Imashini yo gushyira ikimenyetso cya laser ya ThinkLaser Semiconductor SC300

ThinkLaser SC300 ni sisitemu yo gushyira ibimenyetso bya laser yo mu rwego rwo hejuru, ikora mu buryo bwikora kandi bwikora, yagenewe by'umwihariko utubati twa 300mm. Agaciro kayo k'ingenzi ni ubushobozi bwayo bwo gushyira ibimenyetso biramba kandi bigaragara neza nta kwangiza utubati cyangwa ngo ikore imyanda—bityo ikaba yujuje ibisabwa bikomeye kugira ngo umusaruro n'uburyo bwo gukurikirana ibintu mu gutunganya ibice bya semiconductor imbere.

Byari byarakozwe mbere kugira ngo bihaze icyifuzo gikomeye cyo gushyira ikimenyetso ku biti bya wafers bidafite umwanda igihe bimaze kwinjira mu cyumba cy’isuku.

**Amahame y'imikorere n'ikoranabuhanga ry'ingenzi**

Imikorere n'ibyiza bya tekiniki bya SC300 bishobora kumvikana neza binyuze mu kugereranya gukurikira:

**Ikoranabuhanga ry'ingenzi** | **Ihame ry'imikorere** | **Ibyiza by'ingenzi**

**SuperSoftMark™ Marking** | Ikoresha laser ifite patenti ya Diode-Pumped Solid-State (DPSS); mu kugenzura neza ingufu za laser, ikora ibimenyetso bito cyane nka 2.5µm ku buso bwa wafer, igahindura gusa ubushobozi bw'ibikoresho bwo kugarura urumuri nta kwangirika ku mubiri. | Nta myanda, isuku nyinshi, ibimenyetso bisobanutse, kandi nta kwangirika kuri wafer.

**Ikoranabuhanga rya Laser rifite patenti** | Ikoresha laser ya 1053 nm Nd:YLF ifite ubushobozi bwo gupima umuvuduko udasanzwe (<0.5%), igenzura ko uburebure bwa buri kadomo kashyizweho buhamye kandi buhamye. | Ifite ubuziranenge buhamye bwo gushyira ibimenyetso hamwe n'uruziga rw'utudomo twinshi (igipimo cy'umurongo munini kugeza kuri muto <1.1), yujuje ibisabwa ku buziranenge.

**Sisitemu yo Kugenzura Ihanitse** | Ihuza uburyo bwo kugenzura bufunganye ku rwego rwa sisitemu hamwe n'uburyo bwa SECS/GEM, bigatuma habaho gufata neza amakuru yose ajyanye n'imikorere ya laser kugeza ku rwego rwa Statistical Process Control (SPC). | Uburyo bwo kugenzura cyane kandi bushobora gukurikiranwa, bushobora guhuzwa neza na sisitemu zo kwihutisha imikorere y'uruganda.

**Ibisobanuro bya tekiniki**

Hashingiwe ku ikoranabuhanga ryayo ry'ingenzi, SC300 ifite ibi bikurikira by'ingenzi bya tekiniki:

**Ingano za Wafer zishyigikiwe:** Isanzwe ya 300mm (santimetero 12), ifite ubushobozi bwo guhuza na wafer za 200mm (santimetero 8).

**Imikorere yo Gushyira Ikimenyetso:** Umuvuduko wo gushyira Ikimenyetso ku nyuguti imwe ni uburebure bwa wafer 125 ku isaha (WPH). Buri tsinda rishyiraho ikimenyetso rishobora gushyiramo inyuguti 80.

**Uburyo bwo Gushyira Ikimenyetso:** Ishobora gusubiramo ahantu henshi, igera kuri ± 0.125mm mu buso bwa 50×50mm. Ibiranga Imiterere: Ifite imiterere ya sisitemu yo gukonjesha umwuka kandi ikurikiza amahame mpuzamahanga menshi y’umutekano n’ibidukikije, harimo CE, SEMI S2, S8, na S14.

Ahantu ho Gukoresha Serivisi

SC300 ikora nk'igikoresho cy'ingenzi cyo gukurikirana ibintu mu mishinga minini ikora ibikoresho bya semiconductor, cyane cyane ikoreshwa muri ibi bikurikira:

Gukora Wafer yo mu mpera z'imbere: Gushyira ikimenyetso ku mawafers afite indangamuntu zihariye kugira ngo byoroshye gusesengura umusaruro, kunoza imikorere, no gukurikirana wafers.

Gupakira mu buryo bugezweho: Gutanga "ibimenyetso byoroshye" ku dupfunyika twakozwe bundi bushya cyangwa udupfunyika mu gihe cyo gupakira mu rwego rwa Wafer-Level (WLP), bityo bigatuma inzira ikurikiranwa kuva ku iherezo kugeza ku iherezo.

Imashini zikora ibikoresho bya semiconductor bivanze: Gutunganya neza ibikoresho bya semiconductor byo mu gisekuru gitaha—nk'i SiC, GaN, na GaAs—kugira ngo bihuze n'ibisabwa byihariye mu buryo bwihariye bwo gukora.

Ibicuruzwa by'inyongera

ThinkLaser itanga uburyo bwo kumenya amakuru ya wafer, aho SC300 igira uruhare runini:

Iyuzuzanya na HM300: SC300 yihariye mu "gushyiraho ikimenyetso cyoroshye" - uburyo budasaba kwangirika cyangwa kwanduzwa na gato - mu gihe HM300 yagenewe "gushyiraho ikimenyetso gikomeye" gisaba kuramba cyane.

Igice cy'umurongo w'ibicuruzwa bya SigmaClean/SigmaDSC: Nubwo SC300 yibanda ku isoko rya mm 300, sisitemu ya SigmaClean na SigmaDSC zikora nk'ibisubizo byikora byoroshye ku bisubizo bya wafer bifite ingano ya mm 200 no ntoya; hamwe, izi sisitemu zikora matrix yuzuye y'ibisubizo byo gushyiramo wafer.

Incamake

Muri make, ThinkLaser SC300 ni sisitemu yo gushyira ibimenyetso byoroshye mu ikoranabuhanga yagenewe by’umwihariko gukora wafer nini ya 300mm. Agaciro kayo k’ingenzi kari mu ikoranabuhanga ryayo rya SuperSoftMark™, ​​rituma habaho gushyira ibimenyetso neza, bidafite ivumbi, kandi binonosoye neza nta kwangiza ubuso bwa wafer—bigatuma iba igikoresho cy’ingenzi mu kugenzura ko inzira zose zigenda zikurikiranwa mu gukora semiconductor igezweho.