BESI Esec 2100 FC hS flip chip bonder

I-BESI Esec 2100 FC hS liqonga elivuthiweyo elenzelwe ngokukodwa ukuvelisa i-flip-chip bonding ekhawulezayo nephezulu. Njengeqela elisebenzayo kweli candelo, libeka phambili ukusebenza kakuhle kwemveliso (UPH) njengeyona njongo yalo ephambili ngelixa ligcina inqanaba eliqinisekisiweyo lokuchaneka (8 µm), okwenza ukuba ifaneleke kakhulu kwizicelo zokupakisha iitshiphusi ze-elektroniki ezixabisa kakhulu.

Ifilosofi Engundoqo: Ukhetho Olulinganiselayo

Isitshixo se-Esec 2100 FC hS sikukulinganisela kwayo okuchanekileyo kwezorhwebo; itheyibhile engezantsi ibonisa ngokucacileyo le ndlela ilinganisiweyo:

Uphawu | Iiparameter ezithile

Indawo yeMveliso | Iqonga lokuBondanisa iiChip ezikhawulezayo zesizukulwana sesithathu

Ukuchaneka kweBonding | 8 µm @ 3σ (Imo yokuchaneka okuphezulu)

Ubuncinane bexesha lomjikelo | 240 ms (kuquka ukuntywila nge-flux)

Ubungakanani beeChip ezixhaswayo | 0.3 mm x 0.3 mm ukuya kwi-20 mm x 20 mm

Ubungakanani beWafer obuxhaswayo | Iisentimitha ezi-4 ukuya kwiisentimitha ezili-12

Izinto ezibalulekileyo zeTekhnoloji

Inkqubo yoVuselelo lwePhi-Y: Ingcamango yentshukumo ekhethekileyo ethi "Phi-Y" idibanisa intshukumo ejikelezayo (Phi) kunye nentshukumo ethe tye (Y), nto leyo efinyeza kakhulu indlela kunye nexesha lokujikeleza kwemisebenzi yePick & Place.

Uyilo "oluKhanyayo noluQiqileyo": Indlela entsha yokukhetha nokubeka imoto inomxube wolwakhiwo olukhaphukhaphu kunye nokuqina okuphezulu kwesakhiwo. Idibene nolawulo oluphambili lwendlela yokuthutha imoto kunye nenkqubo yokupholisa ulwelo, iqinisekisa ukuchaneka okugqwesileyo kunye nozinzo ngexesha lokusebenza ngesantya esiphezulu.

Ukubeka esweni okugqibeleleyo ngexesha langempela kunye nokulungisa iimpazamo ngokufanelekileyo: Le nkqubo ibonelela ngemifanekiso yexesha langempela yeendawo ezine ezahlukeneyo zokubopha kwaye inemisebenzi yoncedo kwi-intanethi ejongene nomxholo, ivumela abaqhubi ukuba baxilonge kwaye basombulule iimpazamo ngokukhawuleza.

Ukusebenza Kokutshintsha Umgca Ogqibeleleyo: Izinto eziphambili zenzelwe ukutshintshwa ngokukhawuleza nangokungenazixhobo, ukunciphisa kakhulu amaxesha okutshintsha imveliso. Ukongeza, inkqubo ixhasa ukuphindaphindwa ngokukhawuleza kweeresiphi "zomatshini wegolide" kwezinye iiyunithi, okwenza kube lula ukusasazwa kwemveliso ngobuninzi kwaye kuvumela imveliso ehambelanayo kwiimashini ezininzi.

Uyilo oluFumaneka kakhulu: Ukwandiswa kokukhula kwenkqubo kunye nokuguquguquka kwixesha elizayo kufezekiswa ngonxibelelwano lweGigabit Ethernet kunye noyilo oluhlengahlengiswayo nolunokuhlaziywa.

I-Esec 2100 FC hS inika inkxaso eqinileyo kwiinkqubo zokupakisha:

**Ukuguquguquka Okubanzi Kokupakisha:** Esi sixhobo siyakwazi ukusingatha uluhlu olubanzi lwezicelo zeFlip Chip (FC), kuquka iintlobo ezahlukeneyo zokupakisha eziphambili—ezifana neFCOL, FC-MIS, FC-SIP, FCCSP, kunye neFCBGA—kunye neepakeji ezintsha ezifana neCSP-LED.

**Iindlela Ezibanzi Zokusebenza:** I-Besi ibonelela ngeseti epheleleyo yeemodyuli ezikhethiweyo zalo matshini, ezigubungela iindawo ezifana nokuphathwa kwe-substrate, i-flux coating, i-precision dispensing, imisebenzi yokukhetha nokubeka, kunye neenkqubo zokubona. Oku kuvumela iyunithi ukuba icwangciswe ngokwemfuno ukuze ihlangabezane neemfuno ezithile zenkqubo.

**Ii-Interfaces ze-Automation eziBanzi:** Ezi zixhobo zidityaniswa ngokungenamthungo kwisiseko se-automation se-semiconductor manufacturing facility. Aziboneleli kuphela nge-standard host communication interfaces kodwa zikwaxhasa ukusebenza kwe-Wafer Mapping kunye ne-E142 Strip Mapping standard, nto leyo evumela ukulandelela nokulawula ngempumelelo ii-batches zemveliso.

Uguquko oluphindaphindayo

Njengoko uluhlu lweemveliso zeBesi luye lwatshintsha, i-Esec 2100 FC hS iye yalandelwa kancinci kancinci ziimodeli ezintsha; nangona kunjalo, ngenxa yamandla ayo okusebenza kunye nokusebenza kakuhle kweendleko, ihlala ikho kwimarike. Kwiizicelo ezifuna ubuchule obuphezulu bokuchaneka kunye nokuzenzela, abasebenzisi banokuqwalasela iimodeli zayo ezilandelayo eziphuculweyo:

**I-Esec 2100 hSi:** Yakhelwe kwiqonga le-FC hS, le modeli yazisa iModyuli entsha yeDual Dispensing kunye nentloko yokubopha echanekileyo kakhulu. Ukongeza, ixhotyiswe ngeNkqubo ejongeka iphezulu enesisombululo esiphezulu, ephucula ngakumbi zombini amanqanaba okuchaneka kwenkqubo kunye nookuzenzakalelayo.

Lilonke, i-Esec 2100 FC hS yi-Flip Chip bonder ene-market position ecacileyo kunye netekhnoloji evuthiweyo. Inkqubo yayo yokunyakaza ye-Phi-Y eyahlukileyo kunye noyilo "olulula, oluqinileyo" lubonelela ngokusebenza okukhawulezayo kwimarike. Ifumana ibhalansi efanelekileyo phakathi kokuchaneka kunye nesantya, ime njengempumelelo eqhelekileyo kwipotifoliyo ye-Flip Chip bonding yeBesi kwaye ihlala ingundoqo kwimigca emininzi yemveliso yokupakisha kunye novavanyo ukuza kuthi ga namhlanje.