Makina Olembera a Laser a ThinkLaser HM300 Wafer

ThinkLaser HM300 ndi makina olembera laser opangidwa ndi makina odziyimira okha a "Hard Marking", opangidwa mwapadera kuti akwaniritse zofunikira zolimba zolembera - zomwe zimadziwika kuti "hard marking" - zomwe zimapangidwa mu njira yopangira ma wafer a semiconductor. Phindu lake lalikulu lili mu kuthekera kwake kulemba ma code ozindikiritsa okhazikika pa ma wafer kudzera mu ntchito yowongolera kuya kwa pulogalamu; ma code awa ndi olimba mokwanira kuti athe kupirira kupsinjika komwe kumachitika chifukwa cha njira zopangira zamphamvu kwambiri, motero kuonetsetsa kuti zinthu zikutsatira bwino nthawi yonse ya moyo wake - kuyambira pakupanga ma chip ndi mapaketi mpaka kuyesa komaliza.

**Maukadaulo Aakulu ndi Mafotokozedwe Ofunika**

Pakati pa ukadaulo wa HM300 pamakhala zinthu zitatu zofunika: kuya, kulondola, ndi kudzipangira zokha. Mafotokozedwe ake apadera aukadaulo ndi awa:

**Chinthu** | **Kufotokozera / Kufotokozera**

**Mtundu wa Zipangizo** | Dongosolo Lolemba Zolemba za Laser Lokhazikika Lokha

**Kugwiritsa Ntchito Cholinga** | Yopangidwira makamaka kuyika chizindikiro cholimba cha semiconductor wafer, mogwirizana ndi zofunikira za miyezo ya SEMI

**Kugwira Ntchito Kwambiri** | Kuwongolera Kuzama Kosinthika: Kuzama kosinthika kolemba, kufika pa kuya kwakukulu kwa ma microns 110 (µm), ndi kulondola kwa kuzama kwa ± 10%

**Ukadaulo Wapakati** | Dual-Spot Optics™: Imagwiritsa ntchito kapangidwe ka kuwala kokhala ndi mipata iwiri komwe kumalola kusinthana koyendetsedwa ndi mapulogalamu pakati pa kukula kwa malo awiri osiyana a laser (kuyambira 50 µm mpaka 110 µm) mkati mwa dongosolo lomwelo.

**Kuwunika Dongosolo** | Kuwunika Dongosolo Lonse: Kulemba molondola deta yonse yogwira ntchito ndi laser

**Chipangizo Chodzipangira Chokha** | Chimathandizira mawonekedwe a SECS II/GEM kuti chithandizire kuyang'anira makina odzipangira okha m'fakitale

**Kugwirizana kwa Wafer** | Imathandizira kukula kwa wafer wa 100mm mpaka 200mm (chithandizo chosankha cha mapanelo a 300mm/310mm chilipo; kuthekera kwatsimikiziridwa kudzera mu deta yomwe ilipo)

**Ntchito, Ubwino, ndi Makhalidwe**

Pogwiritsa ntchito ukadaulo wapamwamba, HM300 imagwira ntchito bwino pochiza mavuto akuluakulu omwe ali m'munda wa kulemba ma wafer:

**Kutha kwa "Kulemba Zolimba" pa Njira Zolimba:** Mosiyana ndi "Kulemba Zofewa," luso la "Kulemba Zolimba" la HM300 limapanga zizindikiro zakuya kokwanira. Izi zimatsimikizira kuti zizindikirozo zimakhalabe zonse—popanda kuwonongeka kapena kusweka—panthawi yonse ya njira zotsatizana (monga kukonza kutentha kwambiri, kuyeretsa mankhwala, ndi kupukuta makina), motero kusunga njira yonse yotsatirira. **Kulondola Kwambiri ndi Kusinthasintha:**

**Kuzama Kowongolera:** Ntchito yowongolera kuzama kosinthika (yomwe imapereka kulondola kwa ± 10% ndi kuzama kofikira 110 µm) imapatsa makasitomala mphamvu yokonza kuzama kolemba molondola, kuonetsetsa kuti kukugwirizana bwino ndi zofunikira zinazake. **Kukula kwa Malo Osinthika:** Ukadaulo wake wa Dual-Spot Optics™ wovomerezeka umalola kusinthana pakati pa kukula kwa malo awiri a laser (50 µm ndi 110 µm) popanda kufunikira kusintha kulikonse kwa hardware, motero kumakwaniritsa mitundu yosiyanasiyana ya zida zolembera ndi zofunikira zinazake zokongola.

