What is the Datacon 8800 CHAMEO Advanced used for?

It is primarily used for advanced semiconductor packaging applications including fan-out packaging, multi-chip assembly, heterogeneous integration, and 3D IC manufacturing.

Does the system support flip-chip bonding?

Yes. The platform supports both flip-chip and face-up die bonding processes.

What placement accuracy can be achieved?

The system delivers up to ±3 μm local placement accuracy at 3 Sigma.

Is it suitable for wafer-level fan-out packaging?

Yes. The machine was specifically developed to support high-precision wafer-level fan-out packaging applications.

Can the platform support future hybrid bonding processes?

The CHAMEO technology platform serves as a foundation for future hybrid bonding developments and advanced integration technologies.

Do you provide refurbished Datacon 8800 CHAMEO Advanced systems?

Yes. Refurbished and production-ready systems may be available depending on inventory status.

GURIGA>Qalabka semiconductor > BESI The Bonder >

Datacon 8800 CHAMEO Advanced Die Bonder

Besi Datacon 8800 CHAMEO Advanced waa qalab casri ah oo loogu talagalay baakadaha semiconductor-ka ee horumarsan, baakadaha taageeraha heerka wafer-ka (WL-FOP), is-dhexgalka kala duwan, iyo isu-imaatinka 3D IC.

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Tilmaan

Baakad Dhimis ah oo Aad u Saxsan oo loogu talagalay Baakad Semiconductor Sare

Besi Datacon 8800 CHAMEO Advanced waa jiilka xiga ee saxnaanta sare lehxidhitaankaloogu talagalay baakadaha semiconductor-ka ee horumarsan, baakadaha taageeraha heerka wafer-ka (WL-FOP), isdhexgalka kala duwan, iyo isu-imaatinka 3D IC. Waxay isku daraysaa saxnaanta meelaynta gaarka ah, dabacsanaanta habka, iyo wax-soo-saarka sare ee jawiga wax-soo-saarka semiconductor-ka ee ugu baahida badan.

Besi Die Bonder Datacon 8800 CHAMEO advanced

Maxaad u dooratay Datacon 8800 CHAMEO Advanced?

Saxnaanta meelaynta aadka u sareysa
Awoodda isu-imaatinka jajabyo badan
Taageerada baakadaha taageere-bixiyaha ee horumarsan
Iswaafajinta isku-xidhka isku-dhafka ah ee mustaqbalka diyaar u ah
Maareynta substrate-ka dabacsan
Naqshad wax soo saar sare leh
Waxqabadka wax soo saarka muddada dheer ee deggan

Loogu talagalay Tiknoolajiyada Baakadaha ee Sare

Datacon 8800 CHAMEO Advanced waxaa si gaar ah loogu sameeyay:

Baakadda Fan-Out-ka Heerka Wafer-ka (WL-FOP)- Habab ballaaran oo loox iyo heer wafer ah oo u baahan meelaynta saxda ah ee dhimaha iyo xakamaynta wax soo saarka.
Is-dhexgalka IC-ga 2.5D iyo 3D- Waxay taageertaa isdhexgalka kala duwan iyo qaab-dhismeedka iyada oo loo marayo silicon-via (TSV).
Isku-dubaridka Module-ka Chip-ka badan– Isu-imaatinka hufan ee meydadka badan ee hal xirmo ah.
Qalabka AI iyo Qalabka Xisaabinta Waxqabadka Sare leh- Isku-xirka isku-xirka aadka u fiican iyo saxnaanta isku-xirnaanta sare.
Baakadda RF iyo Dareemaha- Saxnaanta isku-xidhka ayaa muhiim u ah waxqabadka qalabka.

Tiknoolajiyada Muhiimka ah

Nidaamka Isku-habaynta Aragga Saxda ah ee Sare– 4 MP kamarad oo leh algorithms horumarsan sixitaanka khaladaadka waqtiga-dhabta ah.
Habaynta Isbarbardhigga ee Laba-Robot- Hawlgallada isku-xidhka iyo soo-qaadista isku mar waxay horumariyaan wax-soo-saarka.
Xakamaynta Habka Caqliga leh- Waxay la socotaa xoogga isku xidhka, heerkulka, waqtiga, iyo saxnaanta meelaynta.
Tiknoolajiyada Isku-xidhka Dabacsan- Waxay taageertaa isku xirka flip-chip, face-up, multi-chip, iyo thermo-compression.

