i-ave ukuya kuthi ga kwi-70% kuMacandelo e-SMT - KwiSitokhwe & Ukulungele ukuThunyelwa
Fumana iQuote →Izisombululo ze-flip chip bonding ezichanekileyo kakhulu zokuhlanganisa i-die-to-substrate, ulungelelwaniso lwe-fine-pitch, i-thermo-compression bonding, i-SiP, i-chiplet integration, izixhobo ze-MEMS, ii-sensors, kunye nemveliso ephambili yokupakisha i-semiconductor.
Ukubeka idayisi encediswa kukubona ukuze ibotshelelwe kakuhle.
I-flip chip bonder sisixhobo sokupakisha se-semiconductor esisetyenziselwa ukubeka nokubopha i-die face-down kwi-substrate, i-interposer, iphakheji, okanye i-carrier. Isetyenziswa kakhulu ekupakisheni i-flip chip, ukuhlanganisa i-fine-pitch, ukuhlanganiswa kwe-chiplet, iimodyuli ze-SiP, izixhobo ze-MEMS, ii-sensors, kunye nokupakisha kwe-semiconductor okuphambili.
Xa kuthelekiswa nezixhobo zemveli zokuncamathisela iidayi, ukubophelela iitshiphusi zeflip kufuna ukuchaneka okuphezulu kokubekwa, ukulungelelaniswa kombono, ulawulo lwamandla okubophelela, kunye nokuzinza kwenkqubo yobushushu kuba uqhagamshelo lombane lwenziwa ngamaqhuma, iipadi, okanye uqhagamshelo kwicala elisebenzayo ledayi.
I-Flip chip bonding ifuna indawo echanekileyo yokudaya, amandla okubopha azinzileyo, ulawulo oluthembekileyo lobushushu, kunye nokusebenza okuphindaphindwayo kwenkqubo. I-flip chip bonding efanelekileyo inceda ukuphucula isivuno sokudibanisa, ukunciphisa iziphene ze-bonding, kunye nokuxhasa iimfuno eziphambili zokupakisha.
Kwiindawo ezithambileyo, ii-micro bumps, ii-chiplets, kunye nee-high-density interconnects.
Inceda ekunciphiseni umonakalo wokufa, ukudibana okungekho kakuhle, kunye nokuguquguquka kwenkqubo.
Kubalulekile kwi-thermo-compression bonding kunye ne-solder bump bonding.
Ixhasa i-SiP, i-chiplet, i-MEMS, ii-sensors, kunye neepakeji ze-semiconductor eziphambili.
Ii-flip chip ezahlukeneyo zifuna ulungelelwaniso olwahlukeneyo lwe-bonding. Sinceda ekufaniseni izixhobo ngokusekelwe kwindlela ye-bonding, ubungakanani be-die, uhlobo lwe-substrate, ukuchaneka kokubekwa, uluhlu lobushushu, ulawulo loxinzelelo, kunye namandla emveliso.
Xoxa ngeNkqubo yakho yoBumbanoKwizicelo ezifuna amandla achanekileyo, ubushushu, ixesha, kunye nolawulo lokulungelelanisa.
Ukuhlanganisa iitshiphusi ezijijekileyo kusetyenziswa ii-solder bumps okanye ii-micro bump interconnects.
Kwi-MEMS, izixhobo zesensor, iimodyuli, kunye nendibano ekhethekileyo ye-substrate.
Kwi-chiplet, iphakheji enoxinano oluphezulu, kunye nezicelo zonxibelelwano eziphambili.
Le ndawo igcinelwe udidi lwemveliso yakho okanye ubizo lwemveliso olucetyiswayo. Tshintsha amakhadi emveliso yesampulu nge-CMS product loop yakho.
Nxibelelanisa i-ASMPT AMICRA AFC Plus kwiprojekthi yakho yokubopha ngokuphonononga inkqubo yokubopha, iimodyuli ezifakiweyo, izixhobo,...
Jonga isitokhwe kunye nexabiso
Jonga ii-bond ze-die kunye ne-flip chip ezisetyenzisiweyo ze-ASMPT AMICRA AFC Plus. Hlola ukufumaneka, imeko yomatshini, uqwalaselo olufakiweyo...
Jonga isitokhwe kunye nexabiso
Hlola i-ASM AMICRA AFC PLUS die and flip chip bonder, kuquka uqwalaselo olufumanekayo, ukuchaneka kokubekwa, ukubophelela...
Jonga isitokhwe kunye nexabiso
I-Shibaura Mechtronics TFC-9000 ngumatshini wokubopha i-flip-chip oveliswa ngobuninzi owenzelwe inkqubo yokupakisha ephucukileyo...
Jonga isitokhwe kunye nexabiso
I-ASM AFC Plus yi-bonder ye-flip chip ekhulileyo ngokwetekhnoloji, echanekileyo kakhulu. Enyanisweni, yi-dual-purp eguquguqukayo...
Jonga isitokhwe kunye nexabiso
I-Besi Datacon 8800 CHAMEO ultra plus AC yeyona iphambili kwimarike yehlabathi ye-hybrid bonding.
