ASM flip chip bonder AFC Plus nga bwe kiri

ASM AFC Plus ye Flip Chip Bonder ekula mu tekinologiya, ekola bulungi nnyo. Mu nkola, ekola nga enkola ey’ebigendererwa bibiri ekola emirimu mingi —esobola byombi standard die bonding ne flip-chip bonding —emanyiddwa olw’obutuufu bwayo obutebenkevu obwa ±1.0 μm n’okukyusakyusa enkola ennywevu. Ye nkola eyettanirwa ennyo mu nkola za R&D n’okufulumya ebintu eby’omulembe mu bungi obutono.

Ebikulu ebikwata ku: High Precision & Multifunctionality

Ekitundu | Ennyonyola enzijuvu

Ekika ky'Ebyuma | Die Bonder / Flip Chip Bonder ekola mu bujjuvu

Omusingi Obutuufu | Obutuufu bw’okukwatagana/okuteeka: ±1.0 μm @ 3σ

Obudde bwa Cycle (Per Die) | Nga. < sekondi 15

Die Size | Obuwanvu ennyo obuwagirwa: okuva ku mm 0.1 okutuuka ku mm 20

Obunene bwa Substrate/Wafer | Asobola okukwata substrates oba wafers okutuuka ku mm 300 x 300

Amaanyi g'okukwatagana (Bonding Force Range) | Efugibwa bulungi, okuva ku 10g okutuuka ku 2kg

Enkola Ezikwatagana | - Okukwatagana mu ngeri ya Eutectic

- Okugaba Epoxy

- Okuwonya UV

- Okukwatagana ne Layisi

Enkola y'okukwataganya | Ebintu ebikwata ku nsengeka eya mutindo Passive Alignment; esobola okulongoosebwa okutuuka ku Active Alignment nga osabye.

Obukyukakyuka bwayo bulagibwa butya?

Ekisumuluzo kya AFC Plus kiri mu dizayini yaayo eya modulo: esobola okukola nga Die Bonder eya bulijjo, naye ate esobola okuddamu okusengekebwa okukola nga Flip Chip Bonder.

Okugatta ebisumuluzo: Ekitundu ekikulu ekisobozesa enkola ya flip-chip ye module ya "Flip Chip Option". Module eno esobozesa enkola okukyusakyusa die, n’egiteeka ng’oludda lwayo olukola lutunudde wansi.

Okukwatagana kw’ebintu: Kuwagira enkola nnyingi ez’okusiba —omuli eutectic, epoxy dispensing, UV curing, ne laser bonding —okusuza ebintu eby’enjawulo ebya flip-chip.

High Versatility: Eddaala lyayo erya waggulu erya modularity n’okukyukakyuka bigifuula emu ku die bonders ezisinga okukyusakyusa mu kiseera kino ku katale, ezisobola okubikka ku spectrum empanvu ey’okukuŋŋaanya scenarios, okuva ku die-to-wafer okutuuka ku die-to-substrate bonding. Ebitundu Ebikulu eby’Okusaba

Nga ekozesa obutuufu bwayo obw’amaanyi ennyo n’okukyukakyuka mu nkola, AFC Plus okusinga ekola emirimu egy’omuwendo omungi nga erina ebisaanyizo ebikakali ku mutindo gw’okusiba:

Silicon Photonics: Yeewaanira ku mutindo ogw’enjawulo mu bintu eby’omulembe nga ebiweereza empuliziganya ey’amaaso ne yingini z’amaaso.

Okupakinga okw’omulembe: Esaanira okukozesebwa mu kupakinga kwa semiconductor okw’omulembe, omuli okugatta 3D n’okusiba die.

MEMS (Micro-Electro-Mechanical Systems): Esobozesa okukuŋŋaanya obulungi sensa nga accelerometers ne gyroscopes.

Ebyuma Ebirabika: Kizingiramu ebyuma bya LiDAR, VCSELs, WDM (Wavelength Division Multiplexing), microlenses, n’ebirala.

R&D ne Prototyping: Ekozesebwa nnyo mu bifo bingi eby’omulembe eby’okunoonyereza ne mu laboratory za yunivasite olw’okukyukakyuka kwayo okw’enjawulo n’obutuufu.

Mu bufunze, embeera z’okukozesa AFC Plus zaawukana nnyo ku za SHIBAURA TFC-9000 ezaayogerwako emabegako: ate nga TFC-9000 ekola ku kukola ebintu mu bungi mu bungi, AFC Plus ekuguse mu kukola ebintu ebituufu ennyo, okutabula ennyo, n’okukyukakyuka —ekigifuula ekintu ekirungi ennyo mu R&D n’okufulumya okupakinga okw’omulembe n’okukola ebintu eby’omulembe ebyuma ebikozesebwa mu kulaba.