Imashini yo gushyira ikimenyetso cya laser ya ThinkLaser SigmaClean Wafer

ThinkLaser SigmaClean ni sisitemu yo gushyira ibimenyetso bya laser mu buryo bwikora "yoroshye" yagenewe by'umwihariko wafers za 100mm kugeza 200mm, ikurikije amahame y'icyumba cyo gusukura cya Class 1. Intego yayo nyamukuru ni ugukoresha ikoranabuhanga rya laser ryemewe n'amategeko kugira ngo ihe wafers za semiconductor ibimenyetso byiza, biramba kandi bisomeka neza—bitarimo kwanduza uduce duto—bityo bigatuma habaho uburyo bwo gukurikirana mu buryo bwikora mu gihe cyose cy'ubuzima bwa wafer.

**Amahame ya tekiniki**

Ingufu z'ingenzi za SigmaClean ziri mu ikoranabuhanga ryayo risukuye rigenzurwa n'isoko ndetse n'imiterere yayo ihamye kandi ikozwe neza.

**Ikoranabuhanga rya SuperSoftMark® rifite uburenganzira bwo gukoresha patenti:** Iki ni cyo kintu cy'ingenzi gitandukanya SigmaClean n'ibindi bikoresho. Mu kugenzura neza ingufu za laser, bituma habaho ikimenyetso cy'uko "Nta myanda" ikoreshwa. Iki kintu gikuraho burundu ibyago byo kwandura uduce duto, bigatuma sisitemu ishyirwa mu buryo bwizewe mu nganda zikora (FEOL) aho ibisabwa mu isuku ari bikomeye cyane.

**Laser Ihamye Ikoresha Diode-Pumped Solid-State:** Sisitemu ikoresha laser ifite patented diode-pumped solid-state irangwa no kudahindagurika cyane mu gutera kw'amagufwa. Ibi bitanga urwego rwo hejuru rw'ubujyakuzimu n'uruziga rwa buri kadomo kanditseho, bityo bikagaragaza ko ubwiza bw'ikimenyetso buhamye kandi bushobora gusubiramo.

**Sisitemu za Optical na Automation:** Imashini yose ifite imiterere y’ikoranabuhanga ryikora, ishyigikira protocole z’itumanaho rya SECS II/GEM mu ruganda, kandi ihuzwa neza na sisitemu zisanzwe zo gufata wafer, nka SMIF (Standard Mechanical Interface) wafer pods.

**Ibyiza by'ingenzi n'ibiranga**

Ibyiza bya SigmaClean biruta ubushobozi bwayo bwo gushyira ibimenyetso mu nganda kugeza ku gaciro gafatika itanga ku nganda zikora wafer.

**Isuku itagira urugero:** Ikurikiza ibisabwa mu cyiciro cya 1 (International Standard ISO Class 3) byo mu cyumba cyo gusukura, bigatuma iba amahitamo meza ku nganda zikora wafer za Front-End (Fabs) zifite amahame ahagije yo kubungabunga ibidukikije.

**Umusaruro mwinshi n'Ikiguzi:** Uburyo bwo gushyira ikimenyetso cyoroshye—cyakozwe by'umwihariko kugira ngo gishyire ikimenyetso ku mavuta asukuye mu byumba by'isuku, ubu kikaba ari igipimo ngenderwaho cy'inganda—bukoreshwa n'ubu buryo kugira ngo butange igisubizo gihendutse cyane.

**Ubwiza bw'Ibimenyetso n'Uburyo bwo Gukurikirana:** Gukomera kw'amajwi kwa laser ni ingenzi mu kugera ku burebure n'ubuzengurutse bw'utudomo bimwe, ikintu cy'ingenzi mu kongera igipimo cyo kumenya uburyo imashini ikoresha mu kureba (Optical Character Recognition, OCR). Muri icyo gihe, sisitemu ikora ibimenyetso bihoraho kandi bisomeka, bigatanga uburyo bwo gukurikirana mu cyiciro cyose cy'umusaruro.

Uburyo bworoshye bwo gukoresha: Amatsinda menshi y'ibimenyetso ashobora gushyirwa ahantu hose ku buso bwa wafer, aho ibimenyetso bigarukira ku gace ka annular kari muri mm 25 uvuye ku nkengero za wafer.

Ibisobanuro n'imikorere/ubwisungane

Icyiciro cy'Ibisobanuro | Ibipimo birambuye n'Ibisobanuro

Gushyira mu byiciro ibikoresho | Byuzuye byikora, ISO 3 / Icyiciro cya 1 cyo gusukura gihuye n'icyumba cyo koza, Sisitemu yo gushyira ikimenyetso cyoroshye cya Wafer soft marking ya 100–200 mm

Ingano ya Wafer | Inkunga isanzwe ya mm 100 - 200 (inchi 4–8)

Ubwoko bwa Laser | Laser ya Sigma100 IR ikoresha Diode-State Solid-State

Ikoranabuhanga ryo Gushyira Ikimenyetso | SuperSoftMark® ifite patenti (Ishyira Ikimenyetso cyoroshye kidasesagura imyanda)

Aho ikimenyetso giherereye | Icyerekezo icyo ari cyo cyose kiri mu gace ka mm 25 ku nkengero z'umugozi

Ihuriro ry'itumanaho | SECS II/GEM, Ihuriro ry'abakira abantu rya SEMI-standard

Ubwikorezi/Kaseti | Sitasiyo 3 za Kaseti Zifunguye; Adaptateri ya 200 mm SMIF Pod idakenewe

