What specific BESI (Datacon & Esec) die bonder configurations do you actively supply?

We supply and configure mainstream BESI platforms: BESI Datacon 2200 evo for multi-chip packaging, BESI Datacon 8800/8800 fc for sub-micron flip chip interconnects, and BESI Esec 2100 platforms for high-volume leadframe mass production.

How do you guarantee the sub-micron placement accuracy of a refurbished BESI 8800 or 2200 system?

Every pre-owned BESI system undergoes linear motor calibration, vision system adjustment, and multi-axis alignment. We perform live recipe dry runs with real substrates to match original factory tolerances before transit.

Do you supply custom Change Kits, pickup tools, and original spare parts for legacy BESI models?

Yes. We maintain a large inventory of consumables and spare parts, including pick-up collets, ejector needles, customized heating blocks, and board modules to support both current and discontinued BESI lines.

What specific BESI (Datacon & Esec) die bonder configurations do you actively supply?

We supply and configure mainstream BESI platforms: BESI Datacon 2200 evo for multi-chip packaging, BESI Datacon 8800/8800 fc for sub-micron flip chip interconnects, and BESI Esec 2100 platforms for high-volume leadframe mass production.

How do you guarantee the sub-micron placement accuracy of a refurbished BESI 8800 or 2200 system?

Every pre-owned BESI system undergoes linear motor calibration, vision system adjustment, and multi-axis alignment. We perform live recipe dry runs with real substrates to match original factory tolerances before transit.

Do you supply custom Change Kits, pickup tools, and original spare parts for legacy BESI models?

Yes. We maintain a large inventory of consumables and spare parts, including pick-up collets, ejector needles, customized heating blocks, and board modules to support both current and discontinued BESI lines.

Can your configured BESI die bonders support automotive-grade or specialized MEMS applications?

Absolutely. Depending on your packaging layouts—whether complex COB, RF modules, automotive optoelectronics, or delicate MEMS sensors—we customize the handling and process modules to protect sensitive components.

What is your typical delivery lead time, and how can we request a detailed technical quote?

In-stock BESI bonders require 2-4 weeks for testing and integration. Systems are vacuum-packed in ESD bags and wooden cases. Contact our team via WhatsApp with package drawings for a formal quotation.

BESI The Bonder

Makina atsopano, ogwiritsidwa ntchito komanso okonzedwanso a BESI die bonder a LED, IC, MEMS, optoelectronics, power semiconductor ndi kupanga ma phukusi apamwamba. Timathandiza makasitomala kupeza makina oyenera mwachangu, kuchepetsa chiopsezo chogula ndikubwezeretsa mphamvu zopangira.

Yang'anani Zomwe Zili M'sitolo & Pezani Mtengo → Onani Mavuto a Makasitomala →

Ma Model Ovuta Kupeza Thandizani cholowa ndi chofulumira cha BESI die bonder sourcing.

Chiwopsezo Chochepa cha Kuyika Ndalama Kuyang'anira, kuyesa ndi kuyang'anira momwe zinthu zilili musanatumize.

Othandizira ukadaulo Kupeza zida, upangiri wa makina ndi chithandizo chopangira.

10+ Zaka Zambiri Zogwira Ntchito pa Zida za Semiconductor

30+ Mayiko Otumikiridwa Padziko Lonse

3-7 Kutumiza Kwachangu Padziko Lonse Kwa Masiku Onse Kuti Kupezeke

24H Kuthandizira Kufananiza Kwachangu ndi Chitsanzo

Zomwe Zikupezeka pa BESI

Makina Odziwika a BESI Die Bonder & Zosankha Zopezera Zinthu

Fufuzani njira zathu zamakono zogwiritsira ntchito BESI die bonding zomwe zakhala zikugulitsidwa kale, kugwiritsidwa ntchito, komanso kukonzedwanso, kuphatikizapo mndandanda wa Datacon ndi Esec. Dongosolo lililonse likhoza kukonzedwa mwamakonda ndi zida zapadera zosinthira, ma module owunikira maso, ndi zida zonyamula kuti zigwirizane bwino ndi mzere wanu wolongedza.

