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EWAKA>Ebyuma bya semiconductor > Ebikozesebwa mu Kusiba Die >
Fully automatic die bonding and flip chip system AD838L plus

Enkola ya die bonding eya otomatiki mu bujjuvu ne flip chip AD838L plus

Enkola ya AD838l plus fully automatic disk bonding ne flip chip system ya die bonding ekola bulungi era ekola bulungi, okusinga ekozesebwa mu kukola otomatiki okupakinga semiconductor ne flip chips. Enkola eno erina ekintu ekikulu kino wammanga

State:Ekozesebwa In stock:have supply
Okusaba okw'amangu Email:smt-sales6@gdxinling.cn
Ebikwata ku ddyo

Enyanjula mu bujjuvu:

AD838L-plus

Enkola ya die bonding ne flip chip mu bujjuvu mu ngeri ya otomatiki


■Obusobozi obw’enjawulo obw’okukwata ebintu obw’ekika ky’omutwala, naddala nga busaanira 8'' ebizibu era ebitera okukunya


■Zhuanli enkola tekinologiya, +25μm / + 15um_upward obutuufu akyayinza okukuuma waggulu essaawa okufulumya obusobozi 12K / H.


■Obusobozi bw'okukwata ebintu mu ngeri ey'obwengula (optional)


■Enkola y’okutikka n’okutikkula wafer mu ngeri ey’obwengula (optional)


■Entuuyo ezikyusakyusa mu ngeri ey’obwengula 4 (eky’okwesalirawo) .


■Obusobozi bw'okukola ku flip chip ya FC (eky'okwesalirawo)


■Fuuyira glue disc okusobola okufuuyira nga tonnafuuyira (optional)


■1 ekisoma bbaakoodi (eky’okwesalirawo), ku mutimbagano (eky’okwesalirawo)


■Owagira reverse feeding okukwata ebintu ebipakiddwa ebitabuddwamu core


■Linear motor driven XY double glue system, ekozesebwa ku paste za ffeeza ez’enjawulo, glues ezitambuza oba ezitatambuza


■Enkola y’omukono gw’okuweta entuuyo ezikyukakyuka ekyusa chip y’okutereeza emmeeza ya wafer ekyukakyuka

 

 

 


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Okutambulira mu Mangu

TUKUTUUKAKO

Endagiriro y’okutuukirira:

No. 18, oluguudo lw’amakolero mu Shangliao, mu kibuga Shajing, mu Disitulikiti y’e Baoan, Shenzhen, China

Ennamba y’essimu ey’okwebuuza:

+86 13480912606

Email:

smt-okutunda6@gdxinling.cn

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