ASM flip chip bond AFC Plus

ASM AFC Plus ndi Flip Chip Bonder yokhwima kwambiri paukadaulo, yolondola kwambiri. M'malo mwake, imagwira ntchito ngati njira yogwiritsira ntchito zinthu ziwiri—yokhoza kulumikiza zinthu zonse ziwiri monga die bonding ndi flip-chip bonding—yodziwika bwino chifukwa cha kulondola kwake kokhazikika kwa ±1.0 µm komanso kusinthasintha kwamphamvu kwa njira. Ndi chisankho chodziwika bwino pa ntchito za R&D komanso kupanga zinthu zapamwamba kwambiri.

Zofunika Kwambiri: Kulondola Kwambiri & Kugwira Ntchito Zambiri

Mbali | Kufotokozera Mwatsatanetsatane

Mtundu wa Zipangizo | Die Bonder Yodzipangira Yokha Yokha / Flip Chip Bonder

Kulondola kwa Pakati | Kulondola kwa Kulinganiza/Kuyika: ±1.0 µm @ 3σ

Nthawi Yozungulira (Pa Tsiku Lililonse) | Pafupifupi masekondi 15

Kukula kwa Die | Kuthandizira kwakukulu kwambiri: kuyambira 0.1 mm mpaka 20 mm

Kukula kwa Substrate/Wafer | Yokhoza kugwira ntchito ndi substrate kapena wafers mpaka 300 x 300 mm

Mphamvu Yogwirizanitsa | Yowongoleredwa bwino, kuyambira 10g mpaka 2kg

Njira Zogwirizana | - Eutectic Bonding

- Kutulutsa Epoxy

- Kuchiritsa kwa UV

- Kugwirizana kwa Laser

Njira Yogwirizanitsa | Kasinthidwe kabwino kamakhala ndi Kugwirizanitsa Kosachita Kuchitika; ikhoza kusinthidwa kukhala Kugwirizanitsa Kogwira Ntchito ngati itapemphedwa.

Kodi Kusinthasintha Kwake Kumawonetsedwa Bwanji?

Chinsinsi cha AFC Plus chili mu kapangidwe kake ka modular: imatha kugwira ntchito ngati Die Bonder wamba, koma imatha kusinthidwa kuti igwire ntchito ngati Flip Chip Bonder.

Kuphatikiza Makiyi: Gawo lalikulu lomwe limalola ntchito ya flip-chip ndi gawo la "Flip Chip Option". Gawoli limalola dongosolo kutembenuza die, ndikuyiyika mbali yake yogwira ntchito ikuyang'ana pansi.

Kugwirizana kwa Zinthu: Kumathandizira njira zosiyanasiyana zolumikizirana—kuphatikizapo eutectic, epoxy dispensing, UV curing, ndi laser bonding—zomwe zimagwirizana ndi zipangizo zosiyanasiyana zolumikizirana.

Kusinthasintha Kwambiri: Kusinthasintha kwake kwakukulu komanso kusinthasintha kwake kumapangitsa kuti ikhale imodzi mwa ma bond osinthika kwambiri omwe alipo pamsika, omwe amatha kuphimba zochitika zosiyanasiyana zomangira, kuyambira pa die-to-wafer mpaka die-to-substrate bonding.

Pogwiritsa ntchito kulondola kwake kwakukulu komanso kusinthasintha kwa njira, AFC Plus imapereka ntchito zamtengo wapatali kwambiri zomwe zimakhala ndi zofunikira zolimba kuti pakhale mgwirizano wabwino:

Silicon Photonics: Ili ndi mbiri yabwino kwambiri m'magawo apamwamba monga ma transceivers olumikizirana ndi ma optical engine.

Kupaka Kwapamwamba: Koyenera kugwiritsa ntchito ma phukusi apamwamba a semiconductor, kuphatikiza kuphatikiza kwa 3D ndi kufa stacking.

MEMS (Micro-Electro-Mechanical Systems): Imathandizira kusonkhanitsa molondola kwa masensa monga accelerometers ndi gyroscopes.

Zipangizo Zowunikira: Zimaphatikizapo zida za LiDAR, VCSELs, WDM (Wavelength Division Multiplexing), ma microlenses, ndi zina zambiri.

Kafukufuku ndi Kukonza Zinthu: Amagwiritsidwa ntchito kwambiri m'malo ambiri ofufuzira apamwamba komanso m'ma laboratories aku yunivesite chifukwa cha kusinthasintha kwake komanso kulondola kwake.

Mwachidule, zochitika zogwiritsira ntchito AFC Plus zimasiyana kwambiri ndi zomwe zidakambidwa kale za SHIBAURA TFC-9000: pomwe TFC-9000 imagwira ntchito popanga zinthu zambiri, AFC Plus imagwira ntchito popanga zinthu zolondola kwambiri, zosakanikirana kwambiri, komanso zosinthasintha—zomwe zimapangitsa kuti ikhale chida chabwino kwambiri pa kafukufuku ndi chitukuko komanso kupanga zida zamakono zopangira ma CD ndi zida zamagetsi zamakono.