Umatshini wokuMakisha weLaser we-ThinkLaser HM300 wafer

I-ThinkLaser HM300 yimatshini yokumakisha i-laser esebenza ngokuzenzekelayo ngokupheleleyo "yokuMakisha okunzima", eyenzelwe ngokukodwa ukuhlangabezana neemfuno eziqinileyo zokumakisha okunzulu—ezaziwa ngokuba "kukumakisha okunzima"—ezivela kwinkqubo yokwenziwa kwe-semiconductor wafer. Ixabiso layo eliphambili likwikhono layo lokuqopha iikhowudi zokuchonga ezisisigxina kwii-wafers ngokusebenzisa umsebenzi wokulawula ubunzulu ocwangcisiweyo; ezi khowudi ziqinile ngokwaneleyo ukumelana noxinzelelo olurhabaxa olubangelwa ziinkqubo zokuvelisa ezisebenza ngamandla aphezulu, ngaloo ndlela ziqinisekisa ukulandeleka kwemveliso ngokupheleleyo kuyo yonke i-lifecycle yayo—ukusuka ekwenziweni kwee-chip kunye nokupakishwa ukuya kuvavanyo lokugqibela.

**Iiteknoloji eziphambili kunye neenkcukacha eziphambili**

Isiseko sobuchwepheshe se-HM300 sijikeleza kwizinto ezintathu ezisisiseko: ubunzulu, ukuchaneka, kunye nokuzisebenzela ngokuzenzekelayo. Iinkcukacha zayo zobugcisa zezi zilandelayo:

**Into** | **Inkcazo/Inkcazo**

**Uhlobo lweZixhobo** | Inkqubo yokuMakisha yeLaser eQinileyo eZenzekelayo ngokupheleleyo

**Usetyenziso olujoliswe kulo** | Yenzelwe ngokukodwa uphawu oluqinileyo lwe-semiconductor wafer, oluhambelana neemfuno ezifanelekileyo zemigangatho ye-SEMI

**Ukusebenza Okungundoqo** | Ulawulo Lobunzulu Olucwangcisiweyo: Ubunzulu bokumakisha obuhlengahlengiswayo, bufikelela kubunzulu obukhulu be-110 microns (µm), kunye nokuchaneka kobunzulu be-±10%

**Iteknoloji Engundoqo** | I-Dual-Spot Optics™: Isebenzisa uyilo lwe-optical olunemiqadi emibini oluvumela ukutshintsha okulawulwa yisoftware phakathi kobukhulu obuhlukeneyo be-laser spot (ukusuka kwi-50 µm ukuya kwi-110 µm) ngaphakathi kwenkqubo efanayo.

**Ukubeka iliso kwinkqubo** | Ukubek' iliso kwinkqubo ngokubanzi: Irekhoda ngokuchanekileyo yonke idatha yokusebenza kwelaser

**Ujongano oluzenzekelayo** | Ixhasa ujongano lwe-SECS II/GEM ukuze kube lula ulawulo oluzenzekelayo lwefektri

**Ukuhambelana kweWafer** | Ixhasa ubungakanani bewafer obuyi-100mm ukuya kwi-200mm (inkxaso ekhethwayo yeephaneli ze-300mm/310mm iyafumaneka; ukwenzeka kwayo kuqinisekisiwe ngedatha ekhoyo)

**Imisebenzi, Iingenelo, kunye neempawu**

Isebenzisa uluhlu lwetekhnoloji eziphambili, i-HM300 ijongana ngempumelelo neengongoma eziphambili zentlungu kwicandelo lokuphawula ii-wafer:

**Ubuchule "bokuMakisha okunzima" kwiinkqubo ezingqongqo:** Ngokungafaniyo "noMaki othambileyo," ubuchule be-HM300 "bokuMakisha okunzima" buvelisa amanqaku obunzulu obaneleyo. Oku kuqinisekisa ukuba amanqaku ahlala elungile—ngaphandle kokuwohloka okanye ukukrazuka—kwiinkqubo ezilandelayo ezinamandla aphezulu (ezifana nonyango lobushushu obuphezulu, ukucoca ngamakhemikhali, kunye nokusila ngoomatshini), ngaloo ndlela kugcinwa ukulandeleka okupheleleyo kwenkqubo. **Ubuchule obuphezulu kunye nokuguquguquka:**

**Ubunzulu Obulawulekayo:** Umsebenzi wolawulo lobunzulu obucwangcisiweyo (obonelela ngokuchanekileyo ukuya kuthi ga kwi-±10% kunye nobubanzi bobunzulu obufikelela kwi-110 µm) unika abathengi amandla okulungisa ngokuchanekileyo ubunzulu bokumakisha, ukuqinisekisa ukuhambelana ngokugqibeleleyo neemfuno ezithile zenkqubo. **Ubungakanani Bendawo Obulungisekayo:** Itekhnoloji yayo ye-Dual-Spot Optics™ enelungelo lobunikazi ivumela ukutshintsha okulawulwa yisoftware phakathi kobukhulu beendawo ezimbini ze-laser (50 µm kunye ne-110 µm) ngaphandle kokufuna naluphi na utshintsho lwehardware, ngaloo ndlela ivumela uluhlu olwahlukeneyo lwezinto zokumakisha kunye neemfuno ezithile zobuhle.

