ali ndi 70% pa Magawo a SMT - Mu Stock & Okonzeka Kutumiza
Pezani Quote →Pezani zida zatsopano, zogwiritsidwa ntchito komanso zokonzedwanso za die bond ndi die bonding zapamwamba kwambiri zopangira ma semiconductor packaging, assembling, substrate bonding ndi ma chip. Timapereka ma die bond oyesedwa bwino komanso okonzedwa bwino omwe ali ndi kulondola kokhazikika, magwiridwe antchito apamwamba komanso magwiridwe antchito odalirika pakupanga ma semiconductor padziko lonse lapansi.
Fufuzani makina athu a Die Bonder omwe timawafuna kwambiri, abwino kwambiri polumikiza ma chip molondola kwambiri, kukhazikitsa mzere wa SMT, kukulitsa mphamvu, komanso kukonza zinthu zotsika mtengo. Kodi simukudziwa kuti ndi mtundu uti womwe ukugwirizana ndi njira yanu? Gawani zomwe mukufuna popanga ndipo akatswiri athu adzakulangizani njira yoyenera kwambiri.
Besi Datacon 2200 APM ndi cholumikizira cha die cholondola kwambiri, chodziyimira chokha. Pogwiritsa ntchito ukadaulo wapamwamba wosankha ndi kuyika,...
Yang'anani Zomwe Zasungidwa & Mtengo
Chogwiritsiridwa ntchito cha ASM AD830 Plus die bond cha siliva epoxy die attach, chokhala ndi kuyang'anira makina, kutsimikizira zida ndi sup yapadziko lonse lapansi ...
Yang'anani Zomwe Zasungidwa & Mtengo
ESEC 2100 hS die bonder ndi nsanja yotchuka ya die bonder yothamanga kwambiri yochokera ku BESI.
Yang'anani Zomwe Zasungidwa & Mtengo
BESI Datacon 2200EVO ndi makina odziyimira okha, olondola kwambiri, komanso okhala ndi ntchito zambiri zoyika ma chip omwe amagwiritsidwa ntchito mu semico...
Yang'anani Zomwe Zasungidwa & Mtengo
ASM die bonder AD819 ndi chipangizo chapamwamba chopangira zinthu za semiconductor chomwe chimagwiritsidwa ntchito kuyika ma chips molondola pa substrates ndi ...
Yang'anani Zomwe Zasungidwa & Mtengo
ASM AD800 ndiwotchipa kwambiri ndipo imakhala ndi ntchito zambiri zapamwamba komanso mawonekedwe
Yang'anani Zomwe Zasungidwa & Mtengo
Mfundo yogwirira ntchito ya ASM die bonder AD50Pro imaphatikizapo kutentha, kugwedezeka, makina owongolera ndi zida zothandizira...
Yang'anani Zomwe Zasungidwa & Mtengo
AD420XL imapereka mayankho a Mini LED COB othamanga kwambiri komanso olondola kwambiri a LCD BLUs akuluakulu (a kuwala kwapafupi...
Yang'anani Zomwe Zasungidwa & Mtengo
Dongosolo la ASMPT la SD8312 lodzipangira lokha lofewa lopangidwa ndi solder die bonder ndi chipangizo chapamwamba chomwe chapangidwira njira ya wafer ya mainchesi 12...
Yang'anani Zomwe Zasungidwa & Mtengo
Mafotokozedwe ndi miyeso ya ASMPT yolumikizira yokha yokha ndi awa: Miyeso: W x D x H 1...
Yang'anani Zomwe Zasungidwa & Mtengo
Dongosolo la AD838l kuphatikiza ma disk bonding ndi flip chip lokha lokha ndi lolondola kwambiri komanso lothandiza kwambiri...
Yang'anani Zomwe Zasungidwa & Mtengo
Zinthu ● Ma bond atsopano a AD8312 okhala ndi mphamvu zambiri akhazikitsa miyezo yatsopano yamakampani ● Tebulo logwirira ntchito la Universal...
Yang'anani Zomwe Zasungidwa & Mtengo
Zinthu ● Kulondola ± 3 µm @ 3s ● Kutulutsa guluu/kutulutsa guluu kuti ligwirizane ● Kufufuza komwe kumachokera kuti zinthu zikhale bwino ...
