ACCRETECH FP2000 wafer prober

FP2000 ni probe ya 200mm (8-inch) yikora neza ya wafer/frame ifite intego ebyiri** yatangijwe na ACCRETECH yo mu Buyapani. Yagenewe ahanini gupima CP ya chips zaciwe ku maframe, mu gihe kandi ijyanye na wafers zose za santimetero 5–8. Ni icyitegererezo gisanzwe cyo gupima CSP/WLCSP, MEMS, na wafers zoroheje cyane/zigoranye.

I. Ihame ry'imikorere

FP2000 ni igikoresho cyo gupima no gutondekanya amashanyarazi neza cyane. Ihame ryayo ry'ingenzi rigizwe n'intambwe eshatu:

* **Gupakira, Gupakurura, no Gushyira mu mwanya byayo:** Ifasha mu buryo bwikora gupakira, guhuza no gufunga wafers zose cyangwa wafers/chips zaciwe mbere zifatanye n'amadirishya yo gukata.

* **Kumenya no Guhuza Ishusho neza:** Porogaramu ya kamera ifite ubushobozi bwo hejuru bwo gutunganya amashusho ihita imenya chip pads, iyobora urubuga rwa XYθ kugenda neza cyane, igenzura ko agace k'ikarita ya probe gahuye neza na pad.

**Kumenya no Guhuza Ishusho:** Porogaramu ya kamera ifite ubushobozi bwo hejuru n'uburyo bwo gutunganya amashusho ihita imenya chip pads, igatwara urubuga rwa XYθ kugira ngo rugende neza cyane, ikareba ko umutwe w'ikarita ya probe uhuye neza na pad. Isuzuma ry'amashanyarazi ryoroshye: Igenzura ryoroshye ryo kugwa ku gipimo cya Z; probe ikanda gato kuri pad kugira ngo ikore umurongo w'amashanyarazi; ikizamini cya ATE gitanga ikimenyetso cyo gupima imikorere/ibipimo bya chip, ikandika ibisubizo byiza/bibi hanyuma ikabishyiramo akamenyetso.

Gutunganya no Gutondekanya Amakuru: Bishyira mu byiciro kandi bikabika amakuru hakurikijwe ibisubizo by'ibizamini, bigahuza n'ibikoresho byo gutondekanya amakuru/gupakira amakuru.

Ibintu by'ingenzi mu bya tekiniki: Ifite uburyo bwihariye bwo gukosora aho chip iherereye, cyane cyane ikemura amakosa yo kunanura, gutandukanya no guhindagurika kwa chip ku gitereko nyuma yo gukata, bigatuma icyuma gifata neza.

II. Ibisobanuro by'ingenzi (2026 biheruka)

Ibipimo by'Ibintu byo ku meza Ingano ikoreshwa: santimetero 120/150/200 (120/150/200mm) wafer yose; icyuma gikatamo uduce cya santimetero 20 (gihuye n'icyuma cya santimetero 20)

Ubuziranenge bw'aho uherereye XY: ± 1.0 μm; θ: ± 0.001°

Umuvuduko wo kugenda XY: Ntarengwa 200 mm/s; Z: Ntarengwa 20 mm/s

Ingano y'ubushyuhe: Ubushyuhe bw'icyumba; Ubusabe: -40℃ ～ +150℃ Isuzuma ry'ubushyuhe buri hejuru n'ubuke

Icyiciro: Icyuma gikonjesha cyane, gitanga umwuka uvacuum; gishyigikira uduce duto cyane (≤50μm), uduce duto cyane two kuzunguruka/uduce duto cyane

Sisitemu yo Kuboneza Kamera ebyiri (yo hejuru/yo hepfo) zitunganya byikora; kongera 200–1000×

Ikarita y'igenzura ihuye n'amakarita yose asanzwe ya 200mm probe; igenzura ryikora ry'uburyo bwo guhuza ibintu

Ubushobozi busanzwe: Wafer 200–300 ku munsi (urufunguzo 8 rwo gukatamo 1800mm; Multi-Die nta yandi mahitamo

Ingano/Uburemere: Hafi 1800×1200×1800 mm; Hafi 1800 kg

III. Imirimo y'ingenzi

Guhindura icyuma gicagagura rimwe cyangwa ukoresheje agace k'ishusho

Nta guhindura ibikoresho bikenewe, guhinduranya inshuro imwe hagati ya wafer yose n'uburyo bwa dicing frame bigabanya cyane igihe cyo guhindura.

