Umatshini wokuMakisha weLaser ye-ThinkLaser SigmaDSC Wafer

Indawo ephambili yeThinkLaser SigmaDSC yinkqubo yokumakisha yelaser ezenzekelayo ngokupheleleyo ethi "Hard Marking"—eyenzelwe ngokukodwa iiwafers eziyi-100mm ukuya kwi-200mm (4 ukuya kwi-8-intshi)—ehambelana ngokupheleleyo nemigangatho yokucoca yeClass 1 (ISO Class 3).

Ixabiso layo eliphambili lisekusebenziseni itekhnoloji yelaser enolawulo lobunzulu olucwangcisiweyo ukwenza iikhowudi zokuchonga ezihlala zihleli nezifundeka lula kwiiwafers. Ezi khowudi zenzelwe ukumelana nobunzima beenkqubo zokuvelisa ezisebenza ngamandla aphezulu—ezifana nokuncitshiswa kwecala elingasemva, unyango lobushushu obuphezulu, kunye nokucoca ngamakhemikhali—ngaloo ndlela kuqinisekiswa ukulandeleka okungqongqo kwemveliso kuyo yonke ijikelezo layo lobomi.

**Imigaqo-siseko**

Isiseko sobuchwepheshe seSigmaDSC sijikeleza "kwi-Hard Marking":

**Uphawu lweDot-Matrix Thermal:** Le ndlela isebenzisa umqadi welaser ogxile kakhulu, onamandla aphezulu ojolise kwiindawo ezithile kumphezulu we-wafer. Oku kubangela ukuba izinto zinyibilike okanye ziphele ngoko nangoko, zenze iindawo ezibonakalayo (ii-pits) ezinobunzulu obuthile (ukuya kuthi ga kwi-110 microns).

**Uzinzo Olugqithisileyo Lweepulse:** Isitshixo sokufikelela kwiimpawu eziqinileyo ezifanayo sixhomekeke kuzinzo olukhethekileyo lwe-pulse-to-pulse yomthombo we-laser. I-laser ye-ThinkLaser enelungelo lobunikazi le-diode-pumped solid-state laser ilawula uzinzo lwe-pulse ukuya kwinqanaba le-<0.5% kwi-frequency ye-1 kHz. Oku kuqinisekisa izinga eliphezulu lokuvumelana kubunzulu kunye nokujikeleza kwechaphaza ngalinye—lisebenza njengesiseko sokuqinisekisa umlinganiselo we-aspect (umlinganiselo we-axis omkhulu ukuya komncinci) we-<1.1 kunye nokuqinisekisa ukufundeka okuphezulu.

**I-Dual-Spot Optics™:** Uyilo olubalulekileyo olubonelela ngokuguquguquka okuphuculweyo, olu buchwepheshe luvumela abasebenzisi ukuba batshintshe phakathi kobukhulu obuhlukeneyo beendawo ezimbini—ukusuka kwi-50µm ukuya kwi-110µm—ngolawulo lwesoftware ngaphakathi kwenkqubo efanayo, ngaloo ndlela ivumela iintlobo ngeentlobo zezinto zokumakisha kunye neemfuno zesicelo.

**Iingenelo eziphambili kunye neenkcukacha**

I-SigmaDSC yenzelwe ukujongana noluhlu olubanzi lwezinto ezisetyenziswa kwi-substrate (kuquka iSilicon, iSilicon Carbide, iGallium Arsenide, iGallium Nitride, iGlasi, iiCeramics, njl.njl.) kunye nokumelana neemeko ezinzima zokwenza i-semiconductor. Iiparameter zayo zokusebenza eziphambili zichazwe ngokucacileyo:

**Udidi lweeMpawu** | **Inkcazo eneenkcukacha / Iinkcukacha ezithile**

**Ubuchule bokuMakisha oBunzima** | **Ulawulo loBunzulu oluCwangcisiweyo:** Ilungisa ngokuzenzekelayo ubunzulu bokuMakisha, ifikelela kwi-110 µm.

**Ukuchaneka kobunzulu:** ±10%.

**Ubungakanani:** Ukuya kuthi ga kwiiwafer ezingama-250 ngeyure. Ukuchaneka nokuLungelelanisa | UkuLungelelanisa kunye neNkqubo: Ihambelana neewafer ezingama-100mm ukuya kuma-200mm, kunye neepaneli ezingama-300mm/310mm.

Ukuchaneka kokuphawula: Ngaphakathi kwendawo engama-50x50mm emva kokulungelelaniswa kwe-wafer, ukuphindaphindwa kwayo yi-±0.125 mm.

Ukusetyenziswa Okubanzi: Ifanelekile kwiindidi ezahlukeneyo zezinto, kuquka iSilicon (Si), iSilicon Carbide (SiC), iGallium Arsenide (GaAs), iGallium Nitride (GaN), nezinye.

Ukuzenzekelayo kunye noNxibelelwano | Ukusebenza ngokuzenzekelayo ngokupheleleyo: Kunciphisa ukungenelela ngesandla kwaye kuxhasa ukuphathwa kweKhaseti evulekileyo.

