I-iron flip chip bonder Datacon 8800 CHAMEO ultra

I-Besi Datacon 8800 CHAMEO ultra plus AC yimveliso ephambili ye-BE Semiconductor Industries (Besi)—inkokeli yehlabathi engenakuphikiswa kwimarike ye-hybrid bonding. Ngobuchane bayo obumangalisayo obufikelela kwi-100 nm kunye nomlinganiselo olinganayo we-2,000 CPH, izibonakalise njengomdlali obalulekileyo kuguquko lwangoku kwi-AI kunye ne-High-Performance Computing (HPC). Isebenza njengeyona nto iphambili eqhuba itekhnoloji ye-hybrid bonding ukusuka kwilabhoratri ukuya kwimveliso enkulu.

**Isikhundla seMarike: Inkokeli yoShishino oluPhantse lonke**

IBesi ikwisikhundla esiphezulu kwimarike yehlabathi yezixhobo zokubopha ezidityanisiweyo; ngakumbi kwicandelo elibalulekileyo le-Die-to-Wafer hybrid bonding, inesabelo semarike esimalunga ne-91%. Esi simo sikhokelele iinkampani zophando lwemarike ukuba zijonge iBesi njengeyona "nkokeli yezobuchwepheshe ethembisayo" kweli candelo ukusukela oko i-ASML yazisa i-EUV lithography.

**Iteknoloji Ephambili: "Isosi Eyimfihlo" Yokufezekisa Ukubopha Okuncinci**

Ukusebenza okugqwesileyo kwemodeli ephambili kaBesi—iDatacon 8800 CHAMEO ultra plus AC—kuqhutywa yinkqubo yobuchwepheshe ebanzi nephucukileyo:

**Ukuchaneka Okugqithisileyo kunye neMpahla ePhakamileyo:** Yakhelwe kwiqonga leDatacon eliqinisekisiweyo, esi sixhobo senza ukuhlanganiswa okuthe ngqo kwee-dielectric layers kubushushu begumbi, kulandele ukufakelwa kwebatch ukuze kugqitywe uqhagamshelo lombane.

**Ulawulo Oluqinileyo Lococeko:** I-hybrid bonding ibuthathaka kakhulu kwiincindi. Indawo yokusebenza yezixhobo ibonelela ngendawo yokucoca ye-ISO Class 3—edlula kakhulu amandla eenkqubo ezininzi ezifanayo kwimarike—ngaloo ndlela inyusa isivuno se-bonding.

**Ubuchule boNxibelelwano lweSub-Micron:** Ifikelela ekuchanekeni okuphezulu kakhulu kokulungelelaniswa kwee-nanometer ezingama-200 kunye neepitshi zokudibanisa ezicolekileyo njenge-1 micron. Olu buchule lubalulekile ekufezekiseni uqhagamshelo oluthe ngqo lwe-copper-to-copper olucolekileyo kakhulu, nto leyo ephucula kakhulu uxinano loqhagamshelo kunye nokusebenza kakuhle kwamandla.

**Ukuhambelana Okubanzi Kwenkqubo:** Esi sixhobo sixhasa uluhlu olubanzi lweenkqubo, kuquka iFan-Out Wafer-Level Packaging (FO-WLP), i-Advanced Chip-to-Wafer bonding, kunye neenkqubo ezinxulumene neThrough-Silicon Via (TSV). Ngaphezu koko, isebenzisa ubuchwepheshe obufana ne-"Van Gogh" high-precision optical alignment kunye ne-"Van Gogh" Inline IR inspection ukuze kube lula ukulawula inkqubo kunye nokuphucula imveliso.

Izixhobo kunye nobuchule bokuphatha: Ezi zixhobo ziyakwazi ukucubungula iitships ezincinci kakhulu ezinobukhulu obuyi-25 microns (μm) kuphela. Zikwaxhasa iinkqubo ezahlukeneyo zokukhupha amanzi—kuquka iindlela eziqhelekileyo zohlobo lwe-pin, iindlela ezininzi, kunye neendlela ezincediswa yi-UV—ukulungiselela iintlobo ezahlukeneyo zeetships.

UkuZenzekela kunye nokuHlanganisa: Ixhotyiswe ngezakhono zokuZenzekela zeFektri ezipheleleyo, inkqubo inokuqhuba utshintsho lwezinto ezizenzekelayo oluqalwa ngqo yinkqubo yomgcini. Ngaphezu koko, idibana nzulu nezixhobo ezivela kwi-Applied Materials ukuze yenze isisombululo esipheleleyo, esisuka ekupheleni ukuya ekupheleni, ngaloo ndlela iphucula ukusebenza kakuhle konxibelelwano phakathi kweenkqubo zangaphambili nezemva.

