ThinkLaser SigmaDSC Wafer Laser Ekyuma Ekikuba obubonero

Ensengeka enkulu eya ThinkLaser SigmaDSC y'enkola ey'okussaako obubonero bwa layisi "Hard Marking" mu bujjuvu —ekoleddwa mu ngeri ey'enjawulo ku wafers za mm 100 okutuuka ku mm 200 (yinsi 4 ku 8) —etuukana mu bujjuvu n'omutindo gwa Class 1 (ISO Class 3) cleanroom.

Omugaso gwayo omukulu guli mu kukozesa tekinologiya wa layisi nga alina programmable depth control okukola programmable identification codes ku wafers. Koodi zino zikoleddwa okusobola okugumira obuzibu bw’enkola eziddirira ez’okukola ebintu mu ngeri ey’amaanyi ennyo —gamba ng’okugonza emabega, okulongoosa mu bbugumu eringi, n’okuyonja eddagala —bwe kityo ne kikakasa nti ebintu bilondoolebwa nnyo mu bulamu bwakyo bwonna.

**Emisingi Emikulu**

Omusingi gwa tekinologiya ogwa SigmaDSC gwetoolodde "Hard Marking":

**Dot-Matrix Thermal Marking:** Enkola eno ekozesa ekitangaala kya layisi ekitunuuliddwa, eky’amaanyi amangi nga kitunuulidde ebifo ebitongole ku ngulu wa wafer. Kino kireetera ekintu okusaanuuka oba okufuumuuka amangu ddala era mu kitundu, ne kikola ebisenge ebirabika (ebinnya) ebirina obuziba obw’enjawulo (okutuuka ku 110 microns).

**Extreme Pulse Stability:** Ekisumuluzo ky'okutuuka ku uniform hard marking kiri mu laser source's exceptional pulse-to-pulse stability. ThinkLaser’s patented diode-pumped solid-state laser efuga okutebenkera kw’omukka okutuuka ku ddaala lya <0.5% ku frequency ya 1 kHz. Kino kikakasa eddaala ery’okukwatagana erya waggulu mu buziba n’okwekulukuunya kwa buli nsonga emu —ekikola ng’ejjinja ery’oku nsonda okukakasa omugerageranyo gw’enjuyi (omugerageranyo gw’ekisiki ekinene n’ekitono) ogwa <1.1 n’okukakasa okusoma okw’ekika ekya waggulu.

**Dual-Spot OpticsTM:** Ekintu ekikulu eky’okukola dizayini ekiwa obusobozi obw’enjawulo, tekinologiya ono asobozesa abakozesa okukyusa wakati wa sayizi z’ebifo bbiri ez’enjawulo —okuva ku 50μm okutuuka ku 110μm—nga bayita mu kufuga pulogulaamu mu nkola y’emu, bwe kityo ne kikwatagana n’ebintu eby’enjawulo eby’okussaako obubonero n’ebyetaago by’okukozesa.

**Ebirungi ebikulu & Ebikwata ku nsonga**

SigmaDSC ekoleddwa yinginiya okukwata ebintu eby’enjawulo ebikolebwa mu substrate (omuli Silicon, Silicon Carbide, Gallium Arsenide, Gallium Nitride, Glass, Ceramics, n’ebirala) n’okugumira embeera ezisaba ennyo mu kukola semikondokita. Ebipimo byayo ebikulu eby’omutindo gw’emirimu bitegeezeddwa bulungi:

**Ekika ky'ebintu** | **Ennyonnyola enzijuvu / Ebikwata ku nsonga eno**

**Obusobozi bw'okussaako obubonero obukalu** | **Programmable Depth Control:** Etereeza obuziba bw’okussaako obubonero mu ngeri ey’otoma, okutuuka ku 110 μm.

**Obutuufu bw'obuziba:** ±10%.

**Ekiyita:** Wafers ezituuka ku 250 buli ssaawa. Obutuufu & Okukwatagana | Compatibility & Process: Ekwatagana ne wafers eza mm 100 okutuuka ku mm 200, wamu ne panels eza mm 300/mm 310.

Obutuufu bw’okussaako obubonero: Mu kitundu kya mm 50x50 oluvannyuma lw’okulaganya wafer, okuddiŋŋana kuli mm ±0.125.

Okukozesebwa mu bugazi: Esaanira ebintu eby’enjawulo, omuli Silicon (Si), Silicon Carbide (SiC), Gallium Arsenide (GaAs), Gallium Nitride (GaN), n’ebirala.

Automation & Empuliziganya | Fully Automated Operation: Ekendeeza ku kuyingira mu nsonga mu ngalo era ewagira okukwata Open Cassette.

