Ibhondi ye-ASM flip chip AMICRA NANO

I-AMICRA NANO ye-ASM yi-flip-chip bonder ekumgangatho ophezulu, echanekileyo kakhulu. Enyanisweni, ayisiyo nje i-flip-chip bonder elula, kodwa sisixhobo esidibanisa imisebenzi ye-die bonding kunye ne-flip-chip bonding, elawula iinkqubo ezahlukeneyo ze-bonding ngokuguquguquka.

Iimpawu eziphambili ze-AMICRA NANO kunye neenkcukacha zobugcisa

Inkcazo eneenkcukacha

Uhlobo lwezixhobo: I-Ultra-precision Die Bonder / Flip Chip Bonder

Ukuchaneka okungundoqo: Ukubekwa/ukulungelelaniswa Ukuchaneka: ±0.2 µm @ 3σ

Iindlela zokubopha: Ukubophelela ngeHybrid, Ukubophelela nge-Eutectic, Ukubophelela ngeLaser, Ukubophelela ngeThermostatic (TCB), Ukunyanga nge-UV

Uluhlu loxinzelelo lokubopha: 0.1 N ukuya kwi-20 N (malunga ne-10g ukuya kwi-2kg)

Ubungakanani beTshiphu: Iphatha iitshiphusi ezincinci kakhulu, umz., 0.1mm x 0.1mm

Ubungakanani beSubstrate: Iphatha iisubstrate ukuya kuthi ga kwi-300mm x 300mm

Izinga leMveliso (UPH): Malunga neetships ezingama-200-400 ngeyure

Inkqubo yokusebenza: Ujongano lweWindows

Ubukhulu bezixhobo: Unyawo kuphela 2.23 x 1.0 m (malunga ne-7.3 x 3.3 ft)

Indawo yoBuchule Ixhotyiswe ngezihluzi zeHEPA kunye nejenereyitha ye-ion, iqinisekisa indawo yokucoca ecocekileyo kakhulu.

Iinkcukacha zobugcisa ezingakumbi kunye nothelekiso neemodeli ezifanayo

Umgaqo

Ukuchaneka okugqithisileyo kwe-AMICRA NANO kuvela kuyilo lwayo olukhethekileyo: iinkqubo ezine zomfanekiso ezinesisombululo esiphezulu zinamathele kwisiseko segranite sendalo, ngelixa ezinye iinkqubo zokulawula intshukumo zihambahamba ezi khamera zizinzileyo. Zidibene ne-active vibration damping kunye nenkqubo yokulungelelanisa enamandla, oku kuqinisekisa indawo echanekileyo.

Iindawo zoSetyenziso

Yenzelwe usetyenziso oluphambili lokupakisha oluneemfuno ezichanekileyo kakhulu, ngakumbi ukugqwesa kwi-silicon photonics, ukupakisha izixhobo ze-optical, i-chip-to-wafer, kunye nokuhlanganiswa kwe-2.5D/3D IC.

Iingenelo zeNkqubo

Ukongeza ekuchanekeni okuphezulu kakhulu kokubekwa, i-AMICRA NANO ikwaxhasa iinkqubo zokubopha ze-AuSn eutectic ezikhawulezayo kwaye inamandla okubopha i-eutectic ngaphakathi, okuphucula ngempumelelo umgangatho wokuphuma kunye nonxibelelwano.

Ezinye iiModeli ezisuka kwezinye

Ngaphandle kwe-NANO, uthotho lwe-ASMPT AMICRA lukwaquka:

I-NOVA Pro: Ikwaxhasa ukubopha kwe-flip-chip ngokuchaneka kwe-±1.0 µm, okufezekisa ulungelelwaniso phakathi kwesantya kunye nokuchaneka.

I-AFC Plus: Le yi-die bonder esetyenziswa ngokubanzi echanekileyo ye-±1.5 µm, eyenzelwe ukuhambelana nothotho lwe-NANO oluphezulu.

Ngamafutshane, i-ASM AMICRA NANO yenzelwe ukuhlangabezana neemfuno zokupakisha ezifuna kakhulu. Ngokungafaniyo nezixhobo ezibeka phambili ukusebenza kakuhle, igxile ekufezekiseni ukuchaneka okugqithisileyo kwe-±0.2 µm, ikhonza uphando nophuhliso kunye nemveliso ephezulu yokuxuba, ephantsi kakhulu kwiinkalo eziphambili ezifana ne-silicon photonics kunye ne-AI computing.