Simukupeza mtundu wa BESI Datacon kapena Esec womwe mukufuna? Titumizireni zizindikiro zanu za phukusi (BGA, QFN, LGA) ndi ma specs a alignment. Mainjiniya athu adzagwirizana ndi dongosolo labwino kwambiri ndikuyang'anira zinthu zotumizira kunja padziko lonse lapansi.

Datacon 8800 CHAMEO Advanced Die Bonder

Besi Datacon 8800 CHAMEO Advanced ndi cholumikizira cha die cham'badwo wotsatira chomwe chapangidwira ma semiconductor apamwamba...
Yang'anani Zomwe Zasungidwa & Mtengo
Makina Olumikizira a Besi Datacon 8800 FC QUANTUM Advanced Die Bonding

Besi Datacon 8800 FC QUANTUM Advanced ndi galimoto yopangidwa ndi automated die bonder yokhala ndi mphamvu zambiri, yopangidwira makamaka galimoto ya m...
Yang'anani Zomwe Zasungidwa & Mtengo
BESI Datacon 2200 EVO kufa chomangira makina

BESI Datacon 2200EVO ndi makina odziyimira okha, olondola kwambiri, komanso okhala ndi ntchito zambiri zoyika ma chip omwe amagwiritsidwa ntchito mu semico...
Yang'anani Zomwe Zasungidwa & Mtengo
BESI ESEC 2100 hS BESI Die Bonder

ESEC 2100 hS die bonder ndi nsanja yotchuka ya die bonder yothamanga kwambiri yochokera ku BESI.
Yang'anani Zomwe Zasungidwa & Mtengo
koma makina opangira ams-x

BESI's AMS-X mold makina ndi makina opangira ma servo hydraulic mold omwe ali ndi zabwino zambiri komanso mawonekedwe.
Yang'anani Zomwe Zasungidwa & Mtengo
ndi makina omangira a MMS-X

Makina opangidwa ndi BESI a MMS-X ndi makina opangidwa ndi manja a makina opangidwa ndi AMS-X. Amagwiritsa ntchito makina osindikizira mbale omwe apangidwa kumene...
Yang'anani Zomwe Zasungidwa & Mtengo
IRON Die Bonding Machine Datacon 8800

Besi Datacon 8800 ndi makina apamwamba olumikizirana ndi chip, omwe amagwiritsidwa ntchito kwambiri paukadaulo wa 2.5D ndi 3D, makamaka TSV ...
Yang'anani Zomwe Zasungidwa & Mtengo

MAWU OVUTA KWA KASITOMALA

Mavuto Ofala Mukamagula BESI Die Bonders

Ogula ambiri samangofuna makina okha, koma amafunikira kupanga kokhazikika, nthawi yochepa yogulira, chiopsezo chochepa komanso chithandizo chodalirika mutagula.

Nthawi Yaitali Yotsogolera Kuchokera ku Zida Zatsopano

Mapulani ambiri opanga zinthu sangayembekezere miyezi ingapo kuti apeze bond yatsopano. Makasitomala amafunika kupeza zinthu mwachangu kuti awonjezere mphamvu zawo mwachangu kapena kuti asinthe.

Ma Model Akale Ovuta Kupeza

Mizere yakale yopangira nthawi zambiri imafuna mitundu yogwirizana ya BESI, koma zoyimitsidwa kapena makonzedwe enaake ndi ovuta kupeza pamsika.

Mtengo Wokwera wa Zipangizo Zatsopano

Zipangizo zatsopano zopakira zinthu za semiconductor zimafuna ndalama zambiri. Ma bond a BESI omwe agwiritsidwa ntchito kapena kukonzedwanso angathandize kuchepetsa bajeti ya zida.