Jonga isitokhwe kunye nexabiso
I-BESI Esec 2100 FC hS ngumatshini omdala owenzelwe ukuvelisa i-flip-chip bonding ekhawulezayo nephezulu.
Jonga isitokhwe kunye nexabiso
I-Yamaha YSH20 flip chip mounter yi-mounter ekhawulezayo nechanekileyo efanelekileyo yokufaka izinto ezahlukeneyo...
Jonga isitokhwe kunye nexabiso
Ukubekwa ngokuthe ngqo kwe-chip kwi-wafer kwizixhobo eziqhelekileyo zokumisa umphezulu, kudibanisa isantya soomatshini bokufaka umphezulu ...
Jonga isitokhwe kunye nexabiso
I-Katalyst™ sisixhobo seFlip Chip esikhokelayo kushishino esasungulwa yiKulicke & Soffa (K&S), esisetyenziselwa kakhulu i-flip chi...
Jonga isitokhwe kunye nexabisoUqwalaselo lwe-Flip chip bonder kufuneka lukhethwe ngokwenkqubo yokubopha, ubungakanani be-die, ubungakanani be-substrate, ukuchaneka kokulungelelanisa, amandla okubopha, imfuneko yobushushu, inkqubo yokubona, kunye namandla emveliso.
Ixabiso le-Flip chip bonder lixhomekeke kuhlobo, iqonga, ukuchaneka kokubekwa, indlela yokubopha, inqanaba lokuzenzekelayo, inkqubo yokubona, imodyuli yobushushu, uqwalaselo lwesoftware, imeko yezixhobo, kunye nokufumaneka kwangoku.
Ukubopha okucolekileyo kunye nokugquma okuncinci kudla ngokufuna amaqonga achanekileyo aphezulu.
I-thermo-compression bonding, i-solder bump bonding, kunye ne-adhesive bonding zifuna iimodyuli ezahlukeneyo.
Iinkqubo ezenziwe ngesandla, ezizenzekelayo, kunye nezizenzekelayo zinomthamo owahlukileyo kunye namanqanaba eendleko.
Iibhondi ze-flip chip ezisetyenzisiweyo nezihlaziyiweyo zinokunciphisa utyalo-mali xa kuthelekiswa neenkqubo ezintsha.
Ixhasa ukulungelelaniswa kwe-die-to-substrate kunye nokuchaneka kokubekwa kwe-fine-pitch.
Kubalulekile ukukhusela iidayi, umgangatho wokudibanisa, kunye neziphumo zokubopha eziphindaphindwayo.
Iyimfuneko kwi-thermo-compression bonding, iinkqubo ze-solder bump, kunye nokuzinza kobushushu.
Ixhasa ii-substrates ezahlukeneyo, ii-interposer, iipakeji, abathwali, kunye neefomathi zeemodyuli.
Khetha iinkqubo ezenziwe ngesandla, ezizenzekelayo, okanye ezizenzekelayo ngokusekelwe kwimfuno yemveliso.
Iinkqubo ezisetyenzisiweyo nezihlaziyiweyo kufuneka zihlolwe uqwalaselo, intshukumo, i-optics, kunye nemeko yolawulo.
I-flip chip bonder kunye ne-die bonder zombini zisetyenziswa kwi-semiconductor assembly, kodwa zibonelela ngezakhiwo ezahlukeneyo ze-bonding kunye neemfuno zokupakisha.
| Into | I-Flip Chip Bonder | I-Bonder |
|---|---|---|
| Isikhokelo sokudibanisa | I-die ibotshelelwe ubuso bujonge phantsi | Idayi idla ngokubekwa ijonge phezulu okanye incamathiselwe kwifreyimu yentsimbi/isiseko sentsimbi |
| Indlela yoQhagamshelo | Iingqumba, ii-pads, ii-micro bumps, ii-interconnects | Isincamathelisi esinamathelayo, i-epoxy, i-solder, okanye i-eutectic attach |
| Imfuneko yokuchaneka | Ukuchaneka okuphezulu kokulungelelanisa | Kuxhomekeke kwiphakheji kunye nenkqubo yokuncamathisela ukufa |
| Izicelo eziphambili | Itshiphusi ejikelezayo, iSiP, itshiphusi, upakisho lwe-2.5D/3D | Ukupakisha okuqhelekileyo kwe-IC, ii-LED, iisensa, iimodyuli |
| Ulawulo lweNkqubo | Ifuna amandla, ubushushu, umbono, kunye nolawulo lokubekwa | Igxile ekubekeni iidayi kunye nokulawula izinto ezincamathiselweyo |
Ii-flip chip bonders zisetyenziswa apho kufuneka khona uqhagamshelo oluxineneyo, iipakethe ezincinci, ulungelelwaniso oluchanekileyo, kunye nokusebenza kakuhle kwendibano.
Ukudibanisa i-chip-to-substrate kunye nokudibanisa iipakethe ezinoxinano olukhulu.
Ukudibanisa izinto ezininzi, ukupakishwa okungafaniyo, kunye nokuhlanganiswa kwe-chiplet.
Kwiimodyuli ezincinci, izixhobo ezikwiphakheji, kunye nezixhobo ezisebenza kakuhle.