Iindawo zokusetyenziswa: "Injini" ye-AI kunye ne-Advanced Packaging

Iimeko eziphambili zokusetyenziswa kwesi sixhobo ziquka ukuhlanganiswa okwahlukeneyo kwee-chipsets ze-AI/HPC, ukwenziwa kwe-High Bandwidth Memory (HBM), kunye nobuchwepheshe be-3D NAND kunye ne-CIS (CMOS Image Sensor); sisebenza njengesixhobo esiphambili esixhasa iimveliso zobuchwepheshe zanamhlanje.

Inkqubo yendalo kunye nobudlelwane

UBesi ulandela amaqhinga amabini aphambili okuqhuba uphuhliso lwenkqubo yeshishini:

Amaqhina oBuchule: IBesi iseke ubudlelwane obunzulu bobuchule neApplied Materials, apho ezi nkampani zimbini zaphuhlisa zaza zaqalisa "iKinex"—inkqubo yokudibanisa i-D2W (Die-to-Wafer) hybrid. Ukongeza, iApplied Materials iphethe malunga ne-9% yezabelo zeBesi, nto leyo eyenza ukuba ibe ngumnini-zabelo omkhulu weBesi kwaye inika inkxaso enkulu yemali neyobuchwephesha.

Ukuqinisekiswa koMthengi: Ii-NHanced Semiconductors—inkampani ekhethekileyo yokupakisha ephucukileyo—yayiyinkampani yokuqala kwihlabathi liphela ukwazisa eli qonga kwimveliso yorhwebo. Eli qonga lenze ukuba imveliso inyuke phantse ngokuphindwe kalishumi.

Ukusebenza kweMarike kunye neNkambiso yoBuchule

IBesi ngokucacileyo iqhubela phambili ukuya kumgangatho ophezulu kunye namacandelo amakhulu emarike:

Ukusebenza kakuhle kwezeMali: Kwikota yokuqala ka-2026, ukuthathwa kwee-odolo zenkampani kufikelele kwi-€269.7 yezigidi—ukunyuka kwe-104.5% ngonyaka—okubonisa imfuno enamandla eqhutywa zizicelo ze-AI. Ngaphezu koko, umda opheleleyo weshishini layo lokupakisha eliphambili uhlale uzinzile malunga ne-63.5%. Imephu yeTekhnoloji eQhubekayo: IBesi sele iceba izixhobo zesizukulwana esilandelayo ezinokukwazi ukufikelela kumanqanaba okuchaneka aphezulu njenge-50 nanometers (nm) ukujongana nemingeni yokuhlanganiswa kweetship kwixesha elizayo, okuphucukileyo ngakumbi, ngaloo ndlela iqinisa imiqobo yayo yetekhnoloji.

Isicwangciso Sobuchwepheshe Esiqhubekekayo: IBesi sele iceba izixhobo zesizukulwana esilandelayo ezinokukwazi ukufikelela kumanqanaba okuchaneka aphezulu ukuya kuthi ga kwi-50 nanometers (nm) ukujongana nemingeni yokuhlanganiswa kweetship kwixesha elizayo, okuphucukileyo ngakumbi, ngaloo ndlela iqinisa imiqobo yayo yetekhnoloji.

Uvavanyo lweShishini kunye neMbono yeXesha elizayo

Ixhaswa ngamathuba ayo acacileyo kwezobuchwepheshe nakwezorhwebo, iBesi ithathwa yimarike njengenkampani yezixhobo ze-semiconductor yaseYurophu ekulungele ukukhula ngamandla kwiminyaka ezayo. Abahlalutyi baqikelela ukuba ingeniso yayo ngesabelo ingaphindaphindeka kane kwiminyaka emine. I-Datacon 8800 CHAMEO ultra plus AC isebenza njengesiseko esixhasa lo mbono unebhongo. Isebenza njengebhulorho edibanisa amandla ekhompyutha e-AI nehlabathi elibonakalayo, iBesi imi kwindawo ephambili yendlela yoshishino lwesakhiwo—utshintsho lwecandelo le-semiconductor ukuya ekupakishweni okuphambili kunye nokuhlanganiswa okungafaniyo.