Mkhalidwe Wosamveka wa Makina Ogwiritsidwa Ntchito

Ogula akuda nkhawa ndi mavuto obisika monga kuwonongeka kwa axis, mavuto a maso, zolakwika za mapulogalamu, kusowa kwa zida ndi kulondola kosakhazikika kwa ma bonding.

Kusowa kwa Thandizo la Ukadaulo

Ogulitsa ena amagulitsa makina okha koma sangathandizire kusankha mitundu, kuyang'anira, kupeza zida kapena kuphatikiza kupanga.

Kupanikizika kwa Nthawi Yopuma Yopanga

Ngati bond yotayika yalephera, tsiku lililonse lopuma lingakhudze nthawi yotumizira katundu, maoda a makasitomala, ndi mtengo wopangira.

Kugwirizana kwa Die Kuyika bwino kwambiri pokonza ma semiconductor

ZIMENE TIMAKONZA

Osati Wogulitsa Makina Okha — Wothandizana ndi Zida Zothandizira Kukonza Ma Die Bonding

GEEKVALUE imathandiza opanga ma semiconductor kupeza ma BESI die bond oyenera kutengera zomwe akufuna kupanga, momwe makinawo alili, bajeti yawo, komanso nthawi yotumizira.

Timayang'ana kwambiri kuthetsa zoopsa zenizeni zogulira: ngati mtunduwo ndi woyenera, ngati makinawo ali bwino, ngati zida ndi chithandizo chaukadaulo zilipo, komanso ngati zidazo zingathandize kupanga zinthu zikafika.

Kufananiza Chitsanzo Perekani chitsanzo choyenera cha BESI die bonder kutengera mtundu wa phukusi ndi zosowa za njira.

Kuyang'anira Makina Yang'anani machitidwe ofunikira musanatumize kuti muchepetse chiopsezo chobisika chogula.

Chithandizo cha Zigawo Thandizani kupeza zida zofunika kwambiri zokonzera ndikugwiritsa ntchito kwa nthawi yayitali.

Kutumiza Padziko Lonse Kulongedza katundu kunja ndi chithandizo cha kutumiza katundu kumayiko ena kwa zida za semiconductor.

CHIFUKWA CHIYANI SANKHANI IFE?

Chifukwa Chake Makasitomala Amagula BESI Die Bonders Kuchokera ku GEEKVALUE

Timamanga tsamba lozungulira zoopsa za makasitomala, osati mawu opanda pake. Cholinga chake ndikupangitsa ogula kumva kuti mavuto awo enieni angathe kuthetsedwa.

Kupeza Masheya Mwachangu

Timathandiza makasitomala kupeza ma BESI die bond omwe alipo mwachangu, makamaka ngati asinthidwa mwachangu, mizere yakale komanso mitundu yosiyidwa.

Kuyendera Musanatumize

Timayang'ana mawonekedwe a makina, momwe makina amayatsira, kayendedwe ka makina, mawonekedwe, mapulogalamu, ndi ntchito zazikulu tisanatumize kunja.

Zosankha Zotsika Mtengo

Ma bond a BESI omwe agwiritsidwa ntchito komanso kukonzedwanso amathandiza makasitomala kuchepetsa ndalama zomwe amagwiritsa ntchito pa zipangizo zawo komanso kusunga mphamvu zopangira zinthu.

Uphungu waukadaulo

Timathandizira kusankha mtundu, kufananiza njira ndi kukambirana za kasinthidwe ka makina musanagule.

Chithandizo cha Zida Zosinthira

Kwa mitundu yakale ya BESI die bonder, kupezeka kwa zida zosinthira ndikofunikira kwambiri. Timathandiza makasitomala kupeza zida ndikuchepetsa chiopsezo cha nthawi yogwira ntchito.

Kutumiza ndi Kutumiza Kunja

Zipangizo za semiconductor zimafuna kulongedza bwino, kukhazikika kwa zinthu komanso kusamalidwa mosamala kuti ziperekedwe kunja.

