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 ‌ASM die bonder AD819

ASM omukuumi AD819

ASM die bonder AD819 ye kyuma eky’omulembe eky’okupakinga semiconductor ekikozesebwa okuteeka obulungi chips ku substrates era kye kyuma ekikulu mu nkola ya automated die bond

State:Ekozesebwa In stock:have supply
Ebikwata ku ddyo

ASM die bonder AD819 ye kyuma eky’omulembe eky’okupakinga semiconductor ekikozesebwa okuteeka obulungi chips ku substrates era kye kyuma ekikulu mu nkola ya automated die bond

AD819 Series Enkola ya ASMPT Die Bonding Ekola mu bujjuvu

Ebintu eby'enjawulo

●TO-can okupakinga okulongoosa obusobozi

●Obutuufu ± 15 μm @ 3s

●Enkola ya eutectic die bond (AD819-LD) .

●Enkola y'okugaba die bond (AD819-PD) .

28.ASMPT fully automatic die bonding system

Lwaki abantu bangi basalawo okukola ne GeekValue?

Brand yaffe esaasaana okuva mu kibuga okudda mu kirala, era abantu abatabalika bambuuzizza nti, "GeekValue kye ki?" Kisibuka mu kwolesebwa okwangu: okutumbula obuyiiya bw’Abachina nga bakozesa tekinologiya ow’omulembe. Guno mwoyo gwa kika ogw’okulongoosa obutasalako, ogukwese mu kugoberera kwaffe okutasalako okukola buli kantu n’essanyu ery’okusukka ebisuubirwa buli lwe tutuusa. Obukugu buno kumpi obw’okwewaayo n’okwewaayo si kugumiikiriza kwokka kw’abatandisi baffe, wabula n’omusingi n’ebbugumu ly’ekibinja kyaffe. Tusuubira nti ojja kutandikira wano era otuwe omukisa okutondawo obutuukirivu. Tukolere wamu okutondawo ekyamagero ekiddako ekya "zero defect".

Ebikwata ku ddyo

Tuukirira omukugu mu by’okutunda

Tuuka ku ttiimu yaffe ey’abatunzi okunoonyereza ku nkola ezikoleddwa ku mutindo ogutuukana obulungi n’ebyetaago bya bizinensi yo n’okukola ku bibuuzo byonna by’oyinza okuba nabyo.

Okusaba Okutunda

Tugoberere

Sigala ng’okwatagana naffe okuzuula obuyiiya obusembyeyo, ebiweebwayo eby’enjawulo, n’okutegeera okujja okusitula bizinensi yo ku ddaala eddala.

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