Bonder Yopangidwa Mwaluso Kwambiri ya Multi-Chip Die Packaging Yotsogola ya Semiconductor
Besi Datacon 8800 CHAMEO Advanced ndi galimoto yolondola kwambiri ya m'badwo watsopanowogwirizanitsaYapangidwira ma CD apamwamba a semiconductor, ma CD a fan-out packaging a wafer-level (WL-FOP), kuphatikiza kosiyanasiyana, ndi 3D IC assembly. Imaphatikiza kulondola kwapadera kwa malo, kusinthasintha kwa njira, komanso zokolola zambiri zopangira zinthu zomwe zimafuna kwambiri ma CD.

Chifukwa Chiyani Sankhani Datacon 8800 CHAMEO Advanced?
Kulondola kwambiri kwa malo
Mphamvu yosonkhanitsira ma chip ambiri
Chithandizo chapamwamba cha ma phukusi otulutsa fan
Kugwirizana kwa mgwirizano wosakanizidwa wokonzeka mtsogolo
Kusamalira zinthu zofewa
Kapangidwe ka kupanga kopindulitsa kwambiri
Magwiridwe antchito okhazikika a nthawi yayitali opanga
Yopangidwira Ukadaulo Wapamwamba Wopaka Mapaketi
Datacon 8800 CHAMEO Advanced yapangidwa makamaka kuti igwiritsidwe ntchito pa:
Phukusi Lotulutsira Fan-Out la Wafer (WL-FOP)- Njira zazikulu zotulutsira ma fan zomwe zimafuna malo okonzera ma die ndi kuwongolera kuchuluka kwa ma coefficients.
Kuphatikiza kwa 2.5D ndi 3D IC- Imathandizira kuphatikiza kosiyanasiyana komanso mapangidwe a through-silicon-via (TSV).
Msonkhano wa Ma Module a Ma Chip Ambiri- Kusonkhanitsa bwino ma dies angapo mu phukusi limodzi.
Zipangizo Zamakono Zogwiritsira Ntchito AI ndi Zapamwamba- Kulumikizana kwabwino kwambiri komanso kulondola kwambiri.
Kupaka kwa RF ndi Sensor- Kulondola kwa kulinganiza ndikofunikira kwambiri pakugwira ntchito kwa chipangizocho.
Ukadaulo Wapakati
High-Precision Vision Alignment System– Kamera ya 4 MP yokhala ndi ma algorithm apamwamba okonzera zolakwika nthawi yeniyeni.
Kukonza Pamodzi kwa Ma Robot Awiri- Ntchito zosankha ndi kukhazikitsa nthawi imodzi komanso zogwirizanitsa zimapangitsa kuti ntchito ziyende bwino.
Kulamulira Njira Zanzeru- Imayang'anira mphamvu yolumikizirana, kutentha, nthawi, ndi kulondola kwa malo.
Ukadaulo Wogwirizana Wosinthasintha- Imathandizira flip-chip, face-up, multi-chip, ndi thermo-compression bonding.
Mafotokozedwe Ofunika Kwambiri a Ukadaulo
| yamTit | Kachitidwe |
|---|---|
| Kulondola kwa Malo Padziko Lonse | ±5 μm @ 3 Sigma |
| Kulondola kwa Malo Omwe Ali M'deralo | ±3 μm @ 3 Sigma |
| Written apit | Mpaka 6,000 - 7,000 UPH |
| Dongosolo la Masomphenya | Kulinganiza kwa Liwiro Lalikulu la Megapixel 4 |
| Njira Zolumikizirana | Flip-Chip / Face-Up / Multi-Chip |
| Chithandizo cha Wafer | Mpaka 300 mm |
| Thandizo la FO-WLP | Mapanelo Ofika pa 340 mm |
| Kugwirizana kwa Chipinda Choyera | Kalasi 5 ya ISO |
| Kuwongolera Njira | Yokonzedwa Mokwanira |
| Thandizo Lapamwamba Lopaka | Inde |
Ubwino wa Opanga Ma Semiconductor
Zokolola Zabwino- Amachepetsa zolakwika zoyika kuti pakhale mtundu wokhazikika wopanga.
Kusinthasintha Kwambiri kwa Njira- Imathandizira mitundu yambiri ya ma phukusi pa nsanja imodzi.
Kupanga Zinthu Zotsimikizira Zamtsogolo- Wokonzeka kulumikizana ndi mibadwo yotsatira.
Kuchepa kwa Chiwopsezo cha Kupanga- Kuwunika mwanzeru kumatsimikizira kudalirika kwa nthawi yayitali.
Zosankha za Zida Zomwe Zilipo
Datacon 8800 CHAMEO Yokonzedwanso
Machitidwe Oyesedwa Mokwanira
Zida Zokonzeka Kupanga
Thandizo Lokhazikitsa Padziko Lonse
Kupereka Zigawo
Thandizo la Uinjiniya
Thandizo la Kukonza Njira
Datacon 8800 CHAMEO vs Traditional Die Bonder
| Mbali | Datacon 8800 CHAMEO | Wachizolowezi The Bonder |
|---|---|---|
| Kupaka Patsogolo | ✓ | Zochepa |
| Kupaka Ma Fan-Out | ✓ | Zochepa |
| Msonkhano wa Ma Chip Ambiri | ✓ | Zochepa |
| Kuphatikiza kwa 3D IC | ✓ | Zochepa |
| Kugwirizana Kosakanikirana Kokonzeka | ✓ | Ayi |
| Kuyika Kulondola | ±3 μm | ±10~20 μm |
| Kuwonjezeka kwa Tsogolo | Zabwino kwambiri | Wocheperako |
Zipangizo Zogwirizana
Zipangizo Zogwirizanitsa Zosakanikirana
Zipangizo Zapamwamba Zokonzera
Machitidwe Oyendetsera Ma Wafer
BESI The Bonder
Mafunso Ofunsidwa Kawirikawiri pa Datacon 8800 Die Bonder
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Kodi Datacon 8800 CHAMEO Advanced imagwiritsidwa ntchito pa chiyani?
Amagwiritsidwa ntchito makamaka pa ntchito zapamwamba zopaka ma semiconductor kuphatikiza kupakidwa kwa fan-out, kusonkhana kwa ma chip ambiri, kuphatikiza kosiyanasiyana, komanso kupanga 3D IC.
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Kodi dongosololi limathandizira kulumikizana kwa flip-chip?
Inde. Nsanjayi imathandizira njira zonse ziwiri zolumikizirana ndi flip-chip komanso face-up die bonding.
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Kodi kulondola kotani komwe kungachitike?
Dongosololi limapereka kulondola kwa malo ofikira mpaka ±3 μm pa 3 Sigma.
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Kodi ndi yoyenera kulongedza zinthu zomwe zimagulitsidwa ngati wafer?
Inde. Makinawa adapangidwa mwapadera kuti athandizire ma phukusi apamwamba kwambiri a wafer-level fan-out.
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Kodi nsanjayi ingathandize njira zolumikizirana zamtsogolo?
Pulatifomu yaukadaulo ya CHAMEO imagwira ntchito ngati maziko a chitukuko cha maubwenzi osakanikirana mtsogolo komanso ukadaulo wapamwamba wophatikizana.
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Kodi mumapereka makina okonzedwanso a Datacon 8800 CHAMEO Advanced?
Inde. Makina okonzedwanso komanso okonzeka kupanga akhoza kupezeka kutengera momwe zinthu zilili.