NTCHITO

Mapulogalamu a BESI Die Bonders

Ma BESI die bonders amagwiritsidwa ntchito kwambiri popanga ma semiconductor association, ma packaging apamwamba komanso njira zolumikizira ma die molondola kwambiri.

Kugwirizana kwa LED Die Kuti mupange ma LED, malo ogwirira ntchito mwachangu komanso kuti mupange zinthu zokhazikika.

Kupaka kwa IC Mayankho omangirira a die a ma circuit a integrated circuit assembly ndi ma packaging line.

Kupaka kwa MEMS Amagwiritsidwa ntchito pa masensa, zida zazing'ono komanso ma module amagetsi olondola.

Zipangizo zamagetsi Chithandizo cha zida zowunikira, ma photonics ndi ma microelectronics apamwamba.

Semiconductor ya Mphamvu Yoyenera ma module amphamvu, zamagetsi zamagalimoto ndi zida zodalirika kwambiri.

Zipangizo za RF Cholumikizira cholondola cha ma module a RF ndi zida zolumikizirana.

Kupaka kwa COB Ma phukusi a chip-onboard a ma module amagetsi ndi mapulogalamu apadera.

Kupaka Patsogolo Kwa ma CD ovuta a semiconductor ndi mizere yopangira yamtengo wapatali.

MIYEZO YOYENERA

Momwe Timachepetsera Chiwopsezo Tisanatumize

Zipangizo za semiconductor zomwe zagwiritsidwa ntchito ziyenera kuyang'aniridwa mosamala musanagule. Njira yathu yowunikira imathandiza makasitomala kumvetsetsa momwe makina alili komanso kuchepetsa mavuto osayembekezereka akatumizidwa.

Kuyang'ana Kowoneka

Yang'anani momwe kunja kulili, ukhondo, kukwanira kwa makina, zophimba, mapanelo ndi zingwe.

Mayeso Ogwiritsa Ntchito Mphamvu

Tsimikizani kuyambika, chiwonetsero, mawonekedwe owongolera ndi momwe dongosolo limayankhira.

Kuyang'ana Kachitidwe Koyenda

Yang'anani kayendetsedwe ka axis, momwe siteji ilili, kukhazikika kwa makina ndi phokoso losazolowereka.

Kuyang'ana Kachitidwe ka Masomphenya

Yang'anani momwe kamera, kuwala, kulumikizana, ndi momwe chithunzi chimazindikiridwira.

Kuyang'ana Ntchito Yogwirizanitsa

Unikani mutu wolumikizirana, kulondola kwa malo, vacuum, chotenthetsera ndi ma module okhudzana ndi njira.

Kuyang'ana Mapulogalamu

Tsimikizirani momwe mapulogalamu amagwirira ntchito, kutsitsa maphikidwe, mbiri ya alamu ndi ntchito zowongolera.

ZOSANKHA ZOPEREKA

Zosankha Zatsopano, Zogwiritsidwa Ntchito & Zokonzedwanso za BESI Die Bonder

Makasitomala osiyanasiyana ali ndi zofunikira zosiyanasiyana pa bajeti, kutumiza ndi kupanga. Timathandiza kufananiza njira yabwino kwambiri yogulira.

BESI Yatsopano The Bonder

Yoyenera kukonzekera mzere watsopano wopanga komanso kukulitsa mphamvu kwa nthawi yayitali.

Kapangidwe katsopano ndi kukonzekera kwa nthawi yayitali
Zabwino pa ntchito zokhazikika zopangira zinthu zambiri
Mtengo wokwera wa ndalama
Kupereka nthawi yayitali kungafunike

BESI Die Bonder Yogwiritsidwa Ntchito

Yoyenera kusinthidwa mwachangu, kupanga mizere yakale komanso kuwongolera bajeti.

