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ASM die bonder AD819 ndi zida zapamwamba zonyamula za semiconductor zomwe zimagwiritsidwa ntchito kuyika tchipisi tating'onoting'ono ndipo ndi chida chofunikira kwambiri pakupanga ma bond bond.
Pezani Mtengo M'mphindi 10 | Thandizo La maola 24 pa sabata
ASM die bonder AD819 ndi zida zapamwamba zonyamula za semiconductor zomwe zimagwiritsidwa ntchito kuyika tchipisi tating'onoting'ono ndipo ndi chida chofunikira kwambiri pakupanga ma bond bond.
AD819 Series Mokwanira Automatic ASMPT Die Bonding System
Mawonekedwe
●Kutha kulongedza katundu pokonza
●Kulondola ± 15 µm @ 3s
●Eutectic die bond process (AD819-LD)
● Njira yopangira ma bond (AD819-PD)
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