Umatshini wokuMakisha we-ThinkLaser Semiconductor laser SC300

I-ThinkLaser SC300 yinkqubo yokumakisha yelaser ekumgangatho ophezulu, ezenzekelayo ngokupheleleyo "yokuMakisha okuthambileyo" eyenzelwe ngokukodwa ii-wafers ezingama-300mm. Ixabiso layo eliphambili likwikhono layo lokufaka iimpawu ezihlala ixesha elide nezifundekayo ngaphandle kokubangela umonakalo kwi-wafer okanye ukuvelisa inkunkuma—ngaloo ndlela ihlangabezana neemfuno ezingqongqo kakhulu zokukhupha kunye nokulandeleka ngaphakathi kwenkqubo ye-semiconductor yangaphambili.

Ekuqaleni yaphuhliswa ukuze yanelise imfuno enzima yokuphawula ii-wafers ezingenangcoliseko xa sele zingene kwindawo ecocekileyo.

**Imigaqo Yokusebenza kunye neeTekhnoloji Eziphambili**

Ukusebenza kunye neenzuzo zobugcisa ze-SC300 zinokuqondwa ngcono ngokuthelekiswa okulandelayo:

**Iteknoloji Ephambili** | **Umgaqo Wokusebenza** | **Iingenelo Eziphambili**

**Uphawu lweSuperSoftMark™** | Isebenzisa ilaser ene-Diode-Pumped Solid-State (DPSS) enelungelo lobunikazi; ngokulawula ngokuchanekileyo amandla elaser, idala iimpawu ezingaphantsi njenge-2.5µm kumphezulu we-wafer, itshintsha kuphela ukubonakaliswa kwezinto ngaphandle kokubangela umonakalo emzimbeni. | Ayinangcola, icocekile kakhulu, iimpawu ezicacileyo, kwaye akukho monakalo kwi-wafer.

**Iteknoloji yeLaser enelungelo lobunikazi** | Isebenzisa ilaser ye-1053 nm Nd:YLF enozinzo olubalaseleyo lwe-pulse (<0.5%), iqinisekisa ukuba ubunzulu bechaphaza ngalinye eliphawulweyo buyahambelana kwaye bakheke kakuhle. | Umgangatho wokumakisha ozinzileyo kunye nokujikeleza kwamachaphaza aphezulu (umlinganiselo we-axis enkulu ukuya kwencinci <1.1), ehlangabezana nemigangatho yomgangatho ongqongqo.

**Inkqubo yoLawulo oluPhambili** | Idibanisa ulawulo oluvaliweyo olukwinqanaba lenkqubo kunye nojongano lwe-SECS/GEM, okuvumela ukurekhodwa ngokuchanekileyo kwayo yonke idatha yokusebenza kwelaser ukuya kwinqanaba loLawulo lweNkqubo yeStatistical (SPC). | Inkqubo elawulekayo kakhulu nelandelekayo, ekwaziyo ukuhlanganiswa ngokungenamthungo kwiinkqubo ze-automation zefektri.

**Iinkcukacha zobugcisa**

Ngokusekelwe kubuchwepheshe bayo obuphambili, i-SC300 inale migaqo ilandelayo yobuchwephesha:

**Ubungakanani beWafer obuxhaswayo:** Umgangatho oqhelekileyo yi-300mm (12-intshi), kunye nokuhambelana okusezantsi kweewafers ezingama-200mm (8-intshi).

**Ukusebenza kokuphawula:** Isantya sokuphawula soonobumba omnye ukuya kuthi ga kwi-125 wafers ngeyure (WPH). Iqela ngalinye lokuphawula lixhasa ubuninzi beempawu ezingama-80.

**Ukuchaneka kokuphawula:** Ukuphinda-phinda okuphezulu, ukufikelela kwi-±0.125mm ngaphakathi kwendawo engama-50×50mm. Iinkcukacha ezibonakalayo: Iqulethe uyilo lwenkqubo yokupholisa umoya kwaye ihambelana nemigangatho emininzi yokhuseleko lwamazwe ngamazwe kunye nokusingqongileyo, kubandakanya i-CE, i-SEMI S2, i-S8, kunye ne-S14.

Iindawo zoSetyenziso

I-SC300 isebenza njengesixhobo esiphambili sokulandelela umkhondo ngaphakathi kwemigca yemveliso ye-semiconductor enkulu, esetyenziselwa ikakhulu:

Ukwenziwa kweWafer ePhambili: Ukuphawula iiwafers ngee-ID ezizodwa ukuze kube lula ukuhlalutya isivuno, ukuphucula inkqubo, kunye nokulandelela iiwafers.

Ukupakisha Okuphambili: Ukubonelela "ngamabala athambileyo" kwii-wafers okanye iiphaneli ezakhiwe ngokutsha ngexesha leenkqubo ze-Wafer-Level Packaging (WLP), ngaloo ndlela kuqinisekiswa ukulandeleka kwenkqubo ukusuka ekuqaleni ukuya ekupheleni.

IiCompound Semiconductors: Zisebenza kakuhle kwizixhobo ze-semiconductor zesizukulwana esilandelayo—ezifana neSiC, iGaN, kunye neGaAs—ukuze zihlangabezane neemfuno ezithile zeenkqubo zokwenza izinto ezikhethekileyo.

Iimveliso ezincedisayo

I-ThinkLaser inikezela ngesisombululo esibanzi sokuchonga i-wafer, apho i-SC300 idlala indima ebalulekileyo:

Ihambisana ne-HM300: I-SC300 igxile "ekumakisheni okuthambileyo" - indlela efuna ukuba umphezulu ungonakaliswa okanye ungcoliseko - ngelixa i-HM300 yenzelwe ukusetyenziswa "kokumakisheni okuqinileyo" okufuna ukuqina okuphezulu.

Inxalenye yoMgca weeMveliso zeSigmaClean/SigmaDSC: Ngelixa i-SC300 igxile kwimarike ye-300mm, iinkqubo zeSigmaClean kunye neSigmaDSC zisebenza njengezisombululo zokumakisha ezithambileyo ezizenzekelayo kwiiwafers ezinobukhulu obuyi-200mm kunye nezincinci; xa zizonke, ezi nkqubo zenza imatrix epheleleyo yemveliso yezisombululo zokumakisha iiwafer.

Isishwankathelo

Ukuqukumbela, iThinkLaser SC300 yinkqubo yokumakisha ethambileyo ephucukileyo ngobuchwepheshe eyenzelwe ngokukodwa ukwenziwa kwe-wafer enkulu ye-300mm. Ixabiso layo eliphambili likwitekhnoloji yayo yeSuperSoftMark™, ​​evumela ukumakisha okusebenzayo, okungenaluthuli, kunye nokuchaneka okuphezulu ngaphandle kokubangela nawuphi na umonakalo kumphezulu we-wafer—okwenza ukuba ibe sisixhobo esibalulekileyo sokuqinisekisa ukulandeleka kwenkqubo ukusuka ekuqaleni ukuya ekupheleni kwimveliso ye-semiconductor yanamhlanje.