Ndalama zochepa zogulira zida
Kutumiza mwachangu ngati katundu alipo
Yabwino kwambiri pobwezeretsa mphamvu mwachangu
Mkhalidwe wa makina uyenera kuyang'aniridwa mosamala

BESI Die Bonder Yokonzedwanso

Njira yoyenera kwa makasitomala omwe amafunikira mtengo wotsika komanso kukonzekera bwino makina.

Yankho lopanga lotsika mtengo
Kuyang'anira ndi kukonza musanatumize
Kuwongolera zoopsa bwino kuposa zida zogwiritsidwa ntchito zosadziwika
Yoyenera kukulitsa kupanga

Ma Model Otchuka

Ma Model Otchuka a BESI Die Bonder Omwe Tingathandize

Kupezeka kwa zinthu kumasintha pafupipafupi. Lumikizanani nafe kuti muwone zomwe zilipo pakali pano, momwe zinthu zilili komanso nthawi yomwe zinthuzo zidzaperekedwere.

BESI Datacon 2200 evo Pulatifomu yotchuka ya die bond yogwiritsira ntchito ma phukusi a semiconductor.

IRON Datacon 8800 Njira yolumikizirana ya die bonding yapamwamba kwambiri yopangira ma phukusi apamwamba.

BESI Datacon 2200 apm Amagwiritsidwa ntchito m'malo osiyanasiyana opangira zinthu zomangira ndi zomangira.

BESI Datacon 8800 fc Yoyenera kugwiritsa ntchito flip chip ndi njira zamakono zokhudzana ndi ma CD.

Chiwombankhanga chachitsulo Amagwiritsidwa ntchito popanga ma die attach othamanga kwambiri komanso popanga ma semiconductor apamwamba.

Machitidwe a BESI a Ma Module Ambiri Machitidwe osinthasintha opangira zinthu zovuta komanso mizere yopangira zinthu modular.

Ma Model a LED Die Bonder Chithandizo chofananiza chitsanzo cha zofunikira pakupanga ma CD a LED.

Ma Model a BESI Akale Chithandizo cha mitundu yopangira yomwe yasiyidwa kapena yomwe ili yovuta kupeza.

ZIGAWO & CHITHANDIZO

Chithandizo Sichimaima Pambuyo Pogula Zida

Kwa mafakitale a semiconductor, kupezeka kwa zida kwa nthawi yayitali ndikofunikira kuposa kugula kamodzi kokha.

Chithandizo cha Zida za BESI Die Bonder

Zipangizo zosinthira ndizofunikira kwambiri pa ma bond akale a BESI komanso ogwiritsidwa ntchito. Timathandiza makasitomala kupeza zinthu zofunika kuti achepetse chiopsezo cha nthawi yogwira ntchito.

Kamera ndi zida zokhudzana ndi masomphenya
Kugwirizanitsa mutu ndi zinthu zokhudzana ndi kuyenda
Zigawo zokhudzana ndi vacuum ndi heater
Mabodi amagetsi ndi ma module owongolera
Zogwiritsidwa ntchito ndi zida zosamalira wamba

Uphungu waukadaulo

Tisanagule, timathandiza makasitomala kumveketsa bwino zofunikira pa ndondomekoyi ndikupewa kugula zinthu zolakwika.

Kusankha chitsanzo kutengera njira yopangira
Kuwunika momwe makina ogwiritsidwa ntchito alili
Kufananiza kasinthidwe ndi mapulogalamu
Kutumiza katundu ndi chithandizo cha kutumiza katundu kunja
Kulankhulana kwakutali kwa mafunso aukadaulo

CHIDZIWITSO CHA ZOFUNIKA PA NTCHITO ZAUKULU

BESI Die Bonder Sourcing & Integration FAQs

Mayankho a akatswiri aukadaulo okhudzana ndi makonzedwe a nsanja ya BESI (Datacon/Esec), kuwerengera kwa sub-micron, ndi kupezeka kwa magawo a turnkey.

Kodi ndi ma configurations ati enieni a BESI (Datacon & Esec) die bonder omwe mumapereka mwachangu?

