Ibhondi yetshiphusi ye-SHIBAURA TFC-9000 flip

I-SHIBAURA MECHATRONICS TFC-9000 yi-flip-chip bonder evelisa ngobuninzi eyenzelwe iinkqubo zokupakisha eziphambili, ezifana neFan-Out Wafer-Level Packaging (FO-WLP). Endaweni yokulandela ukuchaneka okugqithisileyo, kwinqanaba lelebhu, iinjongo zayo eziphambili zoyilo zibeka phambili iMveliso ePhakamileyo kunye neNyawo encinci, ziyibeka ngqo kwimarike yemveliso ngobuninzi. Iqhutywa yindlela yokunciphisa kunye nokuhlanganiswa okuphezulu kwizixhobo eziphathwayo, imfuno yeenkqubo ze-FO-WLP iyanda; i-TFC-9000 imi njengemodeli ephambili yeShibaura eyenzelwe ngokukodwa ukujongana nale meko yesicelo.

**Iinkcukacha eziPhambili: Ukulinganisela Ukusebenza kunye nokuSebenza kakuhle**

Ezi parameters zobugcisa zilandelayo, eziqokelelwe kwidatha esemthethweni, zibonisa ulungelelwaniso lomatshini phakathi kokuchaneka, ukusebenza kakuhle, kunye nokukwazi ukuphatha izinto:

**Impawu** | **Iiparameter ezineenkcukacha**

**Uhlobo lwezixhobo** | I-Bonder yokuPakisha ye-Wafer-Level / i-Flip-Chip Bonder

**Iinkqubo eziPhambili** | Ukupakisha iFan-Out Wafer-Level (FO-WLP), iFlip-Chip Ball Grid Array (FC-BGA)

**Ukuchaneka kokubekwa** | Ulungelelwaniso lweNdawo: ±5 µm (3σ)

Ulungelelwaniso lweHlabathi: ±7 µm (3σ)

**Ukusebenza kakuhle kwemveliso (UPH)** | Ulungelelwaniso lweHlabathi: Ukuya kuthi ga kwiiyunithi ezingama-7,200/ngeyure

Ulungelelwaniso lweNdawo: Ukuya kuthi ga kwiiyunithi ezingama-5,100/ngeyure

**Amandla okubopha** | Ubuninzi. 50 N

**Ubungakanani beChip obuxhaswayo** | Ubuninzi. □26 mm

**Ubungakanani beSubstrate/Wafer exhaswayo** | Iwafer: φ200 / 300 mm

Isiseko: Ubuninzi. 330 × 320 mm

**Inkxaso yeNkqubo** | Ixhasa zombini iinkqubo zeFace-Up kunye neFlip-Chip (Face-Down); iyahambelana netekhnoloji ezahlukeneyo kuquka i-DAF (Die Attach Film), i-C4 (Controlled Collapse Chip Connection), kunye ne-T/C (Thermo-Compression) bonding.

**Umqadi weenyawo** | Indawo yeyunithi ephambili: Malunga ne-2.5 m² (Uyilo oluncinci)

**Isikhundla kunye neenkcukacha zobuchwephesha eziphambili**

Ifilosofi yoyilo oluphambili emva kwe-TFC-9000 kukuhlangabezana neemfuno zemveliso enkulu, esebenza kakuhle kakhulu yokupakisha. **Ulungiselelo lweeNtloko ezimbini eziMvelisiweyo:** Esi sixhobo sinolungiselelo lweentloko ezimbini, sifezekisa ukusebenza kakuhle kwemveliso ngaphakathi komgangatho omncinci kakhulu; sisebenza njengomzekelo obalulekileyo wefilosofi ethi "Small Footprint & High Productivity".

**Ukuhambelana kweNkqubo eBanzi:** Ilungiselelwe ngokukodwa ukuPakisha iFan-Out Wafer-Level (FO-WLP), le nkqubo iyahambelana neendlela eziphambili zenkqubo yeFO-WLP—"iChip-First" kunye ne"Chip-Last/RDL-First"—ngaloo ndlela ivumela iindlela ezahlukeneyo zobuchwepheshe zabathengi abahlukeneyo.

**Iindlela zoLungiselelo oluGuquguqukayo:** Ukongeza kwizakhono zokubopha ezisemgangathweni ze-flip-chip, izixhobo zibonelela ngokhetho oluninzi lweemodyuli ezisebenzayo—ezifana neFlux Copying kunye neThick/Thin Die Pickup—ukugubungela uluhlu olubanzi lweemeko zokusetyenziswa.