Yang'anani Zomwe Zasungidwa & Mtengo
Zinthu ● Kulondola ± 12.5 µm @ 3s● Kumatha kukonza mwachindunji zinthu zadothi ● Njira yabwino komanso kapangidwe ka module ● Yodziyimira payokha...
Yang'anani Zomwe Zasungidwa & Mtengo
MRSI Systems Die Bonder ndi chinthu chopangidwa ndi Mycronic Group, chomwe chimayang'ana kwambiri pakupereka zinthu zodziwikiratu zokha komanso zolondola kwambiri...
Yang'anani Zomwe Zasungidwa & Mtengo
Besi Datacon 8800 ndi makina apamwamba olumikizirana ndi chip, omwe amagwiritsidwa ntchito kwambiri paukadaulo wa 2.5D ndi 3D, makamaka TSV ...
Yang'anani Zomwe Zasungidwa & Mtengo
Mndandanda wa AD838 wa ASMPT ndi wolumikizira wothamanga kwambiri komanso wolondola kwambiri womwe umadziwika kwambiri pamsika.
Yang'anani Zomwe Zasungidwa & MtengoDie bonder ndi makina okonzera zinthu a semiconductor olondola omwe amagwiritsidwa ntchito kusankha, kulumikiza ndi kulumikiza ma semiconductor dies pa ma substrates, ma lead frames, zonyamulira za ceramic, ma phukusi kapena ma assemblies ena amagetsi.
Ndi imodzi mwa makina ofunikira kwambiri popanga ma semiconductor packaging, LED packaging, IC assembly ndi kupanga zamagetsi apamwamba. Kwa mafakitale ambiri, kusankha die bonder yoyenera kumakhudza mwachindunji kulondola kwa ma bonding, kukolola, mphamvu yopanga komanso mtengo wopangira wa nthawi yayitali.
Makina amakono opangira ma bond apangidwa kuti akwaniritse malo okonzera ma semiconductor molondola kwambiri, magwiridwe antchito okhazikika komanso kupanga bwino nthawi zonse pamapaketi ndi zida zamagetsi.
Kuyika bwino kwambiri kwa die kumakhudza mwachindunji ubwino wa phukusi, kuchuluka kwa zokolola komanso kusinthasintha kwa kupanga.
Makina apamwamba owongolera kuwala amathandiza kukwaniritsa malo olondola a kufa komanso kubwerezabwereza kwa ma bonding.
Kupanikizika kokhazikika kwa ma bonding ndikofunikira kwambiri kuti ma die attachment akhale odalirika komanso kuti chipangizocho chigwire ntchito bwino kwa nthawi yayitali.
Ukadaulo wosiyanasiyana wogwirizanitsa umathandizira zofunikira zosiyanasiyana zomangira ndi kugwiritsa ntchito ma semiconductor.
Kutentha kolondola ndi kuwongolera kutentha kumathandiza kuti mgwirizano ukhale wabwino komanso kuchepetsa kusiyana kwa njira.
Kuthamanga kwa zotulutsa ndi kugwira ntchito bwino kwa zopanga ndi zinthu zofunika kwambiri popanga zinthu zambiri.
Ma bond a Die amagwiritsidwa ntchito kulikonse komwe die, chip kapena microelectronic component ya semiconductor ikufunika kuyikidwa molondola ndikulumikizidwa modalirika.
Pakupanga kwa IC, gwiritsani ntchito cholumikizira cha die ndi kupanga phukusi.
Zogwirizanitsa ma chip a LED, ma CD a LED ndi zinthu zamagetsi.
Kwa ma module a semiconductor amphamvu, zamagetsi zamagalimoto ndi zida zamagetsi.
Kwa masensa, zipangizo zazing'ono ndi zida zamagetsi zolondola.
Kwa ma modules a kuwala, zipangizo za laser ndi zigawo zodalirika kwambiri.
Kwa ma module a RF, ma hybrid circuits ndi ma electronics amtengo wapatali.
Ngakhale kuti mapulogalamu osiyanasiyana opangira ma semiconductor angagwiritse ntchito njira zosiyanasiyana, ntchito zambiri zogwirira ntchito zolumikizirana zimatsatira magawo angapo opanga.