**Ulawulo oluzenzekelayo kunye nobukrelekrele:**

**Ukusebenza Okuzenzakalelayo Ngokupheleleyo:** Inika amandla okusebenza kwezixhobo ngokuzenzekelayo ngokupheleleyo, inciphisa ukungenelela kwabantu kwaye inciphisa amathuba okwenza iimpazamo.

**Inkxaso yeProtokholi ye-SECS/GEM:** Ixhasa iiprotokholi ze-automation ezisemgangathweni zoshishino (SECS II/GEM), ezivumela ukuhlanganiswa okungenamthungo kwiNkqubo yokuSebenza kweMveliso (MES) yeefektri ze-semiconductor zanamhlanje ukuze kuvumeleke ukujonga imeko yezixhobo ngexesha langempela kunye nolawulo olukude lweeparamitha zenkqubo.

**Ukurekhoda Iinkcukacha Ngokupheleleyo:** Inkqubo irekhoda ngokuchanekileyo yonke idatha yokusebenza kwelaser, inika isiseko esiqinileyo sohlalutyo lwenkqubo kunye nokulandelelwa komgangatho.

**Ukuhambelana kwezinto ezibanzi kunye neNkqubo:**

Yenzelwe ngokukodwa abathengi abasebenza kwicandelo lee-compound semiconductors, ii-process nodes eziphambili, kunye nokupakisha okuphucukileyo, le nkqubo ijongana ngempumelelo nemingeni yokuphawula enxulumene nezixhobo ze-semiconductor zesizukulwana esilandelayo ezifana neSiC, GaN, kunye neGaAs.

Ifilosofi yayo yoyilo idlulela ngaphaya kwemisebenzi esisiseko yokumakisha; ibekwe njenge "sisombululo esibanzi sokumakisha i-wafer," esikwaziyo ukuphononongwa kunye nokuhlaziywa ngokwezifiso—elungiselelwe izixhobo kunye nobukhulu be-wafer obukhethekileyo—ukuze kuhlangatyezwane neemfuno ezithile.

**Iindawo zokufaka isicelo**

I-HM300 sisixhobo esibalulekileyo kwicandelo lokuvelisa ii-semiconductor kunye nokupakisha okuphucukileyo, esetyenziswa kakhulu kwezi ndawo zilandelayo:

**Ukwenziwa kweeSemiconductor (I-Front-end kunye ne-Back-end):** Ibonelela ngee-ID ezisisigxina ezisemgangathweni ophezulu zee-wafers ze-substrate—kuquka i-silicon, i-SiC, kunye ne-GaN—ngaloo ndlela ixhasa ulawulo lwemigca oluzenzekelayo kunye nokulandeleka komgangatho kwizityalo zokwenza izinto (iiFabs) kunye nezakhiwo zokuhlanganisa/zovavanyo.

**Ukupakisha Okuphambili:** Inika uphawu oluthembekileyo kwiiwafers okanye iipaneli ezakhiwe ngokutsha ngaphakathi kwenkqubo yokupakisha iWafer-Level (WLP) kunye nePanel-Level Packaging (PLP).

**Intsebenziswano nezinye iimveliso zeThinkLaser**

I-ThinkLaser inikezela ngesisombululo esibanzi sezisombululo zokumakisha ii-wafer, apho i-HM300 idlala indima ebalulekileyo:

**Intsebenziswano neZixhobo zokuMakisha eziThambileyo:** Kumgca ofanayo wemveliso, i-HM300 inokusebenza ngaxeshanye ne-ThinkLaser's SC300 (inkqubo yokumakisha ethambileyo yee-wafers ezingama-300mm) okanye i-SigmaClean (inkqubo yokumakisha ethambileyo yee-wafers ezingama-100–200mm). Abavelisi banokukhetha ngokuguquguquka itekhnoloji yokumakisha efanelekileyo ngokusekelwe kwii-nodes ezithile zenkqubo okanye iimfuno zabathengi.

**Isishwankathelo**

Ngamafutshane, iThinkLaser HM300 yinkqubo ekhethekileyo, ekumgangatho wezoshishino eyenzelwe ngokusisiseko ukubonelela ngophawu lwe-wafer olulawulwa bubunzulu, oluhlala luhleli oluhlangabezana nemigangatho yeshishini enzima kakhulu. Ngokusebenzisa ulawulo lwayo lobunzulu olucwangcisiweyo, iteknoloji ye-dual-beam, kunye nobuchule bokuzenzekela obuphambili, isombulula ngempumelelo umngeni obalulekileyo kwishishini le-semiconductor wokugcina ukulandeleka kwemveliso kuyo yonke imixokelelwane yenkqubo enamandla aphezulu; imi njengesixhobo esibalulekileyo kwimigca yokuvelisa kunye nokupakisha ye-wafer ephezulu. Umphuhlisi wayo, iThinkLaser, uqhayisa ngamava eqela elihlangeneyo angaphezu kweminyaka engama-80 kweli candelo kwaye unesabelo semarike esimalunga nama-80% eMelika.