**IiDomain zesicelo:** Igxile kwiPakethe enkulu ePhambili

I-TFC-9000 isetyenziswa kakhulu kwiindawo ezinkulu zemveliso apho ukusebenza kakuhle, ukuchaneka, kunye nolawulo lweendleko zezona zinto zibalulekileyo.

**Ukupakisha iWafer-Out Wafer-Level (FO-WLP):** Usetyenziso oluphambili. Lwenzelwe ukupakisha iitships ezininzi ezifumaneka kwizixhobo eziphathwayo—ezifana neefowuni eziphathwayo kunye neetablet—kuquka iiPower Management ICs (PMICs) kunye neeRF Front-End Modules (RF FEMs).

**I-Flip-Chip Ball Grid Array (FC-BGA):** Enye indawo ephambili yesicelo. Isetyenziselwa ukupakisha ii-chips zekhompyutha ezisebenzayo kakhulu, ezifana nee-CPU, ii-GPU, kunye neeprosesa ze-AI.

**I-Wafer-to-Wafer / I-Substrate-to-Substrate Bonding (I-Chip kwi-Wafer/Substrate):** Ixhasa ukubekwa kweetships kwi-300mm wafers okanye kwi-square substrates ezinobukhulu obufikelela kwi-330mm x 320mm, ivumela iintlobo ngeentlobo zeefomathi zokupakisha.

**Indawo yeMarike kunye neeNzuzo zoKhuphiswano: iShibaura's Niche Market**

Kwimarike yehlabathi egxile kakhulu kwiibhondi ze-flip-chip, uShibaura ungumdlali ophambili.

**Isikhundla seMarike:** Imarike yehlabathi ye-flip-chip bonder ilawulwa ngabavelisi abane abakhulu—iBesi, i-ASM Pacific, iShibaura, kunye neKulicke & Soffa—abaquka phantse i-70% yesabelo siphela semarike. Indima kaShibaura: IShibaura Mechatronics inamava anzulu eminyaka emininzi kwicandelo le-flip-chip bonding. Uthotho lwemveliso yayo ye-TFC lubonisa ukusebenza okugqwesileyo kuluhlu lweetekhnoloji eziphambili zokupakisha, kubandakanya i-FO-WLP kunye ne-FC-BGA. Le nkampani inerekhodi ende, ngakumbi kwiindawo ze-semiconductor flip-chip bonders kunye ne-Flat Panel Display (FPD) bonders.

Isishwankathelo: Kutheni Ukhetha i-TFC-9000?

Ngokungafaniyo nezinye iinkqubo eziphambili ezibeka phambili ukuphishekela ukuchaneka okugqithisileyo ngaphezu kwayo yonke enye into, iSHIBAURA TFC-9000 sisisombululo esenziwe ngokuchanekileyo ukuze siphucule ukusebenza kakuhle kwemveliso ngobuninzi. Xa abavelisi bokupakisha befuna izixhobo zeenkqubo eziphambili—ezifana ne-FO-WLP okanye i-FC-BGA—ezibonelela ngokusebenza okuzinzileyo, ezihlangabezana nemigangatho yokuchaneka efunekayo, kwaye ngaxeshanye ziphucula imveliso kwindawo nganye, i-TFC-9000 ivelele njengokhetho oluqinisekisiweyo noluthembekileyo. Ifezekisa olu mahluko ngokusebenza kwayo okugqwesileyo, uyilo oluncinci, kunye nobuchule obukhulu bukaShibaura kwicandelo lokubopha.

Uphawu I-TFC-9000 (SHIBAURA) Ukubaluleka

Indawo ePhambili Imveliso enkulu yobunzima; ilinganisela ukusebenza kakuhle nangokuchaneka Igxile kwimveliso yobuninzi, endaweni yokusebenza njengeqonga le-R&D elichanekileyo—ingqwalasela eqhelekileyo kuhlalutyo oluthelekisayo.

Ukuchaneka (Kwendawo) ±5 µm Ihlangabezana neemfuno zemveliso enkulu yetekhnoloji eziphambili zokupakisha.

Ukusebenza kakuhle (UPH) Ukuya kuthi ga kwi-7,200 Imveliso ephumayo iphezulu kakhulu; imele inzuzo ephambili yokukhuphisana.

Unyawo Malunga ne-2.5 m² Uyilo oluncinci; luphucula ukusetyenziswa kwendawo yomgangatho wefektri.

Izicelo Ezijoliswe Kuzo I-FO-WLP, i-FC-BGA Igxile kwiindawo ezikhula ngokukhawuleza kwicandelo lokupakisha eliphucukileyo.