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Umatshini we-SIPLACE CA ngumatshini wokubekwa kwe-hybrid oqaliswe ngu-ASMPT, onokuqonda zombini i-semiconductor flip chip (FC) kunye ne-chip attachment (DA) iinkqubo kumatshini ofanayo.
Iinkcukacha zobugcisa kunye neeparamitha zokusebenza
Umshini we-SIPLACE CA unesantya sokubeka ukuya kuthi ga kwi-chips ye-420,000 ngeyure, isisombululo se-0.01mm, inani le-feeders ye-120, kunye nemfuno yombane we-380V12. Ukongeza, i-SIPLACE CA2 inokuchaneka ukuya kuthi ga kwi-10μm@3σ kunye nesantya sokucubungula i-50,000 chips okanye i-76,000 SMDs ngeyure.
Iindawo zesicelo kunye nokuma kwemarike
Umatshini we-SIPLACE CA ufanelekile ngokukodwa kwiindawo zokuvelisa ezifuna ukuguquguquka okuphezulu kunye nemisebenzi enamandla, njengezicelo zemoto, izixhobo ze-5G kunye ne-6G, izixhobo ezihlakaniphile, njl. Ngokudibanisa i-SMT yendabuko kunye ne-bonding kunye ne-flip chip assembly, i-SIPLACE CA iphucula ukuveliswa kwemveliso. ukupakishwa okuphambili, kwandisa ukuguquguquka, ukusebenza kakuhle, imveliso kunye nomgangatho, kwaye konga ixesha elininzi, iindleko kunye nendawo.
Imvelaphi yeMarike kunye neTekhnoloji
Njengezicelo zeemoto, i-5G kunye ne-6G, izixhobo ezihlakaniphile kunye nezinye izixhobo ezininzi zifuna amacandelo adibeneyo kunye anamandla, ukupakishwa okuphambili kuye kwaba enye yezobuchwepheshe eziphambili. Imishini ye-SIPLACE CA idala amathuba amatsha kubenzi be-elektroniki ngokusebenzisa uqwalaselo lwabo oluguquguqukayo kakhulu kunye neenkqubo ezilungelelanisiweyo, zivule iimarike ezintsha kunye namaqela amatsha abathengi, ukunciphisa iindleko kunye nokwandisa imveliso.
Isishwankathelo, oomatshini be-SIPLACE be-CA lukhetho olufanelekileyo kubenzi bezinto zombane kunye nokusebenza kwabo okuphezulu, ukuguquguquka okuphezulu kunye nemisebenzi enamandla, ngakumbi kwiindawo zokuvelisa ezifuna ukuhlanganiswa okuphezulu kunye nokupakishwa okuphezulu.