Kwizixhobo ezibuthathaka ezifuna indawo ezinzileyo kunye nolawulo lokubopha.
Kwimigca ye-R&D, imveliso yovavanyo, ukwandiswa komthamo, okanye iiprojekthi ezixabisa kakhulu, ii-flip chip bonders ezisetyenzisiweyo nezihlaziyiweyo zinokubonelela ngobuchule bokubopha obusebenzayo kunye nexesha elifutshane lokufumana kunye neendleko eziphantsi zezixhobo.
Ngaphambi kokuba uthenge i-flip chip bonder esetyenzisiweyo okanye ehlaziyiweyo, jonga izinto eziphambili ezichaphazela ngokuthe ngqo ukuchaneka kokulungelelaniswa, uzinzo lwe-bonding, kunye nokusetyenziswa kwexesha elide.
Sinceda abathengi bafumane ii-flip chip bonders ezifanelekileyo ngokusekwe kubungakanani be-die, uhlobo lwephakheji, imfuneko yokulungelelanisa, inkqubo ye-bonding, umthamo wemveliso, imeko yezixhobo, uhlahlo-lwabiwo mali, kunye nexesha lokuhanjiswa.
Qinisekisa idayi, isiseko, uhlobo lwephakheji, inkqubo yokubopha, kunye nemfuneko yokuchaneka.
Cebisa amaqonga afanelekileyo asekelwe kwinkqubo kunye nohlahlo-lwabiwo mali.
Qinisekisa ulungelelwaniso lomatshini kunye nokulungelelaniswa kwezixhobo ezisisiseko ngaphambi kokuba zithunyelwe.
Xhasa ukupakishwa kokuthunyelwa kwamanye amazwe, ukulungelelaniswa kwezinto ezithuthwayo, kunye nokuthunyelwa kwamanye amazwe.
I-flip chip bonder sisixhobo sokupakisha se-semiconductor esisetyenziselwa ukubeka nokubopha i-die ijonge phantsi kwi-substrate, i-interposer, okanye iphakheji kusetyenziswa ulungelelwaniso oluchanekileyo, amandla, kunye nolawulo lobushushu.
Isetyenziselwa ukupakisha iitshiphusi ezijijekileyo, ukubopha iitshiphusi ukuya kwi-substrate, ukupakisha okuphucukileyo, i-SiP, ukuhlanganiswa kweetshiphusi, izixhobo ze-MEMS, iisensa, kunye nendibano ye-semiconductor enoxinano oluphezulu.
I-die bonder ibeka i-die kwi-substrate okanye kwi-leadframe, ngelixa i-flip chip bonder ibopha i-die ijonge ezantsi ngokulungelelaniswa ngokuchanekileyo nama-bumps, ii-pad, okanye ama-interconnect.
Ewe. Iibhondi ze-flip chip ezisetyenzisiweyo nezihlaziyiweyo zifanelekile kubathengi abafuna amandla okubopha athembekileyo kunye notyalo-mali oluphantsi.
Kuya kufuneka uqwalasele ukuchaneka kokubekwa, indlela yokubopha, ubungakanani besidi, ubungakanani besiseko, amandla okubopha, ulawulo lobushushu, amandla okukhupha, imeko yezixhobo, uhlahlo lwabiwo-mali, kunye nenkxaso ekhoyo.
Sixelele ubungakanani bedayi yakho, uhlobo lwesiseko, indlela yokubopha, imfuneko yokuchaneka, uphawu olukhethwayo, uhlahlo lwabiwo-mali, kunye nexesha lokuhambisa. Siza kukunceda ucebise ngeendlela ezifanelekileyo zokubopha i-flip chip.
Kutheni abantu abaninzi bekhetha ukusebenza ngeGeekValue?
Uphawu lwethu lusasazeka ukusuka kwisixeko ukuya kwisixeko, kwaye abantu abangenakubalwa bandibuze, "Yintoni iGeekValue?" Ivela kumbono olula: ukuxhobisa ukusungulwa kweTshayina ngetekhnoloji ye-cutting-edge. Lo ngumoya wokuziphucula okuqhubekayo, ofihliweyo ekusukeleni kwethu iinkcukacha ezingayekiyo kunye nolonwabo lokugqithisa ebesikulindele ngalo lonke unikezelo. Obu buchule bobugcisa obuphantse bugqithise kunye nokuzinikela akukona nje ukuzingisa kwabaseki bethu, kodwa kunye nokubaluleka kunye nokufudumala kwe-brand yethu. Siyathemba ukuba uza kuqala apha kwaye usinike ithuba lokudala imfezeko. Masisebenze kunye ukwenza ummangaliso olandelayo othi "zero defect".
IinkcukachaQhagamshelana nengcali yokuthengisa
Finyelela kwiqela lethu lezentengiso ukuze ujonge izisombululo ezilungiselelweyo ezihlangabezana ngokugqibeleleyo neemfuno zeshishini lakho kwaye ulungise nayiphi na imibuzo onokuba unayo.
© Onke Amalungelo Agciniwe. Inkxaso yobuGcisa:TiaoQingCMS
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