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Semiconductor equipment
EWAKA>Ebyuma bya semiconductor > Ebikozesebwa mu Kusiba Die >
‌ASM die bonder AD819

ASM omukuumi AD819

ASM die bonder AD819 ye kyuma eky’omulembe eky’okupakinga semiconductor ekikozesebwa okuteeka obulungi chips ku substrates era kye kyuma ekikulu mu nkola ya automated die bond

State:Ekozesebwa In stock:have supply
Okusaba okw'amangu Email:smt-sales6@gdxinling.cn
Ebikwata ku ddyo

ASM die bonder AD819 ye kyuma eky’omulembe eky’okupakinga semiconductor ekikozesebwa okuteeka obulungi chips ku substrates era kye kyuma ekikulu mu nkola ya automated die bond

AD819 Series Enkola ya ASMPT Die Bonding Ekola mu bujjuvu

Ebintu eby'enjawulo

●TO-can okupakinga okulongoosa obusobozi

●Obutuufu ± 15 μm @ 3s

●Enkola ya eutectic die bond (AD819-LD) .

●Enkola y'okugaba die bond (AD819-PD) .

28.ASMPT fully automatic die bonding system

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Tugoberere

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Okutambulira mu Mangu

TUKUTUUKAKO

Endagiriro y’okutuukirira:

No. 18, oluguudo lw’amakolero mu Shangliao, mu kibuga Shajing, mu Disitulikiti y’e Baoan, Shenzhen, China

Ennamba y’essimu ey’okwebuuza:

+86 13480912606

Email:

smt-okutunda6@gdxinling.cn

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