Chitsulo chachitsulo chozungulira cha Datacon 8800 CHAMEO ultra

Besi Datacon 8800 CHAMEO ultra plus AC ndi kampani yayikulu ya BE Semiconductor Industries (Besi)—mtsogoleri wodziwika bwino padziko lonse lapansi pamsika wa hybrid bonding. Ndi kulondola kwake kodabwitsa kwa 100 nm komanso mphamvu yokwanira ya 2,000 CPH, yadzikhazikitsa ngati wosewera wofunikira kwambiri pakusintha kwamakono kwa AI ndi High-Performance Computing (HPC). Imagwira ntchito ngati mphamvu yayikulu yoyendetsera ukadaulo wa hybrid bonding kuchokera ku labotale kupita ku kupanga kwakukulu.

**Udindo Wamsika: Mtsogoleri Wamakampani Omwe Ali Pafupi Ndi Umodzi**

Besi ili ndi udindo waukulu pamsika wapadziko lonse wa zida zolumikizirana; makamaka mkati mwa gawo lofunika kwambiri la Die-to-Wafer hybrid bonding, ili ndi gawo la msika la pafupifupi 91%. Udindo uwu wapangitsa makampani ofufuza msika kuwona Besi ngati "mtsogoleri wodalirika kwambiri waukadaulo" m'munda uno kuyambira pomwe ASML idayambitsa EUV lithography.

**Ukadaulo Wapachimake: "Msuzi Wachinsinsi" Wokwaniritsa Kugwirizana kwa Nanoscale**

Kapangidwe kabwino kwambiri ka Besi—Datacon 8800 CHAMEO ultra plus AC—kagwiritsidwe ntchito ka ukadaulo wokwanira komanso wotsogola:

**Kulondola Kwambiri ndi Kutulutsa Kwapamwamba:** Yomangidwa pa nsanja yotsimikizika ya Datacon, chipangizochi chimagwira ntchito yolumikiza mwachindunji zigawo za dielectric kutentha kwa chipinda, kutsatiridwa ndi batch annealing kuti amalize kulumikizana kwamagetsi.

**Kusamalira Ukhondo Mwamphamvu:** Kugwirizanitsa kophatikizana kumakhala kovuta kwambiri kuipitsidwa ndi tinthu tating'onoting'ono. Malo ogwirira ntchito a zidazi amapereka malo oyeretsera a ISO Class 3—oposa kwambiri mphamvu za machitidwe ambiri ofanana pamsika—potero kumawonjezera phindu la mgwirizano.

**Kutha kwa Kulumikizana kwa Sub-Micron:** Kumakwaniritsa kulondola kwambiri kwa ma nanometer 200 ndi ma interconnection pitches okwana 1 micron. Kuthekera kumeneku ndikofunikira kwambiri pakukwaniritsa kulumikizana kwa ultra-fine-pitch kwa copper-to-copper direct, zomwe zimathandizira kwambiri kuchuluka kwa kulumikizana komanso kugwiritsa ntchito mphamvu moyenera.

**Kugwirizana Kwambiri ndi Njira:** Zipangizozi zimathandiza njira zosiyanasiyana, kuphatikizapo Fan-Out Wafer-Level Packaging (FO-WLP), Advanced Chip-to-Wafer bonding, ndi njira zokhudzana ndi Through-Silicon Via (TSV). Kuphatikiza apo, imagwiritsa ntchito ukadaulo monga "Van Gogh" high-precision optical alignment ndi "Van Gogh" Inline IR inspection kuti ithandize kuwongolera njira ndi kukulitsa zokolola.

Zipangizo ndi Kutha Kuzigwira: Zipangizozi zimatha kukonza ma chips owonda kwambiri okhala ndi makulidwe a ma microns 25 (μm) okha. Zimathandizanso njira zosiyanasiyana zotulutsira madzi—kuphatikizapo njira zodziwika bwino zotulutsira madzi, njira zambiri, komanso njira zothandizira UV—kuti zigwirizane ndi mitundu yosiyanasiyana ya ma chips.

Kudzipangira ndi Kuphatikiza: Popeza ili ndi luso la Full Factory Automation, dongosololi limatha kusintha zinthu zokha zomwe zimayambitsidwa mwachindunji ndi dongosolo la host. Kuphatikiza apo, limalumikizana kwambiri ndi zida zochokera ku Applied Materials kuti lipange yankho lathunthu, kuyambira kumapeto mpaka kumapeto, motero limakulitsa magwiridwe antchito pakati pa njira zoyambira ndi kumbuyo.

Malo Ogwiritsira Ntchito: "Injini" ya AI ndi Ma Packaging Apamwamba

Zinthu zofunika kwambiri zomwe zimagwiritsidwa ntchito pa chipangizochi zimagwiritsa ntchito makamaka kuphatikiza kwa ma chipset a AI/HPC, kupanga High Bandwidth Memory (HBM), komanso ukadaulo wa 3D NAND ndi CIS (CMOS Image Sensor); ndi chida chofunikira kwambiri chomwe chimagwiritsa ntchito zinthu zamakono zamakono.

Zachilengedwe ndi Mgwirizano

Besi akutsatira njira ziwiri zofunika kwambiri zoyendetsera chitukuko cha chilengedwe cha mafakitale:

Mgwirizano Wanzeru: Besi yakhazikitsa mgwirizano waukulu ndi Applied Materials, womwe makampani awiriwa adapanga ndikuyambitsa "Kinex" - njira yolumikizirana ya D2W (Die-to-Wafer) hybrid. Kuphatikiza apo, Applied Materials ili ndi magawo pafupifupi 9% a Besi, zomwe zimapangitsa kuti ikhale gawo lalikulu la Besi komanso kupereka chithandizo chambiri chazachuma komanso ukadaulo.

Kutsimikizira kwa Makasitomala: NHanced Semiconductors—kampani yapadera yopangira ma CD—inali kampani yoyamba padziko lonse lapansi kuyambitsa nsanja iyi popanga zinthu zamalonda. Nsanjayi inathandiza kuti ntchito yogwiritsa ntchito iwonjezere pafupifupi kakhumi.

Magwiridwe Antchito a Msika ndi Malangizo Anzeru

Besi ikupita patsogolo kwambiri kuti ipeze njira yolondola kwambiri komanso kuti ikule kwambiri pamsika:

Kugwira Ntchito Mwamphamvu Pazachuma: Mu kotala yoyamba ya 2026, ndalama zomwe kampaniyo idatenga zidafika pa €269.7 miliyoni—kuwonjezeka kwa 104.5% chaka ndi chaka—kusonyeza kufunikira kwakukulu komwe kumayendetsedwa ndi mapulogalamu a AI. Kuphatikiza apo, phindu lonse la bizinesi yake yopangira zinthu zapamwamba lakhalabe lokhazikika pafupifupi 63.5%. Njira Yopitira Patsogolo Yopita Patsogolo Yaukadaulo: Besi ikukonzekera kale zida zam'badwo wotsatira zomwe zitha kukwaniritsa milingo yolondola mpaka 50 nanometers (nm) kuti ithane ndi mavuto amtsogolo, kuphatikiza ma chip apamwamba kwambiri, potero kulimbitsa zopinga zake zaukadaulo.

Njira Yopitira Patsogolo Paukadaulo: Besi ikukonzekera kale zida za m'badwo wotsatira zomwe zingathe kukwaniritsa milingo yolondola mpaka 50 nanometers (nm) kuti zithetse mavuto amtsogolo, kuphatikiza ma chip apamwamba kwambiri, motero kulimbitsa zopinga zake zaukadaulo.

Kuwunika Makampani ndi Chiyembekezo cha Mtsogolo

Mothandizidwa ndi kuthekera kwake komveka bwino kwaukadaulo ndi malonda, Besi imaonedwa ndi msika ngati kampani ya zida za semiconductor ku Europe yomwe ikukonzekera kukula kwamphamvu kwambiri m'zaka zikubwerazi. Akatswiri akuganiza kuti phindu lake pa gawo lililonse likhoza kuwirikiza kanayi mkati mwa zaka zinayi. Datacon 8800 CHAMEO ultra plus AC ndi maziko ofunikira kwambiri pothandizira masomphenyawa. Pogwira ntchito ngati mlatho wolumikiza mphamvu ya makompyuta ya AI ndi dziko lapansi, Besi ili pakati pa kayendetsedwe ka makampani—kusintha kwa gawo la semiconductor kupita ku ma CD apamwamba komanso kuphatikiza kosiyanasiyana.