I-ACCRETECH FP2000 wafer prober

I-FP2000 yi-200mm (8-intshi) eyi-wafer/frame ezenzekelayo ngokupheleleyo eyi-200mm (8-intshi) eyasungulwa yi-ACCRETECH yaseJapan. Yenzelwe ngokukodwa uvavanyo lwe-CP lwee-chips ezisikiweyo kwiifreyimu zokusikwa, ngelixa ikwahambelana nee-wafers ezipheleleyo ezisemgangathweni eziyi-5-8 intshi. Yimodeli eqhelekileyo yokuvavanya i-CSP/WLCSP, i-MEMS, kunye nee-wafers ezibhityileyo/ezigobileyo.

I. Umgaqo Wokusebenza

I-FP2000 ngokusisiseko sisixhobo sokuvavanya nokwahlula umbane esichanekileyo. Umgaqo wayo ophambili unamanyathelo amathathu:

* **Ukulayisha, Ukukhulula, kunye nokuBeka ngokuzenzekelayo:** Ixhasa ukulayisha, ukulungelelanisa, kunye nokulungisa ngokuzenzekelayo ii-wafers ezipheleleyo okanye ii-wafers/iitships ezisikiweyo/ezifakwe kwizakhelo zokusikwa.

* **Ukuqatshelwa koMfanekiso kunye noLungelelaniso oluchanekileyo:** Ikhamera enesisombululo esiphezulu kunye nesoftware yokucubungula imifanekiso iyaziqonda ngokuzenzekelayo ii-chip pads, nto leyo eqhuba iqonga le-XYθ ukuba lihambe ngokuchanekileyo, iqinisekisa ukuba incam yekhadi le-probe ihambelana ngokuchanekileyo ne-pad.

**Ukuqatshelwa koMfanekiso kunye noLungelelwaniso oluchanekileyo:** Isoftware yekhamera enesisombululo esiphezulu kunye nokucubungula imifanekiso iyaziqonda ngokuzenzekelayo ii-chip pads, iqhuba iqonga le-XYθ ukuba lihambe ngokuchanekileyo, iqinisekisa ukuba incam yekhadi le-probe ihambelana ngokuchanekileyo ne-pad. Uvavanyo loMbane oluThambileyo: Ulawulo lokuthambekela oluthambileyo lwe-Z-axis; i-probe icinezela kancinci kwi-pad ukwenza uqhagamshelo lombane; umvavanyi we-ATE ukhupha isignali yokuvavanya umsebenzi/iiparameter ze-chip, erekhoda iziphumo ezilungileyo/ezimbi kwaye iziphawule.

Ukucutshungulwa nokuHlela idatha: Ihlela idatha ngokuzenzekelayo kwaye igcine ngokweziphumo zovavanyo, iqhagamshela kwizixhobo zokuhlunga/zokupakisha zasemva.

Izinto ezibalulekileyo zobugcisa: Ixhotyiswe nge-algorithm eyahlukileyo yokulungisa indawo yetshiphu, ngokukodwa ilungisa iimpazamo zokunwebeka, zokunciphisa, kunye nokugoba kwetshiphu kwifreyimu emva kokunqumla, ukuqinisekisa ukudibana okuchanekileyo kweprobe.

II. Iinkcukacha zeCore (zamva nje zika-2026)

Ipharamitha yento yeTheyibhile Ubungakanani obusebenzayo 5/6/8 intshi (120/150/200mm) i-wafer epheleleyo; 8-intshi isakhelo sokusika (esihambelana nesakhelo se-6-intshi)

Ukuchaneka kokubekwa kweXY: ±1.0 μm; θ: ±0.001°

Isantya Sokuhamba XY: Ubuninzi obuyi-200 mm/s; Z: Ubuninzi obuyi-20 mm/s

Umgangatho woLuhlu loBushushu: Ubushushu begumbi; Ukhetho: -40℃ ～ +150℃ Uvavanyo lobushushu obuphezulu nobuphantsi

Isigaba Isigaba se-ceramic esiqinileyo kakhulu, ukufunxwa kwe-vacuum; ixhasa ii-wafers/iifreyimu ezibhityileyo kakhulu (≤50μm), ezigobileyo kakhulu

Inkqubo yoLungelelaniso Ikhamera ezimbini (ephezulu/esezantsi) ulungelelwaniso oluzenzekelayo; ukukhulisa 200–1000×

Ikhadi leProbe Liyahambelana nazo zonke iikhadi zeprobe ze-200mm eziqhelekileyo; ukulinganisa okuzenzekelayo kokufana

Umthamo Oqhelekileyo: Iiwafer ezingama-200–300 ngosuku (ifreyimu yokusika eyi-8 1800mm; ungazikhethela ukuba zininzi kangakanani na

Ubukhulu/Ubunzima: Malunga ne-1800×1200×1800 mm; Malunga ne-1800 kg

III. Imisebenzi ephambili

Ukutshintsha ifreyimu yesafire/yokusika ngokucofa kanye

Akukho mfuneko yokuguqulwa kwehardware, ukutshintsha ngokucofa kanye phakathi kwe-whole wafer kunye neendlela zesakhelo sokusika kunciphisa kakhulu ixesha lokutshintsha.

