ThinkLaser HM300 wafer Ekyuma Ekikuba obubonero Laser

ThinkLaser HM300 kyuma kya layisi ekikola mu bujjuvu mu ngeri ey'otoma "Hard Marking", eyakolebwa mu ngeri ey'enjawulo okutuukiriza ebisaanyizo ebikakali eby'okussaako obubonero obuziba —ekimanyiddwa nga "hard marking" —ekizaalibwa mu nkola y'okukola wafer za semiconductor. Omugaso gwayo omukulu guli mu busobozi bwayo okuwandiika koodi z’okuzuula ez’olubeerera ku wafers okuyita mu mulimu gw’okufuga obuziba oguyinza okuteekebwa mu pulogulaamu; koodi zino zinywevu ekimala okugumira okunyigirizibwa kw’okusiiga okuva mu nkola z’okukola ez’amaanyi amangi eziddirira, bwe kityo ne kikakasa nti ebintu bilondoolebwa mu bujjuvu mu bulamu bwakyo bwonna —okuva ku kukola chip n’okupakinga okutuuka ku kugezesebwa okusembayo.

**Tekinologiya Omukulu n'Ebikulu Ebikwata Ku Bulijjo**

Omusingi gwa tekinologiya mu HM300 gwetoolodde ebintu bisatu ebikulu: obuziba, obutuufu, n’okukola mu ngeri ey’obwengula. Ebikwata ku by’ekikugu byayo ebitongole bye bino wammanga:

**Ekintu** | **Ennyonnyola / Ennyonyola**

**Ekika ky'Ebyuma** | Enkola y'okussaako obubonero mu ngeri ya layisi ekola mu ngeri ey'otoma mu bujjuvu

**Okusaba Okugenderera** | Ekoleddwa mu ngeri ey’enjawulo ku semiconductor wafer hard marking, nga egoberera ebisaanyizo ebikwatagana eby’omutindo gwa SEMI

**Emirimu emikulu** | Programmable Depth Control: Obuziba bw’okussaako obubonero obutereezebwa, okutuuka ku buziba obusinga obunene obwa microns 110 (μm), n’obutuufu bw’obuziba bwa ±10%

**Tekinologiya Omukulu** | Dual-Spot OpticsTM: Ekozesa enkola ya dual-beam optical design esobozesa okukyusakyusa okufugibwa software wakati wa sayizi bbiri ez’enjawulo eza laser spot (okuva ku 50 μm okutuuka ku 110 μm) munda mu nkola y’emu

**Okulondoola Enkola** | Okulondoola Enkola okujjuvu: Kuwandiika bulungi ebikwata ku nkola ya layisi yonna

**Enkolagana ya Automation** | Awagira SECS II/GEM interfaces okusobola okwanguyiza okuddukanya automation mu makolero

**Okukwatagana kwa Wafer** | Ewagira sayizi za wafer eza mm 100 okutuuka ku mm 200 (obuwagizi obw’okwesalirawo ku bipande bya mm 300/mm 310 buliwo; obusobozi bukakasiddwa okuyita mu data eriwo)

**Emirimu, Ebirungi, n'Ebirimu**

Nga ekozesa ekibinja kya tekinologiya ow’omulembe, HM300 ekola bulungi ku nsonga enkulu eziruma munda mu kisaawe ky’okussaako obubonero bwa wafer:

**Obusobozi bwa "Hard Marking" ku nkola enkakali:** Okwawukana ku "Soft Marking," obusobozi bwa HM300 obwa "Hard Marking" bukola obubonero obw'obuziba obumala. Kino kikakasa nti obubonero busigala nga bwe buli —nga tebulina kuvunda oba kunyiga —mu nkola zonna eziddirira ez’amaanyi amangi (nga okulongoosa mu bbugumu eringi, okuyonja eddagala, n’okusena mu byuma), bwe kityo ne kikuuma okulondoola enkola mu bujjuvu. **Obutuufu bwa waggulu n'okukyukakyuka:**

**Obuziba obufugibwa:** Omulimu gw’okufuga obuziba oguyinza okuteekebwa mu pulogulaamu (oguwa obutuufu obutuuka ku ±10% n’obuziba obutuuka ku 110 μm) guwa bakasitoma amaanyi okulongoosa obulungi obuziba bw’okussaako obubonero, okukakasa nti gukwatagana bulungi n’ebyetaago by’enkola ebitongole. **Adjustable Spot Size:** Tekinologiya waayo ow’ekika kya Dual-Spot OpticsTM alina patent asobozesa okukyusakyusa okufugibwa pulogulaamu wakati wa sayizi bbiri eza layisi (50 μm ne 110 μm) awatali kwetaaga kukyusa mu byuma bikalimagezi, bwe kityo n’ekwatagana n’ebintu eby’enjawulo eby’okussaako obubonero n’ebyetaago ebitongole eby’okulabika obulungi.