Timapereka, kukonza, ndikukonza mapulatifomu akuluakulu a BESI olondola kwambiri. Pa ma multi-chip bonding, advanced flip chip, ndi flexible epoxy/eutectic dispensing, tikupangira izi.BESI Datacon 2200 evo ndi apm mndandandaKuti tipeze ma sub-micron tolerances olondola kwambiri komanso TCB (Thermo-Compression Bonding), tili ndiBESI Datacon 8800 ndi 8800 fc mndandandaKuti tigwiritse ntchito ma leadframe opangidwa ndi anthu ambiri, timaperekaMndandanda wa BESI Esec 2100 ndi nsanja za Eagle, yokonzedwa ndi zida zinazake zotengera kuti muteteze zolinga zanu za OEE.

Kodi mungatsimikizire bwanji kuti malo osungira ma micron a sub-micron ndi olondola pa makina okonzedwanso a BESI 8800 kapena 2200?

Pulatifomu iliyonse ya BESI yomwe idagwiritsidwa ntchito kale imadutsa munjira yotsimikizira uinjiniya wa mfundo zambiri. Akatswiri athu okonza mapaketi amachita kuwerengera kwathunthu kwa mota, kulinganiza kwa makina owonera bwino, komanso kuwunika kobwerezabwereza mayendedwe. Tisanatumize zinthu kunja, timayendetsa njira zowuma pogwiritsa ntchito njira zokhazikika kuti tiwonetsetse kuti makinawo akusunga zofunikira zoyambirira za fakitale, kupereka malipoti omveka bwino otsimikizira makanema kwa gulu lanu la uinjiniya.

Kodi mumapereka zida zosinthira, zida zonyamulira, ndi zida zoyambira za mitundu yakale ya BESI?

Inde. Kuchepetsa nthawi yogwira ntchito kwa mzere panthawi yosintha kukula kwa ma chip ndiye cholinga chathu chachikulu. Timasunga zinthu zambiri zosungiramo zinthu zogwiritsidwa ntchito komanso zida zosinthira zopangidwa mwamakonda zomwe zimagwirizana ndi machitidwe a BESI. Izi zikuphatikizapo ma pick-up collets apadera, ejector needles, heating blocks, vacuum transducers, ndi ma mainboard control modules. Timaonetsetsa kuti ngakhale mizere yopangira ya BESI yomwe yasiyidwa kapena yakale imalandira chithandizo cha turnkey hardware.

Kodi ma BESI die bond anu okonzedwa angathandize mapulogalamu a MEMS a automotive-grade kapena apadera?

Inde. Kutengera ndi mapangidwe anu a ma CD—kaya ndi ovuta kugwiritsa ntchito Chip-on-Board (COB), ma RF modules, automotive optoelectronics, kapena masensa ofooka a MEMS—timasintha ma module oyendetsera ndi kukonza makina a BESI. Timayika ma valve operekera, malaibulale ozindikira maso, ndi zowongolera mphamvu ya bond kuti zigwire zinthu zobisika popanda kusweka kwa kupsinjika kapena zolakwika m'mapangidwe.

Kodi nthawi yanu yoperekera katundu nthawi zambiri imakhala yotani, ndipo tingapemphe bwanji mtengo waukadaulo wokwanira?

Pa ma bond a BESI omwe alipo, kukonzekera kwachizolowezi, kuyesa mapulogalamu, ndi kuphatikiza zida zapadera kumafuna milungu iwiri mpaka inayi. Makina onse amatsekedwa ndi vacuum ndi matumba oteteza olemera (ESD) ndipo amaikidwa m'matumba amatabwa olimbikitsidwa ochokera kunja. Kuti muwone ngati alipo nthawi yeniyeni ndikulandira mtengo wopikisana wa FOB/CIF, chonde dinani ulalo wathu wa WhatsApp kapena tumizani zojambula zanu za phukusi ndi zolinga zanu zopanga mwachindunji ku gulu lathu logulitsa.