Enkola ya ASM Pacific Technology Turret Enkola y’okugezesa omutendera gwa wafer SUNBIRD

SUNBIRD nkola nnungi, ey’obutuufu obw’amaanyi, eyesigamiziddwa ku turret-based wafer-level test system eyakolebwa mu makolero agakola semiconductor. Kisinga kukozesebwa mu kugezesa amasannyalaze ga wafers nga tezinnaba kusala (wafer sort/CP test). Ebirungi byayo ebikulu bye bino: throughput ya waggulu, stability ya waggulu, ne modular design. Kisobola okukyusakyusa mu byetaago eby’enjawulo eby’okugezesa okuva ku R&D okutuuka ku kukola mu bungi, naddala nga kituukira ddala ku mbeera z’okugezesa ennene ez’obuziba obugatta obuzito (nga logic chips, memory, sensors, n’ebirala).

2. Ebintu ebikulu n’obuyiiya bwa tekinologiya

2.1 Enteekateeka eyesigamiziddwa ku Turret

Obusobozi bw’okugezesa mu ngeri ya parallel: Okuyita mu dizayini ya turret ya siteegi nnyingi, okutikka n’okutikkula mu ngeri ey’enjawulo, okukwatagana, n’okugezesa wafers bituukibwako, okulongoosa ennyo obulungi (nga turret ya siteegi 8 esobola okukola wafers eziwera mu kiseera kye kimu).

Okukola nga toyimiridde: Turret bwe yeekulukuunya okukyusa siteegi, siteegi endala zigenda mu maaso n’okukola, ekimalawo obudde bw’okulinda kw’abagezesa ab’ennono.

2.2 Okugatta mu ngeri ey’otoma mu bujjuvu

Enkolagana ya roboti: Okugatta emikono gya roboti egy’obutuufu obw’amaanyi n’enkola z’okulaga ebifo ebirabika okusobola okumaliriza mu ngeri ey’otoma okutikka wafer, okugikwataganya, okukwatagana ne probe n’okusunsula.

Intelligent scheduling algorithm: okulongoosa ensengeka y’okugezesa n’ekkubo, okutumbula enkozesa y’ebyuma (UPH esobola okutuuka ku bitundu 200+/essaawa, okusinziira ku buzibu bw’okugezesa).

2.3 Obusobozi bw’okugezesa obw’obutuufu obw’amaanyi

Nano-level positioning accuracy: laser interferometer oba high-resolution encoder ekozesebwa okukakasa alignment entuufu ya probe card ne wafer pad (mu ±1μm).

Okugezesa emikutu mingi: kuwagira okugezesa okukwatagana okutuuka ku nkumi n’enkumi z’emikutu, okukwatagana ne DC/AC parameters, RF, okugezesa siginiini ezitabuliddwa, n’ebirala.

2.4 Okukyukakyuka n’okulinnyisa omutindo

Modular design: modulo y'okufuga ebbugumu (-55 ° C ~ 150 ° C), multi-DUT test board, eby'enjawulo probe card interfaces (nga MEMS probe) bisobola okulondebwa okusinziira ku byetaago.

Software open interface: ewagira okugatta n’ebikozesebwa bya EDA eby’ekibiina eky’okusatu (nga Cadence, Keysight) n’enkola za MES okutuuka ku kwekenneenya data mu kiseera ekituufu (SPC, Bin Map generation).

2.5 Okwesigamizibwa n’okulabirira

Enkola y’okwezuula: okulondoola mu kiseera ekituufu okwambala kwa probe, okuwuguka kw’ebbugumu n’ebintu ebirala, okutandika okupima oba alamu mu ngeri ey’otoma.

Enkyukakyuka mu layini ey’amangu: Dizayini y’ebintu ebiteekebwa mu mutindo ewagira okukyusa amangu kaadi za probe/ebipande by’okugezesa (obudde bw’okukyusa < eddakiika 10).

3. Ensonga eza bulijjo ez’okukozesa

Logic/memory chip mass production test: nga okugezesebwa kwa CP okulungi okwa SoC, DRAM, ne NAND Flash.

Okugezesa sensa mu butuufu obw’amaanyi: okukakasa kwa parameter eziwera ebyuma bya MEMS (gyroscopes, pressure sensors).

Okugezesa kwa semiconductor okw’omulembe ogw’okusatu: okutuukagana n’ebyetaago by’okugezesa ebya vvulovumenti eya waggulu n’eby’ebbugumu eringi ebya SiC/GaN wafers.

4. Ekyokulabirako kya parameter ey’ekikugu (ekitereezebwa okusinziira ku nsengeka entuufu) .

Ekintu Parameter

Wafer sayizi 6 "/8"/12" (esobola okulongoosebwa)

Omuwendo gwa siteegi z’okugezesa 4/6/8 siteegi za kwesalirawo

Obutuufu bw’okuteeka ekifo ±0.5μm @ 3σ

Ekigezo ky’ebbugumu Ebbugumu erya bulijjo ~ 150°C (optional low temperature module)

Omuwendo ogusinga obunene ogw’emikutu gy’okugezesa emikutu 2048 (egigaziwa)

Enkola y'empuliziganya GPIB/Ethernet/SECS/GEM

5. Okwekenenya okuvuganya kw’akatale

Ebirungi ebirimu:

Bw’ogeraageranya n’abagezesa aba siteegi emu (nga Prober ey’ekinnansi), obulungi bulongoosebwa ebitundu 30%~50%.

Okukwatagana okw’amaanyi, okuwagira enkyukakyuka etaliimu buzibu okuva ku bungi obutono mu R&D okudda ku bungi obuyita mu kukola ebintu mu bungi.

Ebintu ebigeraageranya:

Evuganya ne Tokyo Electron (TEL) Prober, Teradyne UltraFlex, n’ebirala, naye erina ebisingawo eby’enjawulo mu nzimba ya turret n’okukendeeza ku nsimbi.

6. Omuwendo gwa Kasitoma

Okukendeeza ku nsaasaanya y’okugezesa: Okukola ennyo kukendeeza ku muwendo gw’ebiteekebwamu ebyuma.

Okulongoosa mu makungula: Okugezesa mu butuufu obw’amaanyi n’okuddamu kwa data mu kiseera ekituufu biyamba okulongoosa enkola.

Okukyusakyusa mu biseera eby’omu maaso: Kuwagira okulongoosa okugezesa okuvugibwa AI n’ebyetaago by’okugezesa eby’okupakinga eby’omulembe (nga Chiplet).

7. Mu bufunze

SUNBIRD egaba eky’okugezesa wafer ekikola obulungi, ekyesigika era ekikyukakyuka eri amakolero ga semiconductor okuyita mu dizayini ya turret ey’obuyiiya, automation mu bujjuvu n’obusobozi bw’okugezesa mu ngeri ey’obutuufu, naddala eri abakola chip z’enkola ez’omulembe abagoberera obulungi bw’okufulumya ebintu mu bungi n’omutindo gwa data. Enzimba yaayo eya modular nayo etereka ekifo eky’okulongoosaamu okusobola okukulaakulana mu tekinologiya mu biseera eby’omu maaso.