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ASM AMICRA AFC PLUS Die and Flip Chip Bonder
The ASM AMICRA AFC PLUS is a fully automatic, high-precision die bonder and flip chip bonder designed for advanced microelectronic, photonic, MEMS and semiconductor packaging applications. Its modular platform supports different bonding processes and can be configured according to specific die, substrate and production requirements.
With placement accuracy of up to ±1.5 µm and a cycle time below 15 seconds, the AFC PLUS is suitable for applications that require stable positioning, flexible process integration and reliable component handling. Actual performance and available functions depend on the installed machine configuration.
Key Specifications
| Manufacturer | ASMPT AMICRA |
| Model | AMICRA AFC PLUS |
| Equipment Type | Automatic Die Bonder / Flip Chip Bonder |
| Placement Accuracy | Up to ±1.5 µm, depending on process and configuration |
| Cycle Time | Below 15 seconds, application dependent |
| Machine Concept | Modular and configurable platform |
| Alignment | Passive alignment; active alignment may be available depending on configuration |
| Bonding Processes | Die bonding, flip chip bonding, epoxy bonding and eutectic bonding |
| Optional Functions | Epoxy dispensing, laser or heating plate bonding, UV curing and post-bond inspection |
Specifications and installed options may vary according to machine year, software version and original configuration. Please contact us for the detailed configuration of the available equipment.
Main Features
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High-precision die placement for demanding assembly processes
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Supports both standard die bonding and flip chip bonding
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Modular design for different bonding and handling requirements
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Compatible with multiple adhesive and eutectic bonding processes
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Suitable for die-to-substrate and die-to-wafer applications
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Automatic component, wafer and substrate handling options
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Flexible platform for research, prototyping and specialized production
Equipment Availability and Support
GEEKVALUE supplies ASM AMICRA die bonding and flip chip bonding equipment according to current inventory availability. Before shipment, the available machine can be checked for appearance, motion control, vision alignment, bonding functions, software operation and installed options.
Please send us your required application, die size, substrate size, bonding process, accuracy requirement and target production capacity. Our team will confirm whether the available AFC PLUS configuration is suitable for your process.
Request an ASM AMICRA AFC PLUS Quote
Contact GEEKVALUE for current availability, machine year, equipment condition, installed configuration, inspection details, delivery time and quotation for the ASM AMICRA AFC PLUS die and flip chip bonder.
