I-Nitto Semiconductor Wafer mounter DR8500III

I-Nitto DR8500III sisixhobo sokufaka iteyiphu yokukhusela ezenzekelayo ngokupheleleyo kuthotho lwe-Nitto NEL SYSTEM™, eyenzelwe ngokukodwa ii-wafers ezingama-200mm (8-intshi). Ngamafutshane, umsebenzi wayo ophambili kukufaka umaleko weteyiphu yokukhusela ngokupheleleyo kwicala elingaphambili le-wafer (icala elineepateni zesekethe) ngaphambi kwenkqubo yokunciphisa umva (ekwaziwa ngokuba kukugaya umva), ukuthintela umonakalo ngexesha lokugaywa ngesantya esiphezulu okulandelayo.

Uthelekiso lweParamitha ye-DR8500III vs. DR3000III

Ukuze sikuncede uqonde ngokukhawuleza indawo ye-DR8500III, siyithelekise ecaleni ne-DR3000III, ekwaxhasa ii-wafers ezingama-300mm, nto leyo eyenza umahluko ubonakale kwangoko.

Izinto zokuthelekisa: DR8500III (Intshayelelo ephambili) DR3000III

Indawo ephambili: Isifaki seteyiphu esikhuselayo esizenzekelayo ngokupheleleyo kwiiwafers ezingama-200mm; Isifaki seteyiphu esikhuselayo esizenzekelayo ngokupheleleyo kwiiwafers ezingama-300mm

Ubungakanani beWafer obusebenzayo: 8/6/5/4 intshi (200/150/125/100mm); 300/200mm (12 intshi/8 intshi)

Imveliso: Eqhelekileyo: iiwafers ezingama-77/iyure

Inguqulelo yeRF: Iiwafer ezingama-68/iyure; Iiwafer ezingama-68/iyure

Ubukhulu beWafer Ehambelanayo: IiWafers ezingagayi ngasemva; 400µm okanye zityebile

Iimpawu eziphambili kunye neempawu zobugcisa:

Iimpawu zobugcisa ze-DR8500III ziqwalasela ngokupheleleyo ukuhambelana, ukusebenza kwenkqubo, kunye nokulula kokusebenza.

Ukuhambelana Okubanzi Kwe-Wafer: Inkxaso eqhelekileyo yee-wafers eziyi-8/6/5-intshi, kunye nenkxaso ekhethiweyo yee-wafers eziyi-4-intshi. Ngaphezu koko, ii-chucks/rollers ezishushu zingongezwa njengendlela yokufikelela kwiimfuno ezahlukeneyo zenkqubo.

Iteknoloji yokusebenzisa ifilimu exinezelekileyo: Uhlobo lwayo lwe-RF lusebenzisa iteknoloji yokusebenzisa ifilimu exinezelekileyo, nto leyo enciphisa kakhulu uxinzelelo kwi-wafer ngexesha lenkqubo yokufaka ifilimu kwaye inciphisa umngcipheko wokuqhekeka okanye ukwaphuka kwe-wafer.

Ukwenziwa kwezinto ngokuzenzekelayo okusemgangathweni ophezulu okusemgangathweni wezemveliso: Ezi zixhobo zivumela abaqhubi ukuba bafikelele ngokukhawuleza kwiiparamitha zemveliso ezicwangcisiweyo ngephaneli yokuchukumisa kunye nokusebenza kweresiphi, okubonelela ngokusebenza okubonakalayo. Ikwahambelana nemigangatho yokhuseleko ye-CE kwaye inikezela ngeeprotokholi zonxibelelwano ze-SECS/GEM ezinganyanzelekanga, okuvumela ukuhlanganiswa okungenamthungo kwiinkqubo zanamhlanje zokuzenzekelayo zefektri ye-semiconductor.

Iindawo zokusetyenziswa: Imarike ephambili ye-DR8500III ikwimveliso yee-semiconductor zee-wafers ezingama-200mm (8-intshi), ezibaluleke kakhulu kwiinkqubo ezilandelayo ezibalulekileyo:

Ukugaya emva: Le yindlela eyintloko yokusebenza kwayo. Ngaphambi kokuba inkqubo yokugaya emva, ikhusela kwicala langaphambili le-wafer, ithintela amavili okugaya ajikelezayo ngesantya esiphezulu ukuba angakrweli umjikelezo; ikwakhusela ngeekhemikhali, ithintela ungcoliseko lomphezulu we-wafer ngokupolisha ulwelo kunye nenkunkuma.

Ukusikwa kwewafer/Ukusarha: Ngaphambi kokuba usikwe iwafer ibe ziitships ezahlukeneyo, kufakwa iteyipu yokusikwa ukuze kulungiswe iwafer, ukuqinisekisa uzinzo kunye nokuchaneka ngexesha lenkqubo yokusikwa.

Umsebenzi Odibeneyo kunye neNkqubo Yendalo

Kumgca wemveliso epheleleyo yokupakisha ii-semiconductor, i-DR8500III ayisebenzi yodwa, kodwa isebenzisana nezinye izixhobo ukwenza inkqubo yokuvelisa evaliweyo "yokusetyenziswa kwefilimu - inkqubo - ukususwa kwefilimu".

Intsebenziswano nooMatshini bokususa iiFilimu: Emva kweenkqubo ezinje ngokuncitshiswa kwecala elingasemva kunye nokutsalwa nge-laser, iteyiphu yokukhusela kufuneka isuswe, nto leyo edinga umatshini wokususa iifilim. Umzekelo, umatshini wokususa iitape ozisebenzela ngokwawo we-Nitto i-HR8500III lukhetho oluqhelekileyo lokudityaniswa ne-DR8500III.

Intsebenziswano neZixhobo zokuGrila/zokuDaya: Inkqubo yokufaka ifilimu ye-DR8500III likhonkco elibalulekileyo ekuboneleleni "ngonyango lwangaphambi kwezinto" kwizixhobo eziphambili zenkqubo ezifana neegrinders kunye neesarha zokudaya.

Isishwankathelo

Ngamafutshane, iNitto DR8500III ngumatshini wokufaka ifilimu ye-wafer eyi-200mm evuthiweyo, ezinzileyo, nesebenza ngokuzenzekelayo ngokupheleleyo. Ixabiso layo eliphambili lisekuboneleleni ngokhuseleko oluthembekileyo lwe-wafer ngaphambi kweenkqubo ezibalulekileyo ezifana nokuncitshiswa kwecala elingasemva ngokusebenzisa ubuchwepheshe befilimu echanekileyo, engaphantsi koxinzelelo, nto leyo ebalulekileyo ekuqinisekiseni isivuno kunye nokusebenza kwe-chip yokugqibela.