I-Factory Automation Interface: Ixhasa iiprotokholi ze-SECS II/GEM zokudibanisa ngaphandle komthungo kwiinkqubo ze-MES zefektri.

Ukubeka iliso kwiNkqubo ngokuBanzi: Irekhoda ngokuchanekileyo yonke idatha yokusebenza kwelaser ukuya kwinqanaba le-SPC (Statistical Process Control).

Iinkcukacha zeZixhobo | Uhlobo lweLaser: Nd:YLF diode-pumped solid-state laser.

Ubude beLaser Wave: 1053 nm.

Indawo Yokuphawula: Ngaphakathi kwe-25mm annular band ukusuka kumphetho we-wafer, okuvumela ukubekwa kwamaqela amaninzi okuphawula kuyo nayiphi na indlela.

Inkqubo yokusebenza: Windows 7 Pro SP1 (32-bit).

Imigangatho yoShishino | Imigangatho ye-SEMI: Ihambelana ngokupheleleyo nemigangatho ye-SEMI, ixhasa iinkcukacha zokumakisha ezifana ne-T7, i-M12, kunye ne-M13.

Iziqinisekiso zamazwe ngamazwe: Ziyahambelana nemigangatho yokhuseleko kunye nokusingqongileyo kuquka i-CE, i-SEMI S2, i-S8, kunye ne-S14.

Imisebenzi ephambili kunye nezicelo

I-SigmaDSC isetyenziswa kakhulu kwiindawo zokuvelisa ii-semiconductor apho ukugcina ukulandeleka okuphezulu kuyo yonke i-lifecycle yemveliso kubalulekile:

Ukwenziwa kweWafer engaphambili kweSemiconductor: Kwangoko nje xa kungena kwigumbi lokucoca, kubhalwa i-ID ekhethekileyo nehlala ihleli kwi-wafer—i-ID eyenzelwe ukumelana nobunzima bazo zonke iindlela zokucubungula ezinzima ezilandelayo (ezifana nokuncitshiswa kwecala elingasemva). Oku kusebenza njengomthombo wolwazi lokulandelela umgangatho kunye nedatha yoLawulo lweNkqubo yeStatistical (SPC) kuyo yonke imisebenzi yemveliso—ukuvelisa i-wafer ye-silicon, ii-foundries, kunye nabavelisi beZixhobo eziDibeneyo (ii-IDM).

Ukupakisha Okuphambili: Kubonelela ngophawu oluthembekileyo lwe-ID kwiiWafers okanye iiPaneli eziHlaziyiweyo ngaphakathi kwenkqubo yokupakisha iWafer-out Wafer-Level (Fan-out WLP).

**Uthelekiso lweZixhobo eziNcedisayo kunye neMigca yeeMveliso**

I-SigmaDSC yinxalenye ebalulekileyo kwisisombululo esibanzi sokuchonga i-wafer se-ThinkLaser. Inkqubo ye-SigmaClean oyikhankanyileyo isebenza njengenkxaso eyahlukileyo kuyo:

**Impawu** | **I-SigmaDSC (Uphawu Oluqinileyo)** | **I-SigmaClean (Uphawu Oluthambileyo)**

**Inkqubo Engundoqo** | Ukumakisha Okuqinileyo | Ukumakisha Okuthambileyo

**Iingenelo eziphambili** | Iimpawu zinobunzulu obubonakalayo; ziyakwazi ukumelana namanyathelo anzima emva kokulungiswa, njengokugaya ngoomatshini. | Akukho nkunkuma kwaye icocekile kakhulu; ihlangabezana neemfuno ezingqongqo zegumbi lokucoca.

**Iimeko eziqhelekileyo zokusetyenziswa** | Isetyenziselwa ii-wafers ezisebenza kwiinkqubo "eziqinileyo"—ezifana nokuncitshiswa kwecala elingasemva—ukubonelela ngokulandeleka okusisigxina. | Isetyenziswa kwiindawo zokwenza ii-wafers ezingaphambili apho kungekho monakalo kumphezulu kwaye ucoceko oluphezulu kakhulu lubaluleke kakhulu.

**Isishwankathelo**

I-ThinkLaser SigmaDSC yinkqubo yokumakisha yelaser ezenzekelayo ngokupheleleyo ezinikele ekuboneleleni "ngophawu oluqinileyo" oluhlala ixesha elide kwiiwafers ezingama-200mm. Iingenelo zayo eziphambili zobuchwepheshe zikwinkqubo yayo yokulawula ubunzulu obucwangcisiweyo, iteknoloji yeDual-Spot Optics™, kunye ne-SECS/GEM interface yokwenza izinto ngokuzenzekelayo ngokupheleleyo. Isebenzisa inkqubo yelaser ezinzileyo, ulawulo oluvaliweyo, kunye neempawu ze-automation eziphambili, iqinisekisa ukufana okumangalisayo kobunzulu beempawu kunye nokujikeleza kuzo zonke izixhobo ezahlukeneyo ze-substrate. Endaweni yokwenza imisebenzi yokucoca okanye yokuhlanganisa, isebenza umsebenzi obalulekileyo wokubonelela ngokuqinisekiswa kobuwena behlabathi kwiiwafers.