**Kuyendetsa Zokha ndi Kuyang'anira Mwanzeru:**

**Kugwira Ntchito Yokha Yokha:** Imapereka mphamvu zogwirira ntchito zida zokha, kuchepetsa kulowererapo kwa anthu ndikuchepetsa kuthekera kwa zolakwika.

**Kuthandizira kwa Mapuloteni a SECS/GEM:** Kumathandizira ma protocol odziyimira pawokha (SECS II/GEM) omwe amagwiritsidwa ntchito m'makampani osiyanasiyana, zomwe zimathandiza kuti pakhale kuphatikizana bwino mu Manufacturing Execution Systems (MES) ya makina amakono a semiconductor kuti athe kuyang'anira momwe zinthu zilili panthawi yeniyeni komanso kuyang'anira magawo a ntchito patali.

**Kulemba Deta Mokwanira:** Dongosololi limalemba molondola deta yonse yogwira ntchito ya laser, zomwe zimapangitsa kuti pakhale maziko olimba owunikira njira ndi kutsata bwino.

**Kugwirizana kwa Zinthu Zambiri ndi Njira:**

Dongosololi, lomwe lapangidwa makamaka kwa makasitomala omwe amagwira ntchito m'magawo a ma semiconductors ophatikizika, ma node apamwamba, ndi ma phukusi apamwamba, limathetsa mavuto okhudzana ndi zida za semiconductor za m'badwo wotsatira monga SiC, GaN, ndi GaAs.

Malingaliro ake a kapangidwe kake amapitirira ntchito zoyambira zolembera; amaikidwa ngati "njira yolumikizirana yonse ya wafer," yomwe imatha kuyesedwa ndi kusinthidwa mwamakonda - yokonzedwa kuti igwirizane ndi zida zapadera za wafer ndi miyeso - kuti ikwaniritse zofunikira zinazake.

**Malo Ogwiritsira Ntchito**

HM300 ndi chida chofunikira kwambiri pakupanga zinthu zopangidwa ndi semiconductor ndi ma phukusi apamwamba, makamaka omwe amagwiritsidwa ntchito m'magawo otsatirawa:

**Kupanga Ma Semiconductor (Front-end ndi Back-end):** Kumapereka ma ID okhazikika a substrate wafers—kuphatikizapo silicon, SiC, ndi GaN—motero kumathandiza kasamalidwe ka mizere yodziyimira payokha komanso kutsata bwino mkati mwa mafakitale opanga (Fabs) ndi malo osonkhanitsira/kuyesa.

**Kupaka Kwapamwamba:** Kumapereka chizindikiro chodalirika cha ma wafer kapena mapanelo omangidwanso mkati mwa njira za Wafer-Level Packaging (WLP) ndi Panel-Level Packaging (PLP).

**Kugwirizana ndi Zinthu Zina za ThinkLaser**

ThinkLaser imapereka mndandanda wathunthu wa mayankho olembera ma wafer, momwe HM300 imagwira ntchito yofunika kwambiri:

**Kugwirizana ndi Zipangizo Zolembera Zofewa:** Pa mzere womwewo wopanga, HM300 imatha kugwira ntchito limodzi ndi ThinkLaser's SC300 (dongosolo lolembera lofewa la ma wafer a 300mm) kapena SigmaClean (dongosolo lolembera lofewa la ma wafer a 100–200mm). Opanga amatha kusankha ukadaulo woyenera kwambiri wolembera kutengera ma node enaake kapena zofunikira za makasitomala.

**Chidule**

Mwachidule, ThinkLaser HM300 ndi njira yapadera, yogwiritsidwa ntchito m'mafakitale yopangidwa kuti ipereke chizindikiro cha wafer chokhazikika komanso cholamulidwa ndi kuya chomwe chimakwaniritsa miyezo yokhwima kwambiri yamakampani. Kudzera mu kuwongolera kwake kwakuya komwe kungakonzedwe, ukadaulo wa dual-beam, komanso luso lapamwamba lodziyimira pawokha, imathetsa bwino vuto lalikulu mkati mwa makampani opanga ma semiconductor losunga kutsata kwa zinthu m'maunyolo azinthu zamphamvu kwambiri; imakhala ngati chida chofunikira kwambiri pakupanga ma wafer apamwamba komanso mizere yolongedza. Wopanga wake, ThinkLaser, ali ndi zaka zoposa 80 zaukadaulo wamagulu onse m'munda uno ndipo ali ndi gawo la msika pafupifupi 80% ku United States.