**Okukola mu ngeri ey'obwengula n'okuddukanya emirimu mu ngeri ey'amagezi:**

**Okukola mu bujjuvu:** Ewa obusobozi bw’okukola ebyuma mu ngeri ey’otoma mu bujjuvu, okukendeeza ku kuyingirira kw’abantu n’okukendeeza ku nsobi eziyinza okubaawo.

**SECS / GEM Protocol Support:** Ewagira amakolero-omutindo automation protocols (SECS II / GEM), okusobozesa okugatta seamless mu Manufacturing Execution Systems (MES) ya modern semiconductor fabs okusobozesa mu kiseera ekituufu ebyuma embeera okulondoola n'okuddukanya ewala enkola parameters.

**Comprehensive Data Logging:** Enkola eno ewandiika bulungi data zonna ez’omutindo gwa laser, n’ewa omusingi omunywevu ogw’okwekenneenya enkola n’okulondoola omutindo.

**Okukwatagana kw'ebintu n'enkola ebigazi:**

Enkola eno eyakolebwa naddala eri bakasitoma abakola mu bitundu bya semikondokita ezigatta, ennyiriri z’enkola ez’omulembe, n’okupakinga okw’omulembe, enkola eno ekola bulungi ku kusoomoozebwa kw’okussaako obubonero okukwatagana n’ebintu bya semikondokita eby’omulembe oguddako nga SiC, GaN, ne GaAs.

Endowooza yaayo ey’okukola dizayini esukka wala emirimu emikulu egy’okussaako obubonero; kiteekeddwa nga "ekintu ekijjuvu eky'okussaako obubonero bwa wafer," ekisobola okuyita mu kwekenneenya n'okulongoosa okukoleddwa ku mutindo —okutuukira ddala ku bintu eby'enjawulo ebya wafer n'ebipimo —okutuukiriza ebyetaago ebitongole.

**Ebitundu by'okusaba**

HM300 kyuma kikulu nnyo mu by’okukola semikondokita n’okupakinga eby’omulembe, okusinga nga bikozesebwa mu bintu bino wammanga:

**Okukola Semiconductor (Front-end ne Back-end):** Ewa ID ez’enkalakkalira ez’obulungi obw’amaanyi ku substrate wafers-omuli silicon, SiC, ne GaN-bwe kityo ne kiwagira okuddukanya layini mu ngeri ey’obwengula n’okulondoola omutindo mu bifo ebikola (Fabs) n’ebifo eby’okukuŋŋaanya/okugezesa.

**Okupakinga okw’omulembe:** Kuwa obubonero obwesigika ku wafers oba panels ezizzeemu okuzimbibwa mu nkola za Wafer-Level Packaging (WLP) ne Panel-Level Packaging (PLP).

**Enkolagana n'ebintu ebirala ebya ThinkLaser**

ThinkLaser egaba ensengeka enzijuvu ey’ebikozesebwa mu kussaako obubonero bwa wafer, nga munda mu bino HM300 ekola kinene:

**Synergy with Soft Marking Equipment:** Ku layini y’emu ey’okufulumya, HM300 esobola okukola nga ekwatagana ne ThinkLaser’s SC300 (enkola y’okussaako obubonero obugonvu ku wafers za mm 300) oba SigmaClean (enkola ey’okussaako obubonero obugonvu ku wafers za mm 100–200). Abakola ebintu basobola okulonda mu ngeri ekyukakyuka tekinologiya ow’okussaako obubonero asinga okusaanira okusinziira ku nkola entongole oba ebyetaago bya bakasitoma.

**Okubumbako**

Mu bufunze, ThinkLaser HM300 nkola ya njawulo, ey’omutindo gw’amakolero mu musingi eyakolebwa okusobola okuwa obubonero bwa wafer obufugibwa obuziba, obw’olubeerera obutuukana n’omutindo gw’amakolero ogusinga obukakali. Okuyita mu kufuga obuziba kwayo okuteekebwa mu pulogulaamu, tekinologiya wa dual-beam, n’obusobozi obw’omulembe obw’okukola otomatiki, egonjoola bulungi okusoomoozebwa okukulu munda mu makolero ga semiconductor okw’okukuuma okulondoola ebintu mu njegere zonna ez’enkola ez’amaanyi amangi; kiyimiridde ng’ekintu ekikulu eky’ebyuma mu layini z’okukola wafer ez’omulembe n’okuzipakinga. Omukugu waayo, ThinkLaser, yeewaanira ku myaka egisukka mu 80 egy’obumanyirivu mu ttiimu ey’omuggundu mu mulimu guno era ng’alina akatale nga 80% mu Amerika.