Ma semiconductor dies amakonzedwa ndikulowetsedwa mu dongosolo la die bonder.
Mutu womangirira umatengera molondola die ya semiconductor.
Makina owunikira amalumikiza die ndi substrate kuti aike bwino.
Kutentha kwa epoxy kapena eutectic kumakonza malo olumikizirana.
Chophimbacho chimayikidwa pa substrate kapena phukusi molondola.
Ubwino wa mgwirizano ndi kukhazikika kwa malo ake zimawunikidwa musanapitirire kupanga.
Yoyenera kupanga ma semiconductor ndi ma LED okhala ndi voliyumu yambiri.
Njira yosinthasintha yopangira zinthu zapakatikati kapena zapadera.
Amagwiritsidwa ntchito pa kafukufuku ndi chitukuko, kupanga zitsanzo komanso kusonkhanitsa molondola kwambiri.
Amagwiritsidwa ntchito popanga ma phukusi apamwamba komanso kugwiritsa ntchito maulumikizidwe apamwamba kwambiri.
Kwa ntchito zomwe zimafuna kutentha kwambiri komanso mphamvu zamagetsi.
Zofala kwambiri pa njira zopakira ma LED, IC ndi ma semiconductor.
Kulumikiza kwa Die ndi kulumikiza kwa waya zonse ndi njira zofunika kwambiri zomangira zinthu za semiconductor, koma zimagwira ntchito zosiyanasiyana panthawi yopanga.
Monga wogulitsa zida zaukadaulo, GEEKVALUE imathandiza makasitomala kupeza die bonder yoyenera kwambiri malinga ndi bajeti, cholinga chopangira, nthawi yoperekera ndi zofunikira zaukadaulo.
Pa ntchito zatsopano zopangira, kukonzekera luso la nthawi yayitali komanso mapulojekiti opanga zinthu odalirika kwambiri.
Kwa mafakitale omwe amafunikira zida zoyesedwa, kutumiza mwachangu komanso ndalama zochepa zogulira.
Kuti zisinthidwe, kuyesedwa, mapulojekiti oyendetsedwa ndi bajeti komanso kufunikira kwa zida mwachangu.
Makasitomala asanagule chotengera cha die bonder, ayenera kuyerekeza makinawo kutengera zosowa zenizeni zopanga, osati mtundu kapena mtengo wokha.
Chongani kulondola kwa malo, kubwerezabwereza komanso kukhazikika kwa njira.
Tsimikizirani kukula kwa die, mtundu wa substrate ndi kuyanjana kwa phukusi.
Sankhani zida zodzipangira zokha, zodzipangira zokha kapena zogwiritsa ntchito pamanja kutengera mphamvu zomwe zimachokera.
Yerekezerani njira zopangira epoxy, eutectic, flip chip kapena njira zina zopangira die attach.
Zipangizo zatsopano, zogwiritsidwa ntchito komanso zokonzedwanso zimapereka ubwino wosiyanasiyana pamtengo.
Zida zosinthira, kuyang'anira, kuwunikira ndi chithandizo chogulitsa pambuyo pogulitsa ndizofunikira kwambiri.
GEEKVALUE imathandiza makasitomala kuchepetsa chiopsezo cha zida poyang'ana momwe makina alili, kayendedwe ka makina, momwe ma bonding amagwirira ntchito komanso momwe makinawo amagwirira ntchito asanatumizidwe.
Yang'anani momwe zinthu zilili kunja, umphumphu wa kapangidwe kake, komanso ukhondo wa makina.
Tsimikizirani kuyambika kwa makina, momwe makina amayankhira komanso kukhazikika kwa magwiridwe antchito.
Yang'anani kayendetsedwe ka axis, kulondola kwa malo ndi momwe makina alili.
Yang'anani makina a kamera, kulumikizana kwa kuwala ndi momwe chithunzi chikuyendera.
Yesani momwe mutu wolumikizirana umagwirira ntchito, kuwongolera mphamvu ndi luso lopanga.
Thandizani kulongedza bwino komanso kutumiza zida za semiconductor padziko lonse lapansi.