Factory Automation Interface: Ewagira SECS II/GEM protocols okusobola okugatta awatali kusosola mu nkola za MES ez’amakolero.

Okulondoola enkola okujjuvu: Kuwandiika bulungi data zonna ez’omutindo gwa layisi okutuuka ku ddaala lya SPC (Statistical Process Control).

Ebikwata ku Hardware | Ekika kya Layisi: Layisi ey’embeera enkalu epampuddwa Nd:YLF dayode.

Obuwanvu bw’amayengo ga Layisi: 1053 nm.

Ekifo eky’okussaako obubonero: Mu 25mm annular band okuva ku wafer edge, okusobozesa okuteeka ebibinja by’obubonero ebingi mu orientation yonna.

Enkola y’emirimu: Windows 7 Pro SP1 (32-bit).

Omutindo gw'amakolero | Omutindo gwa SEMI: Gugoberera mu bujjuvu omutindo gwa SEMI, nga guwagira ebiragiro ebikwata ku kussaako obubonero nga T7, M12, ne M13.

Ebbaluwa z’ensi yonna: Egoberera omutindo gw’obukuumi n’obutonde omuli CE, SEMI S2, S8, ne S14.

Emirimu Ebikulu & Enkozesa

SigmaDSC okusinga ekozesebwa mu mbeera z’okukola semikondokita ng’okukuuma okulondoola okw’amaanyi mu bulamu bwonna obw’ebintu kikulu nnyo:

Semiconductor Front-end Wafer Manufacturing: Amangu ddala nga oyingidde mu kisenge ekiyonjo, ID ey’enjawulo, ey’olubeerera ewandiikibwa ku wafer —ID ekoleddwa okugumira obuzibu bw’emitendera gyonna egy’okukola egy’obukambwe egyaddirira (nga okugonza ku ludda lw’emabega). Kino kikola ng’obulamu bw’okulondoola omutindo n’okufuga enkola y’emitindo (SPC) data mu nkola yonna ey’emirimu gy’okufulumya-ekwata ku kukola silicon wafer, foundries, ne Integrated Device Manufacturers (IDMs).

Okupakinga okw’omulembe: Kuwa obubonero obwesigika obwa ID ku Wafers oba Panels ezikoleddwa Reconstituted mu nkola za Fan-out Wafer-Level Packaging (Fan-out WLP).

**Okugeraageranya ebyuma ebijjuliza n'ennyiriri z'ebintu**

SigmaDSC ekola ekitundu ekikulu munda mu ThinkLaser’s comprehensive wafer identification solution. Enkola ya SigmaClean gy’oyogeddeko ekola ng’ekintu eky’enjawulo ekigijjuliza:

**Ekifaananyi** | **SigmaDSC (Okussaako obubonero obukaluba)** | **SigmaClean (Okussaako obubonero obugonvu)**

**Enkola Enkulu** | Okussaako obubonero obukaluba | Okussaako obubonero obugonvu

**Ebirungi Ebikulu** | Obubonero bulina obuziba obw’omubiri; asobola okugumira emitendera egy’amaanyi egy’oluvannyuma lw’okulongoosa, gamba ng’okusena mu byuma. | Temuli bifunfugu ng’erina obuyonjo obw’amaanyi ennyo; etuukiriza ebisaanyizo ebikakali eby’ekisenge ekiyonjo.

**Enkola eza bulijjo ez'okukozesa** | Ekozesebwa ku wafers eziyita mu nkola "enzibu" —nga okugonza ku ludda lw'emabega —okuwa okulondoola okw'olubeerera. | Ekozesebwa mu mbeera z’okukola wafer ez’omu maaso nga zero okwonooneka kungulu n’obuyonjo obw’amaanyi ennyo bye bisinga obukulu.

**Okubumbako**

ThinkLaser SigmaDSC nkola ya layisi ekola obubonero mu bujjuvu era nga yeewaddeyo okuwa "obubonero obuzibu" obuwangaala ennyo ku wafers za mm 200. Ebirungi byayo ebikulu mu tekinologiya biri mu kufuga obuziba obusobola okuteekebwa mu pulogulaamu, tekinologiya wa Dual-Spot OpticsTM, n’enkolagana ya SECS/GEM okusobola okukola mu ngeri ey’obwengula mu bujjuvu. Nga ekozesa enkola ya layisi ennywevu, okufuga okuggaddwa-loopu, n’ebintu eby’omulembe eby’okukola otomatiki, ekakasa obuziba bw’akabonero obw’enjawulo obufaanagana n’okwekulukuunya mu bintu eby’enjawulo ebya substrate. Mu kifo ky’okukola emirimu gy’okuyonja oba okukuŋŋaanya, ekola omulimu omukulu ogw’okuwa okukakasa endagamuntu y’ensi yonna ku wafers.