ASM AMICRA AFC PLUS Okufa ne Flip Chip Bonder
OmuASM AMICRA AFC PLUS EKYOKUYIGAye fully automatic, high-precision die bonder ne flip chip bonder eyakolebwa mu mirimu egy’omulembe egy’okupakinga microelectronic, photonic, MEMS ne semiconductor. Enkola yaayo eya modular ewagira enkola ez’enjawulo ez’okusiba era esobola okusengekebwa okusinziira ku byetaago ebitongole ebifa, substrate n’okufulumya.
Olw’obutuufu bw’okuteeka okutuuka ku ±1.5 μm n’obudde bw’enzirukanya wansi wa sikonda 15, AFC PLUS esaanira okukozesebwa ezeetaaga okuteeka mu kifo ekinywevu, okugatta enkola okukyukakyuka n’okukwata ebitundu mu ngeri eyesigika. Enkola entuufu n'emirimu egiriwo bisinziira ku nsengeka y'ekyuma ekissiddwa.
Ebikulu ebikwata ku nsonga eno
| Omukozi w’ebintu | ASMPT AMICRA |
| Ekifaananyi | AMICRA AFC PLUS EY'OKWEGATTA |
| Ekika ky’Ebyuma | Otomatiki Die Bonder / Flip Chip Bonder |
| Obutuufu bw’okuteeka | Okutuuka ku ±1.5 μm, okusinziira ku nkola n’ensengeka |
| Obudde bwa Cycle | Wansi wa sikonda 15, okusinziira ku kukozesa |
| Endowooza y'Ekyuma | Omukutu gwa modulo era oguyinza okuteekebwateekebwa |
| Okukwatagana | Okukwatagana okutali kwa maanyi; active alignment eyinza okubaawo okusinziira ku nsengeka |
| Enkola z’okukwatagana | Okusiba die, okusiba flip chip, okusiba epoxy n’okusiba eutectic |
| Emirimu egy’okwesalirawo | Okugaba epoxy, okusiba laser oba heating plate, okuwonya UV n’okukebera oluvannyuma lw’okusiba |
Ebikwata ku nsengeka eziteekeddwamu biyinza okwawukana okusinziira ku mwaka gw'ekyuma, enkyusa ya pulogulaamu n'ensengeka eyasooka. Tukusaba otutuukirire okumanya ensengeka enzijuvu ey'ebyuma ebiriwo.
Ebikulu Ebirimu
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High-precision die placement ku nkola z’okukuŋŋaanya ezisaba
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Awagira byombi standard die bonding ne flip chip bonding
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Modular design for ebyetaago eby’enjawulo eby’okusiba n’okukwata
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Ekwatagana n’enkola eziwera ez’okusiba n’okusiba eutectic
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Esaanira okukozesebwa mu die-to-substrate ne die-to-wafer
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Enkola z’okukwata ebitundu, wafer ne substrate mu ngeri ey’otoma
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Omukutu ogukyukakyuka ogw’okunoonyereza, okukola prototyping n’okufulumya mu ngeri ey’enjawulo
Okubeerawo kw'Ebyuma n'Obuwagizi
GEEKVALUE egaba ASM AMICRA die bonding ne...flip chip okusibaebyuma okusinziira ku yinvensulo eriwo mu kiseera kino. Nga tonnasindikibwa, ekyuma ekiriwo kisobola okukeberebwa endabika, okufuga entambula, okukwatagana kw’okulaba, emirimu gy’okusindika, enkola ya pulogulaamu n’enkola eziteekeddwamu.
Tukusaba otuweereze okusaba kwo okwetaagisa, sayizi ya die, sayizi ya substrate, enkola y’okusiba, ekyetaagisa mu butuufu n’obusobozi bw’okufulumya ekigendererwa. Ttiimu yaffe ejja kukakasa oba ensengeka ya AFC PLUS eriwo esaanira enkola yo.
Saba omutemwa gwa ASM AMICRA AFC PLUS
Tuukirira GEEKVALUE okumanya obuliwo mu kiseera kino, omwaka gw’ekyuma, embeera y’ebyuma, ensengeka eziteekeddwa, ebikwata ku kwekebejja, obudde bw’okutuusa n’okuteesa ku...ASM AMICRA AFC PLUS okufa n'okukyusa chip bonder.