Makasitomala amasankha GEEKVALUE chifukwa timawathandiza kuthetsa mavuto enieni ogula: kupezeka kwa zida, kuwongolera ndalama, zoopsa zaukadaulo, liwiro lotumizira ndi chithandizo cha ntchito kwa nthawi yayitali.
Gawani njira yanu yopangira, zomwe mukufuna kuti mugwirizane nazo komanso bajeti yanu.
Timathandiza kufananiza mtundu, mkhalidwe, mtundu ndi zofunikira zaukadaulo.
Timatsimikiza kupezeka kwa makina, momwe alili, nthawi yotumizira ndi mtengo wake.
Kuyang'anira zida, kulongedza katundu kunja, kutumiza katundu ndi chithandizo chaukadaulo kumakonzedwa.
Die bonder ndi makina opakira zinthu a semiconductor omwe amagwiritsidwa ntchito kutola, kuyika ndi kumangirira ma dies pa substrates, mafelemu a lead, mapaketi kapena zonyamulira.
Timapereka ma epoxy die bonders, eutectic die bonders, flip chip bonders, automatic die bonders ndi zida zokonzedwanso zopangira ma semiconductor.
Inde, timapereka ma bond okonzedwa bwino, oyesedwa komanso okonzedwa bwino okhala ndi magwiridwe antchito okhazikika komanso njira zotsika mtengo zopangira ma paketi.
Kulumikiza kwa die kumalumikiza die ya semiconductor ku phukusi kapena substrate, pomwe kulumikizana kwa waya kumalumikiza die pogwiritsa ntchito mawaya achitsulo abwino.
Inde. Ma die bond okonzedwanso ndi oyenera zinthu zambiri popanga makina akayang'aniridwa, kuyesedwa ndikuthandizidwa ndi zida ndi ntchito.
Ma bond a Die amagwiritsidwa ntchito kwambiri popanga ma semiconductor packaging, IC assembly, optoelectronics, automotive chips, consumer electronics ndi zipangizo zachipatala.
Inde, timapereka zonyamula katundu zotetezeka, zida zaukadaulo komanso kutumiza katundu padziko lonse lapansi kwa zida zonse zotumizira katundu ndi zotumizira katundu.
Timapereka kukhazikitsa pamalopo, kukonza makina, kuphunzitsa ogwiritsa ntchito komanso chithandizo chaukadaulo cha nthawi yayitali cha zida zolumikizirana ndi die bonding.
Muyenera kuyerekeza kulondola kwa bonding, kukula kwa die, mtundu wa substrate, njira yobonding, kuchuluka kwa kupanga, bajeti, nthawi yotumizira ndi chithandizo chogulitsa pambuyo pogulitsa.
Mutha kulankhulana ndi gulu lathu logulitsa kudzera pa WhatsApp, fomu ya pa intaneti kapena imelo kuti muwone zomwe zili mu sheya nthawi yeniyeni, kupezeka kwake, komanso mitengo yaposachedwa ya ma bond.
Chifukwa chiyani anthu ambiri amasankha kugwira ntchito ndi GeekValue?
Mtundu wathu ukufalikira kuchokera ku mzinda kupita ku mzinda, ndipo anthu osawerengeka andifunsa, "Kodi GeekValue ndi chiyani?" Zimachokera ku masomphenya osavuta: kupatsa mphamvu luso lachi China ndi luso lamakono. Uwu ndi mzimu wodzitukumula mosalekeza, wobisika pakufunafuna kwathu tsatanetsatane komanso chisangalalo chopitilira zomwe tikuyembekezera pakubweretsa kulikonse. Mmisiri waluso komanso kudzipereka uku sikungolimbikira kwa omwe adayambitsa, komanso tanthauzo ndi kutentha kwa mtundu wathu. Tikukhulupirira kuti muyambira pano ndikutipatsa mwayi wopanga ungwiro. Tiyeni tigwire ntchito limodzi kuti tipange chozizwitsa chotsatira cha "zero defect".
ChenLumikizanani ndi katswiri wazogulitsa
Lumikizanani ndi gulu lathu lazamalonda kuti mufufuze mayankho omwe amagwirizana bwino ndi bizinesi yanu ndikuyankha mafunso aliwonse omwe mungakhale nawo.
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