Ibikoresho bitari ngombwa | Gusoma no kongera gushyiramo OCR/Barcode

Sisitemu ya Porogaramu | Interface y'Umukoresha ishingiye kuri Windows®

Iyubahirizwa ry'amategeko n'iyubahirizwa ry'amategeko | Iyubahirizwa ry'amahame ya SEMI S2/S8, CE, n'andi mahame

Ingufu n'Ingufu z'Umwotsi | Ingufu zisanzwe z'inganda zikoresha imashini imwe ya 220V n'umwuka usukuye ufunze neza

SigmaClean yakozwe kandi mu rwego rworoshye kuyibungabunga:

**Byoroshye Kubungabunga:** Imiterere ya sisitemu yorohereza isuku ya buri munsi; igenzura risanzwe—nk'isukura indorerwamo z'amabara y'ijisho—rishobora gukorwa mu minota 5. Byongeye kandi, igikoresho gifite ubushobozi bwo kwisuzuma buri munsi kandi gitanga ubuyobozi busobanutse neza mu bijyanye no kubungabunga mu gihe habaye ikibazo, bityo bikorohereza isuku yateguwe n'umukoresha.

**Umutekano n'Isuku:** Igishushanyo rusange cy'imashini gihuye n'amahame mpuzamahanga y'umutekano (urugero, SEMI S2/S8, CE, n'ibindi) kandi gifite uburyo bwo gukuramo ivumbi, birushaho gutuma ibidukikije bikorerwamo birangwa n'umutekano n'isuku.

**Imikorere y'ingenzi n'Ibikorwa bya Porogaramu**

**Gukora Wafer zo mu cyiciro cya mbere:** Bikwiriye wafer zikozwe mu bikoresho nka silicon, SiC, na GaAs, zifite ingano kuva kuri mm 100 kugeza kuri mm 200. Mu gushushanya ikimenyetso cyihariye mu ntangiriro z'umusaruro, sisitemu ituma habaho gukurikirana ubuziranenge kuva ku mpera kugeza ku mpera no kugenzura imikorere y'ibarurishamibare (SPC).

**Pakingi igezweho:** Itanga ibimenyetso by'ingenzi byo gukurikirana mu buryo bwa Wafer-Level Packaging (WLP) cyangwa Reconstituted Wafer.

**Ubushakashatsi n'Iterambere n'Umusaruro w'Ibice Bito:** Imiterere yayo yoroshye kandi yikora ku buryo bwikora ituma ikwiriye neza mu bushakashatsi n'iterambere ndetse n'inganda z'icyitegererezo zirangwa n'inganda zivanze cyane kandi zikora ibintu bike.

**Incamake n'Igereranya**

Muri make, ThinkLaser SigmaClean ni igikoresho gikoresha ikoranabuhanga rya SuperSoftMark® rigezweho mu rwego rwo kugira isuku, ubuziranenge, no gukora ibintu mu buryo bwikora. Ikoresheje ikoranabuhanga ryayo rya SuperSoftMark®, ikemura neza ikibazo cy’ingutu—ubwandu bw’udukoko—bukunze kujyana n’uburyo gakondo bwo gushyira ibimenyetso, bityo ikaba ari cyo gipimo cy’ingenzi mu bijyanye no gushyira ibimenyetso mu buryo bworoshye ku dupapuro twa santimetero 4 kugeza kuri 8. Kugira ngo urusheho gusobanukirwa neza aho duherereye mu murongo w’ibicuruzwa, nyamuneka reba igereranya rikurikira na SC300—ikindi gikoresho cyo gushyira ibimenyetso mu buryo bworoshye:

**Ikintu** | **SigmaClean** | **SC300**

**Ishyirwa mu mwanya w'ibanze** | Sisitemu yo gushyira ibimenyetso byoroshye mu buryo bwikora ku macupa ya 100–200mm (4–8-inch) | Sisitemu yo gushyira ibimenyetso byoroshye mu buryo bwikora ku macupa ya 300mm (12-inch)

**Ikoreshwa ry'Isoko** | Igenewe inganda zikora ibikoresho bya wafer bya semiconductor n'ibipfunyika bikoresha wafers za santimetero 2.8 n'izito; ni igisubizo cy'ingenzi muri iki gice cy'isoko | Yemejwe cyane n'abakora ibikoresho byose bya 300mm Integrated Device Manufacturers (IDMs) n'inganda zikora ibikoresho bya wafer.

**Ibiranga Tekiniki** | Ijyanye n'icyumba cyo gusukura cyo mu cyiciro cya mbere; ikoresha ikoranabuhanga rya SuperSoftMark® rifite uburenganzira bwo gushyiramo ibimenyetso bitarimo imyanda | Ikoresha kandi ikoranabuhanga ryo gushyiramo ibimenyetso byoroshye, ritanga uburyo buhuye n'ibikenewe, isuku, ireme ry'ibimenyetso, n'ubwizerwe bukenewe kugira ngo hakorwe uburebure bwa 300mm

**Sisitemu yo gutwara ibintu** | Isanzwe ishyirwaho hamwe na sitasiyo 3 zifunguye za kaseti; pods za SMIF ziraboneka nk'amahitamo | Isanzwe ikorana na pods zifunguye imbere (FOUPs); ishyigikira sisitemu ya OHT (Overhead Hoist Transport)

**Imiterere y'Inganda** | Igisubizo gikomeye mu nganda cyo gushyiramo ikimenyetso cyoroshye cya santimetero 4–8 | Igipimo ngenderwaho mu nganda cyo gushyiramo ikimenyetso cyoroshye mu bikoresho bya wafer bya 300mm, gifite urufatiro runini rwashyizweho (ibice birenga 140)