Inkqubo yovavanyo oluzenzekelayo ngokupheleleyo

Ukulayisha ngokuzenzekelayo → Ukulungelelaniswa komfanekiso → Uqhagamshelwano lwe-probe → Uvavanyo lombane → Ukurekhoda iziphumo → Ukukhupha izinto ngokuzenzekelayo, ngaphandle kokujonga.

Ukulungiswa kwesikhundla esichanekileyo

Isoftware ezinikeleyo ihlawula ukolula iitshiphusi, ukucima, kunye nokugoba emva kokugawula, nto leyo ephucula isivuno nge-3–5%.

Ubushushu obubanzi kunye novavanyo olukhethekileyo

Iimodyuli zovavanyo zobushushu obuphezulu nobuphantsi, i-micro-current, i-voltage ephezulu, kunye ne-RF ezikhethwayo, ezigubungela i-MEMS, izixhobo zamandla, kunye neemfuno ze-elektroniki zeemoto.

Ukubeka iliso kwiNeedle Track

Ukubeka iliso ngexesha langempela lokuguga nokugoba kweprobe, ukuthintela umonakalo wephedi kunye nokunciphisa iindleko zokugcina.

Uvavanyo oluhambelanayo lweMulti-Die

Ixhasa uvavanyo ngaxeshanye lweetships ezifikelela kwi-4, inyusa i-throughput ngokuphindwe kabini ukuya kwezintathu. Ukulandelelwa kwedatha kunye noLawulo: Ukuqatshelwa kwekhowudi yebhakhowudi/QR, ukufundwa nokubhalwa kwe-ID, ukulayisha idatha yovavanyo ngexesha langempela, kunye nenkxaso yohlalutyo lwemveliso kunye nokulandelelwa kwayo.

Ukulandelelwa kwedatha kunye noLawulo: Ukuqatshelwa kwekhowudi yeBhakhowudi/QR, ukufundwa nokubhalwa kwe-ID, ukulayisha idatha yovavanyo ngexesha langempela, ukuxhasa uhlalutyo lwemveliso kunye nokulandelelwa kwayo.

IV. Imisebenzi Ephambili: Izixhobo eziphambili zokuvavanya iitshiphusi (CP): Zenza uvavanyo lombane oluyi-100% kwiitshiphusi esele zisikiwe kwifreyimu yewafer emva kokuzisika nangaphambi kokuzipakisha, zihlola iimveliso ezilungileyo kwaye ziphephe inkunkuma yokupakishwa.

Uhlengahlengiso oluPhambili lokuPakisha: Yenzelwe ngokukodwa iipakeji ze-CSP/WLCSP, iFan-out, kunye ne-2.5D/3D, isombulula imingeni yokuvavanya enxulumene ne-ultra-thin/warpage/dicing.

Inikezelwe kwiMEMS/Power Devices: Ixhasa uvavanyo oluchanekileyo lweMEMS (uxinzelelo/i-accelerometer/i-gyroscope), iiMOSFET, ii-IGBT, kunye neediode/iitransistors.

Ukuphucula Isivuno kunye Nomthamo: Ukulinganisa ngokuzenzekelayo + uvavanyo olukhawulezayo + ukucubungula ngaxeshanye kuphucula isivuno, umthamo ophindwe kabini, kwaye kunciphisa iindleko zovavanyo lweeyunithi.

V. Iingenelo eziphambili (Ukuthelekisa neeMveliso ezifanayo)

1. Imodeli Ekhethekileyo "Ye-Wafer/Frame Dual-Use" Echanekileyo Kakhulu: Uninzi lweemveliso ezikhuphisanayo zinikezelwe kwiiwafers okanye kwiifreyimu kuphela; i-FP2000 ilingana noomatshini ababini kumatshini omnye, inika ixabiso eliphezulu kakhulu.