Uburyo bwo gupima bwikora ku buryo bwikora

Gupakira byikora → Guhuza ishusho → Gupima icyuma gipima → Gupima amashanyarazi → Kwandika ibisubizo → Gupakurura byikora, nta muntu ubyitayeho.

Gukosora neza aho umuntu aherereye

Porogaramu yihariye ifasha mu kurambura ibyuma, gutandukanya no guhindagurika nyuma yo gukata ibice, bigatuma umusaruro uzamukaho 3–5%.

Ubushyuhe bwinshi n'ibizamini byihariye

Uburyo bwo gupima ubushyuhe buri hejuru n'ubuke, micro-current, high voltage, na RF, bushobora gukoreshwa mu gupima MEMS, ibikoresho by'amashanyarazi, n'ibikoresho by'ikoranabuhanga by'imodoka.

Gukurikirana inzira y'urushinge

Gukurikirana mu buryo butunguranye ukwangirika no kunama kwa probe, gukumira kwangirika kwa pad no kugabanya ikiguzi cyo kuyisana.

Isuzuma rya Multi-Die rikorwa kuri parallel

Ishyigikira igeragezwa rya chips zigera kuri 4 icyarimwe, yongera umusaruro inshuro 2-3. Gukurikirana no gucunga amakuru: Kumenya kode ya Barcode/QR, gusoma no kwandika indangamuntu, kohereza amakuru y'ibizamini mu buryo nyabwo, no gushyigikira isesengura ry'umusaruro no gukurikirana.

Gukurikirana no gucunga amakuru: Kumenya kode ya Barcode/QR, gusoma no kwandika indangamuntu, kohereza amakuru mu gihe nyacyo, gushyigikira isesengura ry’umusaruro no gukurikirana amakuru.

IV. Imirimo y'ingenzi: Ibikoresho by'ingenzi byo gupima chips (CP): Ikora isuzuma ry'amashanyarazi 100% ku chips zaciwe ku gitereko cya wafer nyuma yo gukata no mbere yo gupakira, isuzuma ibicuruzwa byiza kandi yirinda imyanda yo gupakira.

Guhindura Packaging mu buryo buhanitse: Byagenewe by'umwihariko packages za CSP/WLCSP, Fan-out, na 2.5D/3D, bikemura ibibazo byo gupima bijyanye no gupima ibintu bito cyane/warpage/dicing.

Byagenewe MEMS/Ibikoresho by'Ingufu: Bishyigikira igeragezwa rya MEMS mu buryo bwimbitse (pressure/accelerometer/gyroscope), MOSFET, IGBTs, na diodes/transistors.

Umusaruro n'ubushobozi byazamuwe: Gupima byikora + isuzuma ryihuse + gutunganya icyarimwe byongera umusaruro, ubushobozi bubiri, kandi bigabanya ikiguzi cyo gupima ibikoresho.

V. Ibyiza by'ingenzi (Kugereranya n'ibicuruzwa bisa)

1. Uburyo bwihariye bwo gukoresha "Wafer/Frame Dual-Use": Ibicuruzwa byinshi bihanganye byihariye kuri wafer cyangwa frame gusa; FP2000 ingana n'imashini ebyiri muri imwe, itanga uburyo bwo kugabanya amafaranga menshi.

2. Ubuziranenge bw'ibizamini nyuma yo kurya: Ikoresheje uburyo bwihariye bwo gupima imiterere y'umubiri bw'imyaka 20, ifasha mu gukata no gukata ibice, ikagera kuri ± 1μm neza, irenze cyane ± 2–3μm z'abanywanyi.

