Mashiinka Calaamadaynta laysarka ee ThinkLaser Semiconductor SC300

ThinkLaser SC300 waa nidaam calaamadayn laysar ah oo heer sare ah, oo si buuxda otomaatig u ah oo loogu talagalay si gaar ah loogu talagalay wafers-ka 300mm. Qiimaha asaasiga ah wuxuu ku jiraa awooddiisa uu ku dabaqo calaamado waara oo aad loo akhrin karo iyada oo aan waxyeello u geysan wafer-ka ama uu soo saaro qashin - sidaas darteedna wuxuu buuxinayaa shuruudaha aadka u adag ee wax soo saarka iyo raad-raaca ee habka semiconductor-ka hore.

Waxaa asal ahaan loo sameeyay si loo daboolo baahida adag ee calaamadaynta aan wasakhda lahayn ee buskudka marka ay galaan jawi nadiif ah.

**Mabaadi'da Hawlgalka iyo Tiknoolajiyada Muhiimka ah**

Hawlgalka iyo faa'iidooyinka farsamo ee SC300 waxaa si fiican loo fahmi karaa iyadoo la barbar dhigayo isbarbardhigga soo socda:

**Tiknoolajiyadda Aasaasiga ah** | **Mabda'a Hawlgalka** | **Faa'iidooyinka Muhiimka ah**

**SuperSoftMark™ Marking** | Waxay isticmaashaa laysar Diode-Pumped Solid-State (DPSS) oo shati haysta; iyadoo si sax ah u xakameysa tamarta laysarka, waxay abuurtaa calaamado gacmeed ilaa 2.5µm oo dusha sare ee wafer-ka ah, iyadoo beddeleysa oo keliya milicsiga walxaha iyada oo aan waxyeello jireed geysan. | Qashin la'aan, nadiifin sare, calaamado cad, iyo waxyeello aan loo geysan wafer-ka.

**Tiknoolajiyadda Laser-ka ee Shatiga haysta** | Waxay isticmaashaa laser 1053 nm Nd:YLF ah oo leh xasillooni garaac oo heer sare ah (<0.5%), iyadoo hubinaysa in qoto dheer ee dhibic kasta oo calaamadaysan ay tahay mid joogto ah oo si wanaagsan loo sameeyay. | Tayada calaamadaynta xasilloon oo leh wareeg dhibco sare leh (saamiga dhidibka weyn-ilaa-yar <1.1), oo buuxinaysa heerarka tayada adag.

**Nidaamka Xakamaynta Sare** | Waxay isku daraysaa xakamaynta wareegga xiran ee heerka nidaamka iyo is-dhexgalka SECS/GEM, taasoo suurtogalinaysa duubista saxda ah ee dhammaan xogta waxqabadka laysarka ilaa heerka Xakamaynta Habka Tirakoobka (SPC). | Habka aadka loo xakamayn karo oo la raadraaci karo, oo awood u leh isku-darka aan kala go 'lahayn ee nidaamyada otomaatiga warshadda.

**Faahfaahinta Farsamada**

Iyada oo ku saleysan teknoolojiyada asaasiga ah, SC300 waxay leedahay sifooyinka farsamo ee muhiimka ah ee soo socda:

**Cabbirka Wafer-ka ee la Taageero:** Heerka caadiga ah ee 300mm (12-inji), oo leh iswaafajin hoos u dhac ah oo loogu talagalay Wafer-ka 200mm (8-inji).

**Waxqabadka Calaamadaynta:** Xawaaraha calaamadaynta hal xaraf oo ah ilaa 125 wafer saacaddii (WPH). Koox kasta oo calaamadayntu waxay taageertaa ugu badnaan 80 xaraf.

**Saxnaanta Calaamadaynta:** Ku celcelinta booska sare, oo gaarta ±0.125mm gudaha aag 50×50mm ah. Tilmaamaha Jirka: Waxay leedahay naqshad nidaam qaboojin hawo ah waxayna u hoggaansan tahay heerar badan oo caalami ah oo badbaado iyo deegaan ah, oo ay ku jiraan CE, SEMI S2, S8, iyo S14.

Meelaha Codsiga

SC300 wuxuu u adeegaa sidii aalad raad-raac oo asaasi ah oo ku jirta khadadka wax soo saarka semiconductor-ka ee baaxadda weyn, oo inta badan loo isticmaalo:

Samaynta Wafer-ka Hore-Dhinaca: Calaamadaynta wafer-ka oo leh aqoonsiyo gaar ah si loo fududeeyo falanqaynta wax-soo-saarka, hagaajinta habka, iyo la socodka wafer-ka.

Baakad Sare: Bixinta "calaamad jilicsan" oo ku saabsan buskudka ama guddiyada dib loo dhisay inta lagu jiro hababka Baakadaha Heerka Wafer (WLP), taasoo hubinaysa in la raadraaci karo habka dhammaadka ilaa dhammaadka.

Konductor-yada Isku-dhafan: Si awood leh u farsameeya agabka semiconductor-ka jiilka soo socda—sida SiC, GaN, iyo GaAs—si loo daboolo shuruudaha gaarka ah ee hababka wax-soo-saarka ee gaarka ah.

Badeecadaha Dhammaystiran

ThinkLaser wuxuu bixiyaa qalab dhammaystiran oo lagu aqoonsado wafer-ka, kaas oo SC300 uu door muhiim ah ka ciyaaro:

Kaabis u ah HM300: SC300 wuxuu ku takhasusay "calaamadeynta jilicsan" - farsamo u baahan eber waxyeello ama wasakheyn dusha sare ah - halka HM300 loogu talagalay codsiyada "calaamadeynta adag" ee u baahan cimri dherer sare.

Qayb ka mid ah Khadka Waxsoosaarka SigmaClean/SigmaDSC: Iyadoo SC300 ay diiradda saareyso suuqa 300mm, nidaamyada SigmaClean iyo SigmaDSC waxay u adeegaan sidii xalal calaamadayn jilicsan oo otomaatig ah oo loogu talagalay wafers cabbirkoodu yahay 200mm iyo ka yar; marka la isku daro, nidaamyadani waxay sameeyaan matrix badeecad oo dhammaystiran oo loogu talagalay xalalka calaamadaynta wafer.

Soo koobid

Gunaanadkii, ThinkLaser SC300 waa nidaam calaamadayn jilicsan oo tignoolajiyadeed oo horumarsan oo si gaar ah loogu farsameeyay soo saarista wafer 300mm oo baaxad weyn leh. Qiimaha asaasiga ah wuxuu ku jiraa tignoolajiyada gaarka ah ee SuperSoftMark™, ​​taasoo suurtogalinaysa calaamadayn hufan, aan boodh lahayn, iyo saxnaan sare leh iyada oo aan waxyeello u geysan dusha sare ee wafer-ka - taasoo ka dhigaysa aalad aan lagama maarmaan u ah hubinta raad-raaca habka dhammaadka ilaa dhammaadka ee wax soo saarka semiconductor-ka casriga ah.