BESI Esec 2100 FC hS flip chip bonder

The BESI Esec 2100 FC hS is a mature platform specifically engineered for high-speed, high-volume flip-chip bonding production. As a workhorse in this field, it prioritizes production efficiency (UPH) as its core objective while maintaining a guaranteed level of precision (8 µm), making it ideally suited for cost-sensitive consumer electronics chip packaging applications.

Core Philosophy: The Balanced Choice

The key to the Esec 2100 FC hS lies in its precise balance of trade-offs; the table below clearly illustrates this balanced approach:

Feature | Specific Parameters

Product Positioning | 3rd Generation High-Speed Flip-Chip Bonding Platform

Bonding Accuracy | 8 µm @ 3σ (High-Precision Mode)

Minimum Cycle Time | 240 ms (including flux dipping)

Supported Chip Sizes | 0.3 mm x 0.3 mm to 20 mm x 20 mm

Supported Wafer Sizes | 4 inches to 12 inches

Key Technological Highlights

Revolutionary Phi-Y Motion System: The unique "Phi-Y" motion concept combines rotational movement (Phi) with linear movement (Y), significantly shortening the path and cycle time for Pick & Place operations.

"Light & Rigid" Design: The newly designed pick-and-place mechanism features a combination of lightweight construction and high structural rigidity. Coupled with advanced trajectory control and a liquid cooling system, it ensures exceptional precision and stability during high-speed operation.

Comprehensive Real-Time Monitoring & Efficient Debugging: The system provides real-time imaging of four distinct bonding zones and features context-sensitive online help functions, enabling operators to quickly diagnose and resolve errors.

Ultimate Line Changeover Efficiency: Key components are designed for tool-less, rapid replacement, drastically reducing product changeover times. Additionally, the system supports the quick replication of "golden machine" recipes to other units, simplifying mass production deployment and enabling synchronized production across multiple machines.

High-Availability Design: Enhanced system scalability and future adaptability are achieved through Gigabit Ethernet communication and a modular, upgradeable design. Packaging Ecosystem and Market Positioning

The Esec 2100 FC hS offers robust support for packaging processes:

**Broad Packaging Versatility:** This equipment is capable of handling a wide range of Flip Chip (FC) applications, encompassing various mainstream packaging types—such as FCOL, FC-MIS, FC-SIP, FCCSP, and FCBGA—as well as emerging packages like CSP-LED.

**Extensive Process Options:** Besi provides a comprehensive suite of optional modules for this machine, covering areas such as substrate handling, flux coating, precision dispensing, pick-and-place operations, and vision systems. This allows the unit to be configured on demand to meet specific process requirements.

**Comprehensive Automation Interfaces:** The equipment integrates seamlessly into a semiconductor manufacturing facility's automation infrastructure. It not only offers standard host communication interfaces but also supports Wafer Mapping functionality and the E142 Strip Mapping standard, enabling effective tracking and management of production batches.

Iterative Evolution

As Besi's product line has evolved, the Esec 2100 FC hS has gradually been succeeded by newer models; however, thanks to its performance capabilities and cost-effectiveness, it remains a highly active presence in the market. For applications requiring even higher precision and automation capabilities, users may consider its subsequent upgraded models:

**Esec 2100 hSi:** Built upon the FC hS platform, this model introduces a new Dual Dispensing Module and a high-precision bonding head. Additionally, it is equipped with a high-resolution Up-Looking System, further enhancing both process precision and automation levels.

Overall, the Esec 2100 FC hS is a Flip Chip bonder with a clear market positioning and mature technology. Its unique Phi-Y motion system and "lightweight, high-rigidity" design deliver market-leading high-speed performance. Striking an optimal balance between precision and speed, it stands as a classic achievement in Besi's Flip Chip bonding portfolio and remains a mainstay in many packaging and testing production lines to this day.