo ezincitshisiweyo: Ukuphumelela okuphezulu kunciphisa inani lotyalo-mali lwezixhobo.

Isivuno esiphuculweyo: Uvavanyo oluchanekileyo oluphezulu kunye nengxelo yedatha yexesha langempela inceda ukukhulisa inkqubo.

Ukuguquguquka kwexesha elizayo: Ixhasa uvavanyo oluqhutywa yi-AI kunye nokupakishwa okuphezulu (okufana neChiplet) iimfuno zovavanyo.

7. Isishwankathelo

I-SUNBIRD inikezela ngesisombululo esisebenzayo, esithembekileyo kunye nesiguquguqukayo sovavanyo lwe-wafer kwishishini le-semiconductor ngokusebenzisa i-turret design entsha, i-automation epheleleyo kunye nobuchule bokuvavanya obuchanekileyo, ngokukodwa kubenzi benkqubo ephuculweyo ye-chip abaphishekela ubuninzi bemveliso kunye nomgangatho wedatha. Uyilo lwemodyuli lukwagcine indawo yophuculo lwendaleko yetekhnoloji yexesha elizayo.