ASM die bonder AD819 ndi zida zapamwamba zonyamula za semiconductor zomwe zimagwiritsidwa ntchito kuyika tchipisi tating'onoting'ono ndipo ndi chida chofunikira kwambiri pakupanga ma bond bond.
ASM die bonder AD819 ndi zida zapamwamba zonyamula za semiconductor zomwe zimagwiritsidwa ntchito kuyika tchipisi tating'onoting'ono ndipo ndi chida chofunikira kwambiri pakupanga ma bond bond.
AD819 Series Mokwanira Automatic ASMPT Die Bonding System
Mawonekedwe
●Kutha kulongedza katundu pokonza
●Kulondola ± 15 µm @ 3s
●Eutectic die bond process (AD819-LD)
● Njira yopangira ma bond (AD819-PD)
Limbikitsani ukadaulo ndi luso la Geekvalue kuti mukweze mtundu wanu pamlingo wina.
Lumikizanani ndi katswiri wazogulitsa
Lumikizanani ndi gulu lathu lazamalonda kuti mufufuze mayankho omwe amagwirizana bwino ndi bizinesi yanu ndikuyankha mafunso aliwonse omwe mungakhale nawo.
© Ufulu Onse Ndiwotetezedwa. Thandizo laukadaulo:TiaoQingCMS
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