ASM flip chip bonder AMICRA NANO

AMICRA NANO eya ASM ya mutindo gwa waggulu, ekola bulungi nnyo nga flip-chip bonder. Mu butuufu, si flip-chip bonder ennyangu yokka, wabula ekyuma ekigatta emirimu gyombi egya die bonding ne flip-chip bonding, nga kikwata mu ngeri ekyukakyuka enkola ez’enjawulo ez’okusiba.

AMICRA NANO Ebintu Ebikulu n'Eby'ekikugu

Ebirimu Ennyonyola enzijuvu

Ekika ky’Ebyuma: Ultra-precision Die Bonder / Flip Chip Bonder

Obutuufu bw’omusingi: Obutuufu bw’okuteeka/okukwatagana: ±0.2 μm @ 3σ

Enkola z’okusiba: Okukwatagana okw’omugatte, Okusiba mu ngeri ya Eutectic, Okusiba kwa Laser, Okukwatagana okw’ebbugumu (TCB), Okuwonya mu UV

Puleesa y’okukwatagana: 0.1 N okutuuka ku 20 N (nga 10g okutuuka ku 2kg)

Chip Size: Ekwata chips entono ennyo, okugeza, 0.1mm x 0.1mm

Sayizi ya Substrate: Ekwata substrates okutuuka ku 300mm x 300mm

Omuwendo gw’okufulumya (UPH): Nga. Chips 200-400 buli ssaawa

Enkola y’emirimu: Windows Interface

Ebipimo by’Ebyuma: Ekigere 2.23 x 1.0 m yokka (nga ffuuti 7.3 x 3.3)

Embeera y’enkola Erimu ebisengejja bya HEPA ne jenereta ya ion, okukakasa embeera y’ekisenge ekiyonjo eky’obulongoofu obw’amaanyi.

Ebisingawo ku by’ekikugu n’okugeraageranya n’ebika ebifaanagana

Omusingi

Obutuufu bwa AMICRA NANO obuyitiridde buva ku nteekateeka yaayo ey’enjawulo: enkola nnya ez’okukuba ebifaananyi ez’obulungi obw’amaanyi zinywezeddwa ku musingi gwa granite ogw’obutonde, ate enkola endala ezifuga entambula zitambula okwetoloola kkamera zino ezitakyuka. Bw’ogattako active vibration damping n’enkola ya dynamic alignment system, kino kikakasa okuteekebwa mu butuufu.

Ebitundu by’Okusaba

Ekoleddwa okukozesebwa mu kupakinga okw’omulembe nga yeetaaga obutuufu obw’amaanyi ennyo, naddala nga esinga mu silicon photonics, okupakinga ebyuma ebirabika, chip-to-wafer, n’okugatta 2.5D/3D IC.

Ebirungi ebiri mu nkola

Ng’oggyeeko obutuufu bw’okuteeka obw’amaanyi ennyo, AMICRA NANO era ewagira enkola za AuSn eutectic bonding ez’amaanyi era erina obusobozi bw’okusiba eutectic mu kifo, okulongoosa obulungi okuyita n’omutindo gw’okuyunga.

Ebikozesebwa Ebirala Ebivaamu (Derivative Models).

Ng’oggyeeko NANO, ASMPT AMICRA series era mulimu:

NOVA Pro: Era ewagira flip-chip bonding n’obutuufu bwa ±1.0 μm, okutuuka ku bbalansi wakati wa sipiidi n’obutuufu.

AFC Plus: Eno ye die bonder ey’ekigendererwa ekya bulijjo ng’erina obutuufu bwa ±1.5 μm, ekoleddwa okujjuliza NANO series ey’omulembe.

Mu bufunze, ASM AMICRA NANO ekoleddwa okutuukiriza ebisaanyizo by’okupakinga ebisinga okusaba. Okwawukana ku byuma ebikulembeza obulungi, essira erisinga kulissa ku kutuuka ku butuufu obuyitiridde obwa ±0.2 μm, okuweereza R&D n’okufulumya okw’omulembe okw’okutabula okungi, okw’obuzito obutono mu nnimiro ez’omulembe nga silicon photonics ne AI computing.