Tilmaamaha Farsamo ee Muhiimka ah

Tilmaamid	Waxqabadka
Saxnaanta Meelaynta Caalamiga ah	±5 μm @ 3 Sigma
Saxnaanta Meelaynta Deegaanka	±3 μm @ 3 Sigma
Awood-soo-saarka	Ilaa 6,000 – 7,000 UPH
Nidaamka Aragga	Isku-dubarid Xawaaraha Sare ee 4 Megapixel
Hababka Isku-xidhka	Flip-Chip / Weji-kor / Chip badan
Taageerada Wafer-ka	Ilaa 300 mm
Taageerada FO-WLP	Ilaa 340 mm Guddiyo
Iswaafajinta Qolka Nadiifinta	Heerka ISO 5aad
Xakamaynta Habka	Si Buuxda Loo Barnaamijayn Karo
Taageerada Baakadaha Sare	Haa

Faa'iidooyinka Soo-saareyaasha Semiconductor-ka

Wax soo saar la hagaajiyay– Waxay yareysaa khaladaadka meelaynta si loo helo tayada wax soo saarka oo joogto ah.
Dabacsanaanta Habka Sare- Waxay taageertaa noocyo badan oo xirmo ah oo ku yaal hal madal.
Wax-soo-saarka Caddeynta Mustaqbalka– Diyaar u ah isku xidhka isku-dhafka ah iyo is-dhexgalka jiilka soo socda.
Khatarta Wax-soo-saarka oo La Yareeyay- La socodka caqliga leh wuxuu hubiyaa isku halaynta muddada dheer.

Ikhtiyaarada Qalabka La Heli Karo

Datacon 8800 CHAMEO Advanced oo la dayactiray
Nidaamyada Si Buuxda Loo Tijaabiyay
Qalabka Diyaarka ah ee Wax-soo-saarka
Taageerada Rakibaadda Caalamiga ah
Bixinta Qaybaha Hadhaaga
Kaalmada Injineerinka
Taageerada Hagaajinta Habka

Datacon 8800 CHAMEO vs Bonder-ka Dhaqanka

Muuqaal	Datacon 8800 CHAMEO	Caadiga ah ee Bonder
Baakad Sare	✓	Xaddidan
Baakadaha Fan-Out	✓	Xaddidan
Golaha Multi-Chip	✓	Qayb ahaan
Isdhexgalka 3D IC	✓	Xaddidan
Isku-xidhka Isku-dhafan ee Diyaarsan	✓	Maya
Xaqiijinta Meelaynta	±3 μm	±10 ~ 20 μm
Miisaaniyadda Mustaqbalka	Aad u fiican	Dhexdhexaad ah

Qalabka La Xiriira

Xirmooyinka Chip-ka ee Flip
Qalabka Isku-xidhka Isku-dhafka ah
Qalabka Baakadaha Sare
Nidaamyada Maareynta Wafer
BESI The Bonder

Su'aalaha Badiya La Weydiiyo ee ku Saabsan Datacon 8800 Die Bonder

Maxaa loo isticmaalaa Datacon 8800 CHAMEO Advanced?

Waxaa ugu horreyn loo isticmaalaa codsiyada baakadaha semiconductor-ka ee horumarsan oo ay ku jiraan baakadaha taageeraha, isu-imaatinka jajabyada badan, isdhexgalka kala duwan, iyo wax-soo-saarka 3D IC.
Nidaamku ma taageeraa isku xidhka jajabka?

Haa. Madalku waxay taageertaa hababka isku xidhka ee loo yaqaan 'flip-chip' iyo 'face-up diabetes' labadaba.
Saxnaanta meelaynta noocee ah ayaa la gaari karaa?

Nidaamku wuxuu bixiyaa ilaa ± 3 μm saxnaanta meelaynta maxalliga ah ee 3 Sigma.
Ma ku habboon tahay baakadaha heerka wafer-ka ee mawjadaha?

Haa. Mashiinka waxaa si gaar ah loogu sameeyay si uu u taageero codsiyada baakadaha heerka sare ee wafer-ka ee mawjadaha.
Madalku ma taageeri karaa hababka isku-xidhka isku-dhafka ah ee mustaqbalka?

Madal tignoolajiyada CHAMEO waxay u adeegtaa aasaaska horumarinta isku-xidhka isku-dhafka ah ee mustaqbalka iyo teknoolojiyada is-dhexgalka ee horumarsan.
Ma bixisaa nidaamyada Datacon 8800 CHAMEO Advanced oo la dayactiray?

Haa. Nidaamyada la dayactiray iyo kuwa diyaarka u ah wax soo saarka ayaa laga yaabaa inay diyaar yihiin iyadoo ku xiran xaaladda kaydka.

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