ASM flip chip bonder AFC Plus

ASM AFC Plus waa xirmo Flip Chip ah oo tignoolaji ahaan bislaaday, aad u saxsan oo aad u sarreeya. Dhab ahaantii, waxay u adeegtaa nidaam laba-u-jeeddo leh oo dhinacyo badan leh - oo awood u leh isku-xidhka caadiga ah ee dhimashada iyo isku-xidhka jajabka - oo caan ku ah saxnaanta xasilloon ee ±1.0 µm iyo la qabsiga habka oo adag. Waa doorasho aad loo jecel yahay oo loogu talagalay codsiyada R&D iyo wax soo saarka mugga hooseeya ee alaabada heerka sare ah.

Tilmaamaha Muhiimka ah: Saxnaanta Sare & Shaqa-badan

Astaanta | Sharaxaad Faahfaahsan

Nooca Qalabka | Bonder Die / Flip Chip Bonder oo si buuxda otomaatig ah u shaqeeya

Saxnaanta Aasaasiga ah | Saxnaanta Isku-xidhka/Dejinta: ±1.0 µm @ 3σ

Waqtiga Wareegga (Qiyaastiiba) | Qiyaastii < 15 ilbiriqsi

Cabbirka Dhimista | Meelo aad u ballaaran ayaa la taageerayaa: laga bilaabo 0.1 mm ilaa 20 mm

Cabbirka Substrate/Wafer | Awood u leh inuu maareeyo substrate-ka ama wafer-ka ilaa 300 x 300 mm

Kala duwanaanshaha Xoogga Isku-xidhka | Si fiican loo xakameyn karo, oo u dhexeeya 10g ilaa 2kg

Habraacyada Iswaafajiya | - Isku-xidhka Eutectic

- Bixinta Epoxy

- Daawaynta UV-ga

- Isku xidhka laysarka

Habka Isku-dubaridka | Qaabeynta caadiga ah waxay leedahay Isku-dubarid Dadban; oo loo cusboonaysiin karo Isku-dubarid Firfircoon marka la codsado.

Sidee loo Muujiyaa Dabacsanaantiisa?

Furaha AFC Plus wuxuu ku jiraa naqshadeeda modular-ka ah: waxay u shaqayn kartaa sida Die Bonder caadi ah, haddana dib ayaa loogu habeyn karaa inay u shaqeyso sida Flip Chip Bonder.

Is-dhexgalka Muhiimka ah: Qaybta asaasiga ah ee awood u siinaysa shaqada flip-chip-ka waa module-ka "Flip Chip Option". Module-kani wuxuu u oggolaanayaa nidaamka inuu rogo laadhuuga, isagoo dhigaya dhinaciisa firfircoon oo hoos u jeeda.

Iswaafajinta Agabka: Waxay taageertaa habab badan oo isku xidhid ah - oo ay ku jiraan eutectic, qaybinta epoxy, curing UV, iyo laysarka - oo la jaanqaadaya agabyo kala duwan oo jajaban.

Kala Duwanaansho Sare: Heerkeeda sare ee modularity iyo dabacsanaanteeda ayaa ka dhigaysa mid ka mid ah xidhmooyinka ugu la qabsan kara ee hadda laga heli karo suuqa, oo awood u leh inay daboolaan noocyo badan oo xaalado isu-imaati ah, oo u dhexeeya die-to-wafer ilaa die-to-substrate isku xidhka. Meelaha Codsiga Aasaasiga ah

Iyada oo ka faa'iideysanaysa saxnaanteeda aadka u sarreysa iyo dabacsanaanta habka, AFC Plus waxay inta badan u adeegtaa codsiyada qiimaha sare leh oo leh shuruudo adag oo ku saabsan tayada isku xidhka:

Silicon Photonics: Waxay ku faantaa rikoodh la taaban karo oo ku saabsan qaybaha casriga ah sida qalabka isgaarsiinta indhaha iyo matoorada indhaha.

Baakad Sare: Ku habboon codsiyada baakadaha semiconductor-ka ee heerka sare ah, oo ay ku jiraan isku-dhafka 3D iyo isku-darka meydka.

MEMS (Nidaamyada Micro-Electro-Mechanical): Waxay awood u siisaa isku-dubaridka saxda ah ee dareemayaasha sida accelerometers iyo gyroscopes.

Qalabka Indhaha: Waxay ku wareegsan tahay aaladaha LiDAR, VCSELs, WDM (Qaybta Wavelength Multiplexing), muraayadaha yaryar, iyo waxyaabo kaloo badan.

R&D iyo Samaynta Sawirka: Si ballaaran ayaa looga isticmaalaa xarumo cilmi-baaris oo horumarsan iyo shaybaarro jaamacadeed sababtoo ah dabacsanaantiisa iyo saxnaantiisa gaarka ah.

Marka la soo koobo, xaaladaha codsiga ee AFC Plus si weyn ayay uga duwan yihiin kuwa SHIBAURA TFC-9000 ee hore looga hadlay: halka TFC-9000 ay u adeegto wax soo saar ballaaran, AFC Plus waxay ku takhasustay saxnaanta aadka u sarreysa, isku-darka sare, iyo wax soo saarka dabacsan - taasoo ka dhigaysa qalabka ugu habboon ee R&D iyo soo saarista baakadaha horumarsan iyo aaladaha optoelectronic-ka casriga ah.