Iron flip chip bonder Datacon 8800 CHAMEO ultra

Besi Datacon 8800 CHAMEO ultra plus AC ni yo ruganda rukora cyane rwa BE Semiconductor Industries (Besi)—ikipe ikomeye ku isi mu bijyanye n’ubuhuza bw’ingufu. Kubera ubuhanga bwayo butangaje bwa 100 nm n’ubushobozi bwayo bungana na 2.000 CPH, yigaragaje nk’umukinnyi ukomeye mu mpinduka iriho muri ubu mu bijyanye n’ubuhanga bwo gukora ibintu mu buryo bwa AI na High-Performance Computing (HPC). Ikora nk'ingufu zikomeye zituma ikoranabuhanga rya hybrid bonding riva muri laboratwari rigera ku musaruro munini.

**Umwanya w'Isoko: Umuyobozi w'Inganda Zisanzwe Zifite Ingufu Zidasanzwe**

Besi ifite umwanya ukomeye ku isoko mpuzamahanga ry’ibikoresho byo guhuza ibikoresho; cyane cyane mu gice cy’ingenzi cy’ibicuruzwa byo guhuza ibikoresho bya Die-to-Wafer, ifite isoko ringana na 91%. Iki kintu cyatumye ibigo bikora ubushakashatsi ku isoko bifata Besi nk' "umuyobozi w’ikoranabuhanga utanga icyizere kurusha abandi" muri uru rwego kuva ASML yashyira ahagaragara EUV lithography.

**Ikoranabuhanga ry'ingenzi: "Isosi y'ibanga" yo kugera ku guhuza nanoscale**

Imikorere idasanzwe ya Besi—Datacon 8800 CHAMEO ultra plus AC—ikoreshwa na sisitemu y’ikoranabuhanga yuzuye kandi igezweho:

**Ubuhanga buhanitse cyane n'umusaruro mwiza:** Byubatswe kuri platform ya Datacon yagaragaye, iki gikoresho gikora ihuriro ry'amashanyarazi mu buryo butaziguye ku bushyuhe bw'icyumba, hanyuma hagakurikiraho gufunganya kugira ngo amashanyarazi arangire.

**Gucunga Isuku Cyane:** Guhuza ibikoresho bivanze birushaho kwanduza uduce duto tw’ibumba. Ahantu ho gukorera ibikoresho hatanga ahantu ho gusukura ho mu cyiciro cya 3 cya ISO—harenze cyane ubushobozi bw’ibikoresho byinshi bisa ku isoko—bigatuma umusaruro w’ibikoresho urushaho kwiyongera.

**Ubushobozi bwo guhuza imiyoboro ya Sub-Micron:** Igera ku buryo bwo guhuza neza cyane bwa nanometero 200 n'uburyo bwo guhuza imiyoboro bungana na mikoroni 1. Ubu bushobozi ni ingenzi cyane mu guhuza imiyoboro ya fer-to-copper, bikongera cyane ubucucike bw'imiyoboro ndetse no gukoresha ingufu neza.

**Guhuza Uburyo Bwinshi:** Ibikoresho bishyigikira uburyo butandukanye bwo gukora, harimo Gupakira Fan-Out Wafer-Level Packaging (FO-WLP), Guhuza Chip-to-Wafer mu buryo bwa Advanced, na Through-Silicon Via (TSV). Byongeye kandi, ikoresha ikoranabuhanga nka "Van Gogh" high-precision optical alignment na "Van Gogh" Inline IR inspection kugira ngo byorohereze kugenzura uburyo bwo gukora no kunoza umusaruro.

Ubushobozi bw'ibikoresho n'uburyo bwo kubikoresha: Ibi bikoresho bifite ubushobozi bwo gutunganya uduce duto cyane dufite ubugari bwa mikoroni 25 gusa (μm). Binashyigikira uburyo butandukanye bwo gusohora—harimo uburyo busanzwe bwo gusohora uduce duto, uburyo bwinshi, n'uburyo bwo gukoresha UV—kugira ngo bihuze ubwoko butandukanye bwa uduce duto.

Kwikora no Guhuza: Ifite ubushobozi bwo gukora ibikoresho byuzuye mu ruganda, iyi sisitemu ishobora guhindura ibikoresho byuzuye mu buryo bwikora bitewe na sisitemu y’ububiko. Byongeye kandi, ihuza cyane n’ibikoresho bivuye mu bikoresho byakoreshejwe kugira ngo ikore igisubizo cyuzuye, kuva ku mpera kugeza ku mpera, bityo yongere ubushobozi bwo gukorana hagati y’ibikorwa byo hagati y’imbere n’inyuma.

Ahantu hakoreshwa: "Moteri" yo gukoresha ubuhanga bwo gukora imibonano mpuzabitsina n'ibikoresho bigezweho

Uburyo bw'ingenzi bwo gukoresha ibi bikoresho bukubiyemo ahanini ihuzwa ry’ibikoresho bitandukanye bya AI/HPC, ikorwa rya High Bandwidth Memory (HBM), ndetse n’ikoranabuhanga rya 3D NAND na CIS (CMOS Image Sensor); ni igikoresho cy’ingenzi gishyigikira ibikoresho by’ikoranabuhanga bigezweho muri iki gihe.

Urusobe rw'ibinyabuzima n'ubufatanye

Besi ikurikirana ingamba ebyiri z'ingenzi zo guteza imbere urusobe rw'inganda:

Ubufatanye mu Ngamba: Besi yashinze ubufatanye bukomeye mu ngamba na Applied Materials, aho izo sosiyete zombi zahuje iterambere n'itangiza "Kinex"—uburyo bwo guhuza bwa D2W (Die-to-Wafer) buhuriweho. Byongeye kandi, Applied Materials ifite hafi 9% by'imigabane ya Besi, bigatuma iba umunyamigabane munini wa Besi kandi itanga inkunga ikomeye mu by'imari na tekiniki.

Kwemeza Abakiriya: NHanced Semiconductors—uruganda rwihariye rukora ibikoresho byo gupakira—ni rwo rwabaye ikigo cya mbere ku isi cyashyize uru rubuga mu bikorwa by’ubucuruzi. Uru rubuga rwatumye umusaruro wiyongera inshuro hafi icumi.

Imikorere y'Isoko n'Icyerekezo cy'Ingamba

Biragaragara ko Besi irimo gutera imbere igana ku buhanga bwo hejuru no ku isoko rinini:

Imikorere Ihamye mu by'Imari: Mu gihembwe cya mbere cya 2026, ibiciro by’isosiyete byageze kuri miliyoni 269.7 z'amayero—izamuka rya 104.5% ry'umwaka ushize—bigaragaza ko icyifuzo gikomeye giterwa n'ubuhanga bwo gupakira ibikoresho byakozwe n'abahanga mu by'ikoranabuhanga (AI). Byongeye kandi, inyungu rusange ku bucuruzi bwayo bwo gupakira ibikoresho byateye imbere yakomeje kuba ingirakamaro ku kigero cya 63.5%. Gahunda y'ikoranabuhanga ikomeje gutera imbere: Besi yamaze gutegura ibikoresho byo mu gisekuru gitaha bishobora kugera ku rwego rwo hejuru kugeza kuri nanometero 50 (nm) kugira ngo bikemure ibibazo byo guhuza chips mu gihe kizaza, bityo bikongere inzitizi z'ikoranabuhanga.

Gahunda y’ikoranabuhanga ikomeje gutera imbere: Besi yamaze gutegura ibikoresho byo mu gisekuru gitaha bishobora kugera ku rwego rwo hejuru rwa nanometero 50 (nm) kugira ngo bikemure ibibazo byo guhuza chips mu gihe kizaza, bityo bikomeze inzitizi zayo mu ikoranabuhanga.

Isuzuma ry'inganda n'icyerekezo cy'ejo hazaza

Ishyigikiwe n'ubushobozi bwayo bugaragara mu ikoranabuhanga n'ubucuruzi, Besi ifatwa n'isoko nk'ikigo cy'i Burayi gishinzwe ibikoresho bya semiconductor cyiteguye kwiyongera cyane mu myaka iri imbere. Abasesenguzi bemeza ko inyungu kuri buri mugabane ishobora kwikuba kane mu myaka ine. Datacon 8800 CHAMEO ultra plus AC ni inkingi ikomeye ishyigikira iki cyerekezo gikomeye. Ikora nk'ikiraro gihuza imbaraga za mudasobwa za AI n'isi ifatika, Besi ni inkingi ikomeye y'inganda zikora imiterere y'inganda—iterambere ry'urwego rwa semiconductor mu gupakira ibikoresho bigezweho no guhuza ibintu bitandukanye.