3. Ubushobozi bukomeye bwo gufata Wafers zoroshye cyane/zifite ibara ry'umuhondo: Gukoresha vacuum adsorption + inkunga yoroshye ituma wafers zifata neza ≤50μm zoroshye cyane kandi >5mm zigoramye, hamwe n'igihombo cy'umusaruro <1%.

4. TCO Ikuze, Ihamye, kandi Iciriritse: Hashingiwe kuri platform yo mu rwego rwo hejuru ya UF2000, ifite ibikoresho birenga 1000 byashyizweho ku isi yose, igihe hagati y’ikosa (MTBF) ni amasaha > 5000, bigatuma ikiguzi cyo kuyisana kiba gito.

5. Kwagura Modular, Guhindura Uburyo Bworoshye: Moduli zikenewe zo gukoresha ubushyuhe buri hejuru n'ubuke, umuvuduko mwinshi, micro-current, RF, gutunganya multi-chip parallel, gusukura probe, nibindi, bifasha kuvugurura uko bikenewe no kurinda ishoramari.

6. Imikorere yoroshye, yoroshye kwiga: Interineti ya GUI ihuriweho, guhindura uburyo bwo gukanda rimwe, guhuza imikorere mu buryo bwikora, no gusuzuma mu buryo bwikora; ndetse n'abatangiye bashobora kwiga kuyikoresha mu munsi umwe.

VI. Ingero zisanzwe z'ishyirwa mu bikorwa

Umuyoboro w'umusaruro wa CSP/WLCSP: Gupima no gupima imiterere ya santimetero 8, ubwinshi bw'amajwi, umusaruro mwinshi

Gukora MEMS: Udupira tw'umuvuduko/accelerometer/gyroscope, isuzuma ry'ubushyuhe buri hejuru n'ubuke + micro-current

Ibikoresho by'Ingufu: MOSFET, IGBT, diode, isuzuma rya voltage nyinshi/amashanyarazi menshi

Wafers zoroshye cyane: Uduce twa Logic/analog turi munsi ya 50μm, adsorption yo mu ruhande rw'inyuma + warpage compensation

Ibyuma by'ikoranabuhanga byo mu modoka: Icyemezo cya AEC-Q100, ubushyuhe bwinshi (-40℃ ~ 150℃) + isuzuma ryizewe cyane

VII. Kugereranya n'abanywanyi (Incamake y'incamake)

Igereranya ry'Imbonerahamwe Ikintu ACCRETECH FP2000 TEL Precio octo UF200R

Wafer/Frame Ikoreshwa mu buryo bubiri Wafer y'inkunga y'umwimerere gusa Wafer y'inkunga gusa

Ubuziranenge bwo gukata ± 1μm (bipimwe) ± 1.5μm (bipimwe) ± 1.5μm (bipimwe)

Uburyo bwo gutunganya ibintu buto cyane ≤50μm ≥100μm ≥75μm

Ubushobozi (urupapuro rwa santimetero 8): Wafer 200–300 ku munsi

Ifuremu ntishyigikiwe

Igiciro: Hagati-hejuru, Hagati, Hasi

Ibintu Bishoboka: Umugati + Umugati, Gupakira Bigezweho, Umugati Mwiza, Umusaruro Rusange, Umugati Mwiza, Umusaruro Uhendutse ku Giciro Giciriritse

Muri make: FP2000 ni yo mashini yonyine ikora ubushakashatsi ku isoko rya santimetero 8 ishobora gukora isuzuma ry’ubuhanga rya "whole wafer" na "diced frame". Ikwiriye cyane cyane porogaramu zigezweho nka CSP/WLCSP, MEMS, na wafers zoroshye cyane, kandi ni yo nzira ikoreshwa cyane mu gupima frame ku isi yose kuva mu 2020 kugeza 2026.