BESI Esec 2100 FC hS ekyuma ekikuba ebipande

BESI Esec 2100 FC hS ye platform enkuze eyakolebwa yinginiya mu ngeri ey’enjawulo okukola flip-chip bonding ku sipiidi ey’amaanyi, ey’amaanyi. Nga embalaasi ekola mu mulimu guno, ekulembeza obulungi okufulumya (UPH) ng’ekigendererwa kyayo ekikulu ate ng’ekuuma omutindo ogukakasiddwa ogw’obutuufu (8 μm), ekigifuula esaanira ennyo okukozesebwa mu kupakinga chip z’ebyuma ebikozesebwa mu byuma ebikozesebwa mu byuma ebikozesebwa mu byuma bikalimagezi ezitasaasaanya ssente nnyingi.

Obufirosoofo Obukulu: Okulonda okw’enjawulo

Ekisumuluzo kya Esec 2100 FC hS kiri mu bbalansi yaayo entuufu ey’okusuubulagana; emmeeza wansi eraga bulungi enkola eno ey’enjawulo:

Ekitundu | Ebipimo Ebitongole

Okuteeka Ebintu mu kifo | Omulembe ogw'okusatu ogw'okusiba Flip-Chip Bonding Platform

Obutuufu bw'okukwatagana | 8 μm @ 3σ (Engeri ey’obutuufu obw’amaanyi) .

Obudde obutono obw'enzirukanya | 240 ms (nga mw’otwalidde n’okunnyika mu flux) .

Sayizi za Chip eziwagirwa | mm 0.3 x mm 0.3 okutuuka ku mm 20 x mm 20

Sayizi za Wafer eziwagirwa | Yinsi 4 okutuuka ku yinsi 12

Ebikulu Ebikulu mu Tekinologiya

Enkola y'entambula ya Phi-Y ey'enkyukakyuka: Endowooza y'entambula ey'enjawulo eya "Phi-Y" egatta entambula ey'enzitowazo (Phi) n'entambula ya layini (Y), ekendeeza nnyo ekkubo n'obudde bw'enzirukanya y'emirimu gya Pick & Place.

"Light & Rigid" Design: Enkola empya eya pick-and-place erimu okuzimba okuzitowa ennyo n'obugumu obw'amaanyi mu nsengeka. Ng’ogasseeko okufuga enkola ey’omulembe n’enkola y’okunyogoza amazzi, ekakasa obutuufu obw’enjawulo n’okutebenkera mu kiseera ky’okukola ku sipiidi ey’amaanyi.

Comprehensive Real-Time Monitoring & Efficient Debugging: Enkola eno egaba ebifaananyi mu kiseera ekituufu eby’ebitundu bina eby’enjawulo eby’okukwatagana era erimu emirimu gy’okuyamba ku yintaneeti egy’embeera, okusobozesa abaddukanya okuzuula amangu n’okugonjoola ensobi.

Ultimate Line Changeover Efficiency: Ebitundu ebikulu bikoleddwa okusobola okukyusibwa nga tebirina bikozesebwa, mu bwangu, okukendeeza ennyo ku biseera by’okukyusa ebintu. Okugatta ku ekyo, enkola eno ewagira okukoppa amangu enkola za "ekyuma kya zaabu" ku yuniti endala, okwanguyiza okuteeka mu nkola okufulumya ebintu mu bungi n'okusobozesa okufulumya okukwatagana mu byuma ebingi.

Enteekateeka ey’okubeerawo kwa waggulu: Enkola eyongezeddwamu amaanyi n’okukyusakyusa mu biseera eby’omu maaso bituukibwako okuyita mu mpuliziganya ya Gigabit Ethernet ne dizayini ya modulo, esobola okulongoosebwa. Enkola y’okupakinga ebitonde n’okuteeka akatale mu kifo

Esec 2100 FC hS ekuwa obuwagizi obw’amaanyi eri enkola z’okupakinga:

**Broad Packaging Versatility:** Ekyuma kino kisobola okukwata emirimu mingi egya Flip Chip (FC), nga kizingiramu ebika by’okupakinga eby’enjawulo ebikulu—nga FCOL, FC-MIS, FC-SIP, FCCSP, ne FCBGA—wamu n’ebipapula ebigenda okuvaayo nga CSP-LED.

**Extensive Process Options:** Besi egaba ekibinja ekijjuvu ekya modulo ez’okwesalirawo ku kyuma kino, nga zikwata ku bitundu nga okukwata substrate, okusiiga flux, okugaba mu ngeri entuufu, emirimu gy’okulonda n’okuteeka, n’enkola z’okulaba. Kino kisobozesa yuniti okutegekebwa ku bwetaavu okutuukiriza ebyetaago by’enkola ebitongole.

**Comprehensive Automation Interfaces:** Ebyuma bino bikwatagana bulungi mu kifo ekikola semiconductor mu nkola ya automation. Tekoma ku kuwa nkola za mpuliziganya za mutindo gwa host wabula era ewagira enkola ya Wafer Mapping n’omutindo gwa E142 Strip Mapping, okusobozesa okulondoola obulungi n’okuddukanya ebibinja by’okufulumya.

Enkulaakulana ey’okuddiŋŋana

Nga layini y’ebintu bya Besi bwe yeeyongera okukulaakulana, Esec 2100 FC hS egenda eddirira mpolampola mmotoka empya; wabula olw’obusobozi bwayo obw’okukola emirimu n’okukendeeza ku nsimbi, esigala nga ekola nnyo ku katale. Ku nkola ezeetaaga obusobozi obusingako n’okubeera obw’obutuufu n’obw’otoma, abakozesa bayinza okulowooza ku bikozesebwa byayo ebiddako ebirongooseddwa:

**Esec 2100 hSi:** Yazimbibwa ku FC hS platform, model eno ereese Dual Dispensing Module empya n’omutwe gwa bonding ogw’obulungi obw’amaanyi. Okugatta ku ekyo, eriko enkola ya Up-Looking System ey’obulungi obw’amaanyi, eyongera okutumbula emitendera gyombi egy’obutuufu bw’enkola n’okukola mu ngeri ey’obwengula.

Okutwaliza awamu, Esec 2100 FC hS ya Flip Chip bonder ng’erina akatale akategeerekeka obulungi ate nga ne tekinologiya akuze. Enkola yaayo ey'enjawulo eya Phi-Y motion system ne "lightweight, high-rigidity" design biwa omulimu ogw'amaanyi ogukulembedde akatale. Nga ekwata bbalansi ennungi wakati w’obutuufu n’obwangu, eyimiridde ng’ekintu ekimanyiddwa ennyo mu kifo kya Besi ekya Flip Chip bonding portfolio era ekyali omusingi omukulu mu layini nnyingi ez’okupakinga n’okugezesa okufulumya n’okutuusa kati.