ASM Die Bonder AD819 waa qalab baakad semiconductor ah oo horumarsan oo loo isticmaalo in si sax ah loogu dhejiyo chips substrates waana aalad muhiim u ah nidaamka dammaanadda dhimashada tooska ah
ASM Die Bonder AD819 waa qalab baakad semiconductor ah oo horumarsan oo loo isticmaalo in si sax ah loogu dhejiyo chips substrates waana aalad muhiim u ah nidaamka dammaanadda dhimashada tooska ah
AD819 Taxanaha Si Toos ah Si Toos ah u ah ASMPT Dhimashada Nidaamka
Astaamaha
●Awoodda farsamaynta baakadaha oo awood u leh
● Saxnaanta ± 15 µm @ 3s
Habka dammaanadda dhimista Eutectic (AD819-LD)
● Bixinta habka dammaanadda dhimista (AD819-PD)
Ka faa'iidayso khibrada iyo khibradda Geekvalue si kor loogu qaado astaantaada heerka xiga.
La xidhiidh khabiirka iibka
La xidhiidh kooxdayada iibka si aad u sahamiso xalal habaysan oo si fiican u daboolaya baahiyahaaga ganacsi oo aad wax uga qabato wixii su'aalo ah ee aad qabtid.
©Dhammaan Xuquuqaha way xifdiyeen. Taageerada Farsamada:TiaoQingCMS
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