2. Ukuchaneka kovavanyo emva kokutya okuphambili kushishino: Sisebenzisa i-algorithm eyahlukileyo yovavanyo lwesakhelo eneminyaka engama-20 ubudala, ilungisa ukolula/ukujika kwemigca, ifezekise ukuchaneka kokubeka i-±1μm, idlule kakhulu i-±2–3μm yabakhuphisana nabo.

3. Amandla Okusebenza Obuchule Bokuphatha IiWafer Ezincinci Kakhulu/Ezigobileyo: Ukufunxwa kweVacuum + inkxaso eguquguqukayo iqinisekisa ukuphathwa okuzinzileyo kweewafers ≤50μm ezigobileyo kakhulu kunye >5mm ezigobileyo, kunye nokulahleka kwesivuno <1%.

4. I-TCO Ekhulileyo, Ezinzileyo, Nephantsi: Ngokusekelwe kwiqonga eliphezulu le-UF2000, elineeyunithi ezingaphezu kwe-1000 ezifakiweyo kwihlabathi liphela, ixesha eliphakathi phakathi kokusilela (MTBF) ziiyure ezingaphezu kwama-5000, nto leyo ebangela iindleko zokulungisa eziphantsi.

5. Ukwandiswa kweModular, Ukulungelelaniswa okuGuquguqukayo: Iimodyuli ezikhethwayo zobushushu obuphezulu nobuphantsi, uxinzelelo oluphezulu, i-micro-current, i-RF, ukucubungula okuhamba ngaxeshanye kweetshiphusi ezininzi, ukucoca iprobe, njl.njl., okuvumela ukuphuculwa njengoko kufuneka kwaye kukhusela utyalo-mali.

6. Ukusebenza okulula, Kulula ukukufunda: Ujongano lwe-GUI oludibeneyo, ukutshintsha imo yokucofa kube kanye, ulungelelwaniso oluzenzekelayo, kunye novavanyo oluzenzekelayo; nabaqalayo banokufunda ukuyisebenzisa ngosuku olunye.

VI. Iimeko eziqhelekileyo zokusetyenziswa

Umgca weMveliso we-CSP/WLCSP: Uvavanyo lwe-dicing oluyi-intshi ezi-8 kunye nefreyimu, olunomthamo ophezulu, olunemveliso ephezulu

Ukwenziwa kweMEMS: Iitships zoxinzelelo/i-accelerometer/i-gyroscope, uvavanyo lobushushu obuphezulu nobuphantsi kunye novavanyo lwe-micro-current

Izixhobo zoMbane: iiMOSFET, ii-IGBT, iidiode, uvavanyo lwe-high-voltage/high-current

IiWafers ezibhityileyo kakhulu: Iitships zeLogic/analog ezingaphantsi kwe-50μm, i-adsorption ecaleni elingasemva + i-warpage compensation

Izixhobo ze-elektroniki zeemoto: Isatifikethi se-AEC-Q100, uluhlu olubanzi lobushushu (-40℃ ~ 150℃) + uvavanyo lokuthembeka okuphezulu

VII. Uthelekiso nabaKhuphisani (Isishwankathelo esiKhawulezayo)

Itheyibhile yokuthelekisa into ACCRETECH FP2000 TEL Precio octo UF200R

Iwafer/Isakhelo Esisetyenziswa Kabini Iwafer Yenkxaso Yemveli Kuphela Iwafer Yenkxaso Kuphela

Ukuchaneka kokusika ±1μm (okulinganisiweyo) ±1.5μm (okungalinganisiweyo) ±1.5μm (okungalinganisiweyo)

Ukucubungula okuncinci kakhulu ≤50μm ≥100μm ≥75μm

Umthamo (ifreyimu ye-intshi ezi-8): Iiwafer ezingama-200–300 ngosuku

Isakhelo asixhaswa

Ixabiso: Phakathi-phezulu, Phakathi, Phantsi

Imeko Ezifanelekileyo: Isakhelo + I-Wafer, Ukupakisha Okuphambili, I-Wafer Ecocekileyo, Imveliso Ebanzi, I-Wafer Ecocekileyo, Imveliso Encinci Engabizi Kakhulu

Ngamafutshane: I-FP2000 yeyona sikhululo sovavanyo esipheleleyo kwimarike ye-8-intshi esinokujongana novavanyo oluchanekileyo oluphezulu lwe-"whole wafer" kunye ne-"diced frame". Ifanelekile ngokukodwa kwizicelo eziphambili ezifana ne-CSP/WLCSP, i-MEMS, kunye ne-ultra-thin wafers, kwaye yimodeli ephambili yovavanyo lwefreyimu kwihlabathi liphela ukususela ngo-